MIMX8QM5AVUFFAB
| Part Description |
MPU I.MX8 QUAD MAX |
|---|---|
| Quantity | 366 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QM |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 | ECCN | 5A992C | Graphics Acceleration | Yes | ||
|---|---|---|---|---|---|---|---|
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Operating Temperature | -40 °C – 125 °C | Qualification | Automotive | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.6 GHz | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of MIMX8QM5AVUFFAB – MPU I.MX8 QUAD MAX
The MIMX8QM5AVUFFAB is a high-performance multicore application processor from the i.MX 8QM series. It combines a heterogeneous CPU cluster, dedicated real-time cores, and multimedia subsystems to support advanced infotainment and multimedia embedded designs.
Architecturally the device integrates two Arm Cortex‑A72, four Arm Cortex‑A53 and two Arm Cortex‑M4F cores, paired with dual 32‑bit GPU subsystems and a 4K H.265 capable VPU. The part targets applications requiring integrated display, audio and multimedia processing with flexible memory and peripheral interfaces.
Key Features
- Heterogeneous Multi‑Core Architecture — Two Arm Cortex‑A72, four Arm Cortex‑A53 and two Arm Cortex‑M4F cores for scalable application and real‑time workloads.
- High Frequency Performance — CPU performance up to 1.6 GHz to support compute‑intensive tasks.
- Graphics & Video — Dual 32‑bit GPU subsystems and a 4K H.265 capable VPU for high‑resolution video decode and rich graphical user interfaces.
- Memory & Storage Interfaces — Supports LPDDR4 memory and a range of storage interfaces including Quad/Octal SPI (FlexSPI), eMMC5.1, RAW NAND and SD 3.0 for flexible system memory and boot options.
- Peripheral Connectivity — Wide peripheral I/O options including PCIe and multiple display output options (MIPI‑DSI, HDMI, eDP/DP, LVDS) for system expansion and varied display topologies.
- Audio Processing — Integrated high‑performance Tensilica HiFi 4 DSP alongside Arm cores for multicore audio processing and voice recognition workflows.
- Package & Mounting — FCPBGA surface‑mount package, 29 × 29 mm body with 0.75 mm pitch offering a compact system footprint.
- Operating Range — Specified operating temperature range from −40 °C to 125 °C for deployment across a wide thermal envelope.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Infotainment Systems — Runs rich multimedia user interfaces and multi‑display infotainment stacks using dual GPUs and the 4K VPU.
- High‑Resolution Display Platforms — Drives single 4K displays or multiple smaller displays via MIPI‑DSI, HDMI, eDP/DP and LVDS outputs.
- Advanced Audio and Voice — Supports multicore audio processing and voice recognition with the Tensilica HiFi 4 DSP and CPU offload.
- Embedded Multimedia Controllers — Combines general‑purpose application cores and real‑time M4F cores for mixed real‑time and application processing.
Unique Advantages
- Heterogeneous compute in a single device: Consolidates application, efficiency and real‑time cores to reduce system BOM and simplify software partitioning.
- Integrated multimedia subsystems: Dual GPUs and a 4K H.265 VPU enable high‑resolution video and advanced graphical user experiences without separate accelerators.
- Flexible memory and boot options: LPDDR4 support plus multiple storage interfaces (eMMC5.1, FlexSPI, RAW NAND, SD 3.0) ease integration across design choices.
- Comprehensive I/O expandability: PCIe and a broad set of peripheral interfaces allow scalable connectivity and subsystem integration.
- Wide thermal operating range: −40 °C to 125 °C operation supports deployment in varied environmental conditions.
- Compact surface‑mount package: 29 × 29 mm FCPBGA reduces PCB area while providing a high pin‑count platform.
Why Choose MIMX8QM5AVUFFAB?
The MIMX8QM5AVUFFAB positions itself as a highly integrated solution for advanced infotainment and multimedia embedded systems needing a combination of application performance, real‑time control and dedicated multimedia acceleration. Its heterogeneous CPU cluster, dual GPU subsystems, 4K H.265 VPU and flexible memory and storage interfaces enable consolidated platform designs that reduce external components and simplify system architecture.
This part is suitable for designers seeking a single‑chip platform for complex display, audio and multimedia processing workloads, offering scalability across software domains and a compact surface‑mount package for space‑constrained designs.
Request a quote or submit an inquiry to receive pricing and availability for MIMX8QM5AVUFFAB and to discuss how this processor fits your next multimedia or infotainment design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016