MIMX8QM6AVUFFAB
| Part Description |
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Microprocessor IC - 2, 2, 4 266MHz, 1.2GHz, 1.6GHz 1313-BGA (29x29) |
|---|---|
| Quantity | 1,693 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QM |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4F | Core Processor | ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 | Device Package | 1313-BGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2, 2, 4 | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 1313-BFBGA | ||
| RAM Controllers | LPDDR4, DRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 266MHz, 1.2GHz, 1.6GHz | Supplier Device Package | 1313-BGA (29×29) | USB | USB (3) |
Overview of MIMX8QM6AVUFFAB – IC MPU 266MHz / 1.2GHz / 1.6GHz, 1313-BGA
The MIMX8QM6AVUFFAB is a multicore microprocessor IC built around ARM processor cores and designed for embedded system applications. Its architecture combines high‑performance application cores with real‑time microcontroller cores and scalable application‑class cores to address multimedia and control-oriented workloads.
Targeted at embedded and infotainment-class designs, the device delivers integrated multimedia and I/O support, flexible memory interfaces, and a compact 29 × 29 mm 1313‑BFBGA package for space‑constrained boards.
Key Features
- Multicore Architecture A combination of ARM cores — 2 × Cortex‑A72, 4 × Cortex‑A53 and 2 × Cortex‑M4F — providing a mix of application performance and real‑time processing.
- Multiple Clock Domains Includes clock domains at 266 MHz, 1.2 GHz and 1.6 GHz to support differentiated performance and power profiles.
- Memory and Storage Interfaces Supports LPDDR4 and DRAM controllers plus Quad/Octal SPI (FlexSPI) and eMMC/raw NAND/SD interfaces for flexible memory and boot options.
- Multimedia and Graphics Includes graphics acceleration and a 4K H.265 capable VPU along with dual GPU subsystems and dual display controllers for high‑resolution display support.
- High‑Speed I/O Integrated high‑speed I/O including USB 3.0, PCIe and multiple display output options (MIPI‑DSI, HDMI, eDP/DP, LVDS) for broad peripheral connectivity.
- On‑chip DSP and Audio Includes a high‑performance audio DSP for advanced audio processing, pre‑ and post‑processing, and voice recognition support.
- Package and Thermal Range 1313‑BFBGA (29 × 29 mm) supplier package, surface‑mount mounting; specified operating temperature range −40 °C to 125 °C.
- Standards and Compliance RoHS compliant material status for environmental compliance.
Typical Applications
- Infotainment and Multimedia Platforms High‑resolution video decode (4K H.265) and graphics acceleration enable rich multimedia user experiences and display systems.
- Human‑Machine Interfaces (HMI) Multi‑core processing and display controller support for responsive graphical interfaces and concurrent control tasks.
- Industrial Embedded Systems Real‑time control with Cortex‑M4F plus application processing for edge computing and machine control in demanding temperature environments.
- Advanced Audio Processing Integrated DSP resources for voice recognition, audio pre/post processing and complex audio pipelines.
Unique Advantages
- Highly integrated multicore design: Combines application and real‑time cores in a single device to consolidate BOM and simplify system partitioning.
- Comprehensive multimedia stack: Graphics acceleration, dual GPU subsystems and a 4K‑capable VPU provide a ready platform for high‑quality video and display applications.
- Flexible memory and boot options: LPDDR4, FlexSPI, eMMC, raw NAND and SD interfaces accommodate a wide range of memory and storage architectures.
- Broad peripheral connectivity: High‑speed USB 3.0, PCIe and multiple display interfaces reduce the need for external bridge components.
- Industrial temperature capability: Specified operation from −40 °C to 125 °C supports deployment in thermally challenging environments.
- Compact, board‑level friendly package: 29 × 29 mm 1313‑BFBGA offers a high pin‑count solution in a compact footprint for space‑sensitive designs.
Why Choose MIMX8QM6AVUFFAB?
MIMX8QM6AVUFFAB positions itself as a scalable, integrated microprocessor solution that balances high‑performance application processing with real‑time control and dedicated multimedia capabilities. Its multicore topology, extensive memory and I/O connectivity, and on‑chip multimedia and DSP resources make it suitable for embedded designs that require concurrent compute, display and audio workloads.
This device is well suited for designers seeking a single‑chip platform to reduce system complexity, support high‑resolution media, and accommodate demanding thermal ranges while maintaining a compact PCB footprint.
Request a quote or submit an inquiry for MIMX8QM6AVUFFAB to receive pricing, lead‑time and availability information tailored to your project needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016