MIMX8QM6AVUFEAB
| Part Description |
i.MX 8QuadMax multicore microprocessor |
|---|---|
| Quantity | 568 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QM |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 | Display & Interface Controllers | MIPI-DSI | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 1G, AVB | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40 °C – 125 °C | ||
| Qualification | Automotive | REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | ||
| Speed | 1.3 GHz | Voltage – I/O | 1.8 V – 3.3 V |
Overview of MIMX8QM6AVUFEAB – i.MX 8QuadMax multicore microprocessor
The MIMX8QM6AVUFEAB is a high‑performance microprocessor IC from NXP Semiconductors in the i.MX 8QM series. It implements a heterogeneous multicore architecture composed of Arm® Cortex®‑A72, Cortex®‑A53 and Cortex®‑M4F processors and operates at up to 1.3 GHz.
Designed for embedded and infotainment-class applications, the device integrates graphics acceleration, a 4K‑capable video processing unit, multiple display controller options (including MIPI‑DSI), extensive memory and peripheral interfaces, and a comprehensive security feature set to address demanding multimedia and connected system designs.
Key Features
- Multicore CPU architecture Two Arm® Cortex®‑A72 cores, four Arm® Cortex®‑A53 cores and two Arm® Cortex®‑M4F cores with a maximum core speed of 1.3 GHz for scalable compute across application and real‑time domains.
- Graphics and video acceleration Dual GPU subsystems and a 4K H.265 capable VPU enable advanced graphics and high‑resolution video playback and rendering.
- Display interfaces Dual failover‑ready display controllers with support for MIPI‑DSI and other outputs provide flexible single‑4K or multi‑display configurations.
- Memory and storage support Interfaces for LPDDR4, Quad/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD 3.0 deliver broad memory and boot storage options.
- Connectivity and high‑speed I/O Rich peripheral I/O including PCIe and 1 Gb Ethernet with AVB support enables robust networking and expansion capability.
- Advanced audio processing Integrated Tensilica® HiFi 4 DSP and multicore audio processing support pre‑/post‑processing and voice recognition workloads.
- Comprehensive security On‑chip security features include CAAM, HAB, SHE, SJC, SNVS, Secure RAM, TRNG and TrustZone (TZ) to address system security requirements.
- Package and mounting FCPBGA 29 × 29 mm package (0.75 mm pitch); surface‑mount device for standard board assembly.
- Operating temperature range Specified for operation from −40 °C to 125 °C to suit thermally demanding embedded deployments.
Typical Applications
- Infotainment and multimedia systems High‑resolution video, dual GPU rendering and a 4K VPU support rich multimedia playback and user experiences.
- Rich HMI and display systems Dual display controllers and MIPI‑DSI support enable complex instrument panels and multi‑display user interfaces.
- Edge compute and networked appliances Multicore processing plus PCIe and 1 Gb Ethernet (AVB) connectivity serve compute‑intensive, networked edge devices.
- Rugged embedded platforms Extended temperature rating and integrated security features make the device suitable for thermally and operationally challenging embedded designs.
Unique Advantages
- Highly integrated multicore platform: Consolidates Arm® A‑class and M‑class cores to support both application and real‑time processing domains on a single device.
- End‑to‑end multimedia capability: Combined GPU subsystems, a 4K H.265 VPU and audio DSP simplify board‑level design for advanced media applications.
- Broad memory and boot flexibility: Support for LPDDR4, FlexSPI, eMMC and SD allows designers to choose appropriate memory and boot architectures.
- Comprehensive on‑chip security: Multiple hardware security modules and features provide building blocks for secure system design.
- Wide thermal operating range: −40 °C to 125 °C rating supports deployment in demanding environmental conditions.
- Proven i.MX 8 family pedigree: Part of NXP’s i.MX 8 series with accompanying technical documentation and family resources for system integration.
Why Choose MIMX8QM6AVUFEAB?
The MIMX8QM6AVUFEAB delivers a balanced combination of multicore compute, advanced multimedia engines, extensive I/O and a robust security feature set. Its architecture and interfaces are suited to designs that require concurrent high‑performance application processing, real‑time control and rich multimedia capabilities.
This part is appropriate for designers targeting infotainment, multimedia, HMI and compute‑rich embedded systems where integration, scalable performance and extended temperature operation are priorities. As a member of the i.MX 8 family from NXP Semiconductors, it aligns with existing documentation and ecosystem resources for system bring‑up and integration.
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