MIMX8MQ5CVAHZAB

IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8MQ 4 Core, 64-Bit 1.3GHz 621-FCPBGA (17x17)

Quantity 1,271 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MQ
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllerseDP, HDMI, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Speed1.3GHzSupplier Device Package621-FCPBGA (17×17)USBUSB 3.0 (2)

Overview of MIMX8MQ5CVAHZAB – IC MPU I.MX8MQ 1.3GHZ 621FCPBGA

The MIMX8MQ5CVAHZAB is an NXP Semiconductors i.MX 8MQ series microprocessor IC featuring a quad ARM® Cortex®‑A53 64‑bit application cluster running up to 1.3 GHz and an on‑chip ARM® Cortex®‑M4 co‑processor for low‑power control tasks. It is supplied in a 621‑FCPBGA (17×17 mm) surface‑mount package and is qualified for industrial applications.

Designed for connected multimedia and embedded systems, this device integrates high‑performance compute, extensive display/camera interfaces, high‑speed I/O and hardware security features to address streaming audio/video, imaging/scanning, HMI and other performance‑sensitive use cases across industrial environments.

Key Features

  • Core processing — Quad ARM® Cortex®‑A53, 64‑bit architecture, up to 1.3 GHz for multi‑threaded application performance.
  • Co‑processor — ARM® Cortex®‑M4 for real‑time and low‑power background processing.
  • Memory controllers — Supports DDR3L, DDR4 and LPDDR4 memory types to match system performance and cost targets.
  • Display and multimedia I/O — eDP, HDMI, MIPI‑CSI and MIPI‑DSI interfaces plus graphics acceleration for display and camera subsystem integration.
  • High‑speed connectivity — Dual USB 3.0 ports and Gigabit Ethernet (GbE) for high‑bandwidth peripheral and network connections.
  • Security — Hardware security features including ARM TrustZone (TZ), CAAM, HAB, RDC, RTC, SJC and SNVS for device integrity and secure boot elements.
  • Package and mounting — 621‑FCPBGA (17×17 mm) FCBGA package, surface mount for compact board integration.
  • Industrial qualification & temperature range — Industrial grade device rated for operation from −40 °C to 105 °C.
  • Additional interfaces — External Bus Interface (EBI)/EMI for legacy or parallel peripheral connections.
  • RoHS compliant — Conforms to RoHS requirements for lead‑free manufacturing.

Typical Applications

  • Connected streaming audio/video devices — Integrates display and high‑speed I/O to support media playback and streaming endpoints.
  • Scanning and imaging systems — MIPI‑CSI and camera interfaces plus on‑chip processing for imaging pipelines and sensor integration.
  • Industrial HMI and control panels — Graphics acceleration, HDMI/eDP outputs and industrial temperature rating for robust human‑machine interfaces.
  • Embedded gateways and appliances — GbE and USB 3.0 connectivity combined with secure boot and hardware security modules for connected embedded systems.

Unique Advantages

  • High computational density: Quad Cortex‑A53 cores at up to 1.3 GHz deliver multi‑threaded application capability in a compact package.
  • Dedicated low‑power processing: Cortex‑M4 enables deterministic control and background tasks without burdening the application cores.
  • Flexible memory options: Support for DDR3L, DDR4 and LPDDR4 allows designers to optimize performance, power and cost.
  • Comprehensive multimedia and I/O set: Multiple display, camera and high‑speed interfaces reduce external components and simplify board design.
  • Industrial readiness: Industrial qualification and an operating range of −40 °C to 105 °C make the device suitable for extended‑environment deployments.
  • Hardware security suite: Built‑in TrustZone, CAAM, HAB and related modules provide on‑chip mechanisms for secure boot and trusted operation.

Why Choose MIMX8MQ5CVAHZAB?

The MIMX8MQ5CVAHZAB combines quad‑core 64‑bit application processing, a real‑time Cortex‑M4 coprocessor, broad memory support and a rich set of multimedia and high‑speed interfaces in a compact industrial package. This combination delivers the performance and integration needed for embedded systems that require multimedia handling, secure boot and robust connectivity.

Manufactured by NXP Semiconductors and qualified for industrial use, the device is well suited for engineers building streaming/media endpoints, imaging and scanning equipment, industrial HMIs and connected appliances that demand long‑term availability and reliable operation across extended temperature ranges.

Request a quote or submit a pricing inquiry to receive availability, lead‑time and purchase information for the MIMX8MQ5CVAHZAB.

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