MIMX8QM6AVUFFAB

IC MPU 266MHZ/1.2/1.6GHZ 1313BGA
Part Description

ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Microprocessor IC - 2, 2, 4 266MHz, 1.2GHz, 1.6GHz 1313-BGA (29x29)

Quantity 1,693 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QM
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4FCore ProcessorARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53Device Package1313-BGA (29x29)
ECCN5A992CGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2, 2, 4Operating Temperature-40°C ~ 125°C (TJ)Package / Case1313-BFBGA
RAM ControllersLPDDR4, DRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed266MHz, 1.2GHz, 1.6GHzSupplier Device Package1313-BGA (29×29)USBUSB (3)

Overview of MIMX8QM6AVUFFAB – IC MPU 266MHz / 1.2GHz / 1.6GHz, 1313-BGA

The MIMX8QM6AVUFFAB is a multicore microprocessor IC built around ARM processor cores and designed for embedded system applications. Its architecture combines high‑performance application cores with real‑time microcontroller cores and scalable application‑class cores to address multimedia and control-oriented workloads.

Targeted at embedded and infotainment-class designs, the device delivers integrated multimedia and I/O support, flexible memory interfaces, and a compact 29 × 29 mm 1313‑BFBGA package for space‑constrained boards.

Key Features

  • Multicore Architecture  A combination of ARM cores — 2 × Cortex‑A72, 4 × Cortex‑A53 and 2 × Cortex‑M4F — providing a mix of application performance and real‑time processing.
  • Multiple Clock Domains  Includes clock domains at 266 MHz, 1.2 GHz and 1.6 GHz to support differentiated performance and power profiles.
  • Memory and Storage Interfaces  Supports LPDDR4 and DRAM controllers plus Quad/Octal SPI (FlexSPI) and eMMC/raw NAND/SD interfaces for flexible memory and boot options.
  • Multimedia and Graphics  Includes graphics acceleration and a 4K H.265 capable VPU along with dual GPU subsystems and dual display controllers for high‑resolution display support.
  • High‑Speed I/O  Integrated high‑speed I/O including USB 3.0, PCIe and multiple display output options (MIPI‑DSI, HDMI, eDP/DP, LVDS) for broad peripheral connectivity.
  • On‑chip DSP and Audio  Includes a high‑performance audio DSP for advanced audio processing, pre‑ and post‑processing, and voice recognition support.
  • Package and Thermal Range  1313‑BFBGA (29 × 29 mm) supplier package, surface‑mount mounting; specified operating temperature range −40 °C to 125 °C.
  • Standards and Compliance  RoHS compliant material status for environmental compliance.

Typical Applications

  • Infotainment and Multimedia Platforms  High‑resolution video decode (4K H.265) and graphics acceleration enable rich multimedia user experiences and display systems.
  • Human‑Machine Interfaces (HMI)  Multi‑core processing and display controller support for responsive graphical interfaces and concurrent control tasks.
  • Industrial Embedded Systems  Real‑time control with Cortex‑M4F plus application processing for edge computing and machine control in demanding temperature environments.
  • Advanced Audio Processing  Integrated DSP resources for voice recognition, audio pre/post processing and complex audio pipelines.

Unique Advantages

  • Highly integrated multicore design: Combines application and real‑time cores in a single device to consolidate BOM and simplify system partitioning.
  • Comprehensive multimedia stack: Graphics acceleration, dual GPU subsystems and a 4K‑capable VPU provide a ready platform for high‑quality video and display applications.
  • Flexible memory and boot options: LPDDR4, FlexSPI, eMMC, raw NAND and SD interfaces accommodate a wide range of memory and storage architectures.
  • Broad peripheral connectivity: High‑speed USB 3.0, PCIe and multiple display interfaces reduce the need for external bridge components.
  • Industrial temperature capability: Specified operation from −40 °C to 125 °C supports deployment in thermally challenging environments.
  • Compact, board‑level friendly package: 29 × 29 mm 1313‑BFBGA offers a high pin‑count solution in a compact footprint for space‑sensitive designs.

Why Choose MIMX8QM6AVUFFAB?

MIMX8QM6AVUFFAB positions itself as a scalable, integrated microprocessor solution that balances high‑performance application processing with real‑time control and dedicated multimedia capabilities. Its multicore topology, extensive memory and I/O connectivity, and on‑chip multimedia and DSP resources make it suitable for embedded designs that require concurrent compute, display and audio workloads.

This device is well suited for designers seeking a single‑chip platform to reduce system complexity, support high‑resolution media, and accommodate demanding thermal ranges while maintaining a compact PCB footprint.

Request a quote or submit an inquiry for MIMX8QM6AVUFFAB to receive pricing, lead‑time and availability information tailored to your project needs.

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