MIMX8QM5AVUFEAB
| Part Description |
Microprocessor IC |
|---|---|
| Quantity | 1,034 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QM |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 | Display & Interface Controllers | MIPI-DSI | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 1G, AVB | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40 °C – 125 °C | ||
| Qualification | Automotive | REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | ||
| Speed | 1.3 GHz | Voltage – I/O | 1.8 V – 3.3 V |
Overview of MIMX8QM5AVUFEAB – Microprocessor IC
The MIMX8QM5AVUFEAB is a high-performance microprocessor from the i.MX 8QM series built around a heterogeneous multicore architecture. It combines high‑performance application cores with real‑time and multimedia processing elements to support advanced display and audio use cases.
Designed for embedded and infotainment-class systems, the device integrates multiple CPU clusters, hardware-accelerated multimedia and graphics subsystems, a broad set of memory interfaces and peripheral I/O, and extensive on‑chip security features—delivering a compact platform for complex multimedia and interface-rich designs.
Key Features
- Multicore CPU configuration — Combines ARM® Cortex®-A72, Cortex®-A53 and Cortex®-M4F cores for mixed high-performance and real-time processing.
- Performance — 1.3 GHz core speed for demanding application workloads.
- Graphics and Video — Dual 32‑bit GPU subsystems and a 4K H.265 capable VPU enable hardware-accelerated graphics and high-resolution video playback.
- Display support — Dual failover-ready display controllers and support for multiple output options including MIPI‑DSI, HDMI, eDP/DP and LVDS for flexible display topologies.
- Audio and DSP — Integrated Tensilica® HiFi 4 DSP for advanced multicore audio processing and voice recognition workflows.
- Memory and storage interfaces — Support for LPDDR4, Quad/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD 3.0 for a wide range of memory configurations.
- High-speed peripherals — Includes interfaces such as PCIe and 1G Ethernet with AVB for networked and high-bandwidth peripheral connectivity.
- Security features — On‑chip security modules including CAAM, HAB, SHE, SJC, SNVS, Secure RAM, TRNG and TrustZone (TZ) for system hardening and secure boot/encryption support.
- Package and mounting — FCPBGA package (29 × 29 mm, 0.75 mm pitch) suitable for surface-mount assembly.
- Operating range — Rated for operation from −40°C to 125°C for extended temperature deployments.
- Regulatory — RoHS compliant.
Typical Applications
- Infotainment and multimedia systems — Hardware-accelerated video and graphics combined with multicore CPUs and DSPs support high-resolution displays and advanced audio processing.
- Human-machine interfaces (HMI) — Multiple display controllers and rich graphics capability enable responsive, high‑resolution user interfaces.
- Media gateways and networked devices — 1G Ethernet with AVB and PCIe connectivity enable robust networked multimedia and peripheral integration.
- Voice and audio processing — Tensilica HiFi 4 DSP and multicore resources are suitable for voice recognition and advanced audio pipelines.
Unique Advantages
- Highly integrated multicore architecture: Multiple ARM cores plus an M4F real‑time pair computing model allows partitioning of application, driver and real‑time tasks on a single device.
- End‑to‑end multimedia capability: On‑chip GPUs, a 4K H.265 VPU and dual display controllers simplify high‑resolution video and multi‑display system design.
- Flexible memory and I/O: Support for LPDDR4, eMMC, FlexSPI and SD interfaces plus PCIe and multiple display outputs reduces external component count and design complexity.
- Comprehensive on‑chip security: Multiple security engines and secure memory regions provide hardware building blocks for secure boot, encryption and key management.
- Extended temperature operation: −40°C to 125°C rating supports deployment in environments that require wide thermal margins.
- Compact package: FCPBGA 29 × 29 mm footprint enables high-density board designs while maintaining robust signal and power distribution.
Why Choose MIMX8QM5AVUFEAB?
The MIMX8QM5AVUFEAB positions itself as a versatile embedded processor option where multicore performance, advanced multimedia capabilities and on‑chip security are required. Its combination of Cortex® application and real‑time cores, dedicated DSP for audio, hardware video/graphics acceleration, and broad peripheral/memory support make it well suited to designs that demand integration of display, audio and networked interfaces.
For engineers building complex infotainment, HMI or multimedia gateway systems, this device offers a compact, feature‑rich building block that supports high-resolution displays, multi‑stream audio processing and secure system operation while simplifying board-level integration.
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Headquarters: Eindhoven, North Brabant, Netherlands
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