MIMX8QM5AVUFEAB

IC
Part Description

Microprocessor IC

Quantity 1,034 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QM
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53Display & Interface ControllersMIPI-DSIECCNN/A
Ethernet1G, AVBGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40 °C – 125 °C
QualificationAutomotiveREACH ComplianceREACH UnknownRoHS ComplianceUnknown
Speed1.3 GHzVoltage – I/O1.8 V – 3.3 V

Overview of MIMX8QM5AVUFEAB – Microprocessor IC

The MIMX8QM5AVUFEAB is a high-performance microprocessor from the i.MX 8QM series built around a heterogeneous multicore architecture. It combines high‑performance application cores with real‑time and multimedia processing elements to support advanced display and audio use cases.

Designed for embedded and infotainment-class systems, the device integrates multiple CPU clusters, hardware-accelerated multimedia and graphics subsystems, a broad set of memory interfaces and peripheral I/O, and extensive on‑chip security features—delivering a compact platform for complex multimedia and interface-rich designs.

Key Features

  • Multicore CPU configuration — Combines ARM® Cortex®-A72, Cortex®-A53 and Cortex®-M4F cores for mixed high-performance and real-time processing.
  • Performance — 1.3 GHz core speed for demanding application workloads.
  • Graphics and Video — Dual 32‑bit GPU subsystems and a 4K H.265 capable VPU enable hardware-accelerated graphics and high-resolution video playback.
  • Display support — Dual failover-ready display controllers and support for multiple output options including MIPI‑DSI, HDMI, eDP/DP and LVDS for flexible display topologies.
  • Audio and DSP — Integrated Tensilica® HiFi 4 DSP for advanced multicore audio processing and voice recognition workflows.
  • Memory and storage interfaces — Support for LPDDR4, Quad/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD 3.0 for a wide range of memory configurations.
  • High-speed peripherals — Includes interfaces such as PCIe and 1G Ethernet with AVB for networked and high-bandwidth peripheral connectivity.
  • Security features — On‑chip security modules including CAAM, HAB, SHE, SJC, SNVS, Secure RAM, TRNG and TrustZone (TZ) for system hardening and secure boot/encryption support.
  • Package and mounting — FCPBGA package (29 × 29 mm, 0.75 mm pitch) suitable for surface-mount assembly.
  • Operating range — Rated for operation from −40°C to 125°C for extended temperature deployments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Infotainment and multimedia systems — Hardware-accelerated video and graphics combined with multicore CPUs and DSPs support high-resolution displays and advanced audio processing.
  • Human-machine interfaces (HMI) — Multiple display controllers and rich graphics capability enable responsive, high‑resolution user interfaces.
  • Media gateways and networked devices — 1G Ethernet with AVB and PCIe connectivity enable robust networked multimedia and peripheral integration.
  • Voice and audio processing — Tensilica HiFi 4 DSP and multicore resources are suitable for voice recognition and advanced audio pipelines.

Unique Advantages

  • Highly integrated multicore architecture: Multiple ARM cores plus an M4F real‑time pair computing model allows partitioning of application, driver and real‑time tasks on a single device.
  • End‑to‑end multimedia capability: On‑chip GPUs, a 4K H.265 VPU and dual display controllers simplify high‑resolution video and multi‑display system design.
  • Flexible memory and I/O: Support for LPDDR4, eMMC, FlexSPI and SD interfaces plus PCIe and multiple display outputs reduces external component count and design complexity.
  • Comprehensive on‑chip security: Multiple security engines and secure memory regions provide hardware building blocks for secure boot, encryption and key management.
  • Extended temperature operation: −40°C to 125°C rating supports deployment in environments that require wide thermal margins.
  • Compact package: FCPBGA 29 × 29 mm footprint enables high-density board designs while maintaining robust signal and power distribution.

Why Choose MIMX8QM5AVUFEAB?

The MIMX8QM5AVUFEAB positions itself as a versatile embedded processor option where multicore performance, advanced multimedia capabilities and on‑chip security are required. Its combination of Cortex® application and real‑time cores, dedicated DSP for audio, hardware video/graphics acceleration, and broad peripheral/memory support make it well suited to designs that demand integration of display, audio and networked interfaces.

For engineers building complex infotainment, HMI or multimedia gateway systems, this device offers a compact, feature‑rich building block that supports high-resolution displays, multi‑stream audio processing and secure system operation while simplifying board-level integration.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the MIMX8QM5AVUFEAB.

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