MIMX8MQ6CVAHZAB

IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8MQ 4 Core, 64-Bit 1.3GHz 621-FCPBGA (17x17)

Quantity 1,229 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MQ
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllerseDP, HDMI, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Speed1.3GHzSupplier Device Package621-FCPBGA (17×17)USBUSB 3.0 (2)

Overview of MIMX8MQ6CVAHZAB – IC MPU I.MX8MQ 1.3GHZ 621FCPBGA

The MIMX8MQ6CVAHZAB is an NXP i.MX 8MQ series microprocessor IC featuring a quad ARM® Cortex®-A53 application core cluster running up to 1.3 GHz, with an integrated ARM® Cortex®-M4 co-processor for low-power tasks. It targets embedded and industrial designs that require a balanced combination of multi-core application processing, real-time control, multimedia I/O and secure system operation.

Built for connected streaming audio/video devices, scanning/imaging equipment and other high-performance, low-power embedded products, this device integrates display and camera interfaces, Ethernet and USB 3.0 connectivity, DDR memory support and industrial temperature qualification for robust deployments.

Key Features

  • Core CPU — Quad ARM® Cortex®-A53 application cores, 64-bit, up to 1.3 GHz for multi-threaded application workloads.
  • Co-processor — ARM® Cortex®-M4 available for general-purpose, low-power control and real-time tasks.
  • Memory Support — Integrated DRAM controller supporting DDR3L, DDR4 and LPDDR4 memory types.
  • Multimedia & Graphics — Graphics acceleration is available; series documentation indicates hardware acceleration for video playback up to 4K (series-specific).
  • Display & Camera Interfaces — Multiple display and image interfaces including eDP, HDMI, MIPI-DSI and MIPI-CSI.
  • High-Speed I/O — Dual USB 3.0 ports and Gigabit Ethernet (GbE) for high-throughput connectivity.
  • Security & System Integrity — On-chip security features include ARM TrustZone (ARM TZ), CAAM, HAB, RDC, RTC, SJC and SNVS for secure boot, cryptography and system partitioning.
  • System Interfaces — Additional EBI/EMI interface support for external peripherals and memory expansion.
  • Package & Mounting — 621-FCPBGA surface-mount package (17 × 17 mm, FCBGA/BGA style).
  • Industrial Qualification & Temperature — Qualified for industrial applications with operating temperature range of -40 °C to 105 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Streaming Media & Smart Displays — Drives high-resolution display output and multimedia playback using integrated graphics acceleration and HDMI/eDP interfaces.
  • Imaging & Scanning Devices — Integrates MIPI-CSI camera interfaces and processing cores suited for camera sensor capture and image pipeline tasks.
  • Industrial HMI & Control — Combines application processing and Cortex-M4 real-time control for human‑machine interfaces and local device control in industrial environments.
  • Connected Edge Devices — Provides GbE and USB 3.0 connectivity plus secure subsystem features for gateway and edge compute nodes requiring secure communications and local processing.

Unique Advantages

  • Integrated Multi-domain Processing: Quad Cortex‑A53 application cores paired with a Cortex‑M4 offer a single-chip solution for both high-level applications and deterministic control tasks.
  • Flexible Memory Options: DDR3L, DDR4 and LPDDR4 controller support enables designers to choose memory architectures that match performance and power targets.
  • Rich Multimedia I/O: Native support for HDMI, eDP, MIPI‑DSI and MIPI‑CSI simplifies high-resolution display and camera integration.
  • High-Speed Connectivity: Dual USB 3.0 ports and Gigabit Ethernet deliver the throughput needed for streaming, storage and networked applications.
  • Industrial Robustness: Industrial qualification and -40 °C to 105 °C operating range accommodate deployments in harsh environments.
  • On-chip Security: Multiple security modules (ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS) support secure boot, cryptographic operations and partitioning for trusted systems.

Why Choose MIMX8MQ6CVAHZAB?

The MIMX8MQ6CVAHZAB positions itself as a versatile processor for embedded and industrial applications that require a combination of multi-core application performance, real-time control, multimedia I/O and on-chip security. Its support for multiple DRAM types, high-speed I/O, and industrial temperature qualification makes it well suited for designs that must balance compute, connectivity and environmental robustness.

Designed within the NXP i.MX 8M series and backed by series documentation and technical resources, this device is appropriate for engineers developing streaming media devices, imaging systems, industrial HMIs and connected edge products where integration, deterministic control and platform security are priorities.

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