MIMX8QP5AVUFFAB

IC MPU 266MHZ/1.2/1.6GHZ 1313BGA
Part Description

ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Microprocessor IC - 1, 2, 4 266MHz, 1.2GHz, 1.6GHz 1313-BGA (29x29)

Quantity 553 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4FCore ProcessorARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53Device Package1313-BGA (29x29)
ECCN5A992CGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1, 2, 4Operating Temperature-40°C ~ 125°C (TJ)Package / Case1313-BFBGA
RAM ControllersLPDDR4, DRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed266MHz, 1.2GHz, 1.6GHzSupplier Device Package1313-BGA (29×29)USBUSB (3)

Overview of MIMX8QP5AVUFFAB – IC MPU 266MHZ/1.2/1.6GHZ 1313BGA

The MIMX8QP5AVUFFAB from NXP Semiconductors is a high-integration microprocessor in the i.MX 8QP family designed for advanced embedded multimedia and display applications. It integrates ARM® Cortex®-A72, ARM® Cortex®-A53 and ARM® Cortex®-M4F processing elements with a broad set of on-chip multimedia and I/O capabilities described in the device datasheet.

This 29 × 29 mm 1313-BGA package supports LPDDR4/DRAM memory interfaces, USB 3 connectivity and graphics acceleration, delivering a compact platform for rich user interfaces, multimedia processing and complex embedded systems operating across a wide temperature range.

Key Features

  • Multicore Architecture  Combines ARM® Cortex®-A72, Cortex®-A53 and Cortex®-M4F cores as described in the i.MX 8QuadPlus family; product labeling includes operating points listed at 266 MHz, 1.2 GHz and 1.6 GHz.
  • Memory and Storage  Supports LPDDR4 and DRAM memory controllers and includes support for common storage interfaces referenced in the datasheet such as eMMC and Quad/Octal SPI (FlexSPI).
  • Multimedia and Graphics  On-chip graphics acceleration, dual GPU subsystems and a 4K H.265 capable VPU are called out in the family datasheet for handling high-resolution display and video workloads.
  • Display Subsystems  Dual failover-ready display controllers and multiple display output options are documented in the datasheet for single 4K displays or multi‑panel configurations.
  • High-speed Interfaces  Includes USB 3 support and SPI among the additional interfaces listed in the product specifications for high bandwidth peripheral connectivity.
  • Package and Mounting  1313-BFBGA package (1313‑BGA, 29 × 29 mm) in a surface-mount form factor suitable for compact embedded board designs.
  • Extended Operating Range  Rated for an operating temperature range of −40 °C to 125 °C as specified in the product data.
  • Developer and System Support  The i.MX 8QuadPlus family datasheet provides detailed architectural, electrical and boot-mode information to support system integration and bring-up.

Typical Applications

  • Infotainment and Display Systems  High-resolution display support, GPU subsystems and a 4K-capable VPU enable rich HMI and multimedia playback implementations.
  • Embedded Multimedia Appliances  Integrated graphics acceleration and audio processing paths make the device suitable for multimedia gateways, media players and smart displays.
  • Voice and Audio Processing  On-chip DSP and Cortex-M4F elements described in the datasheet support pre/post audio processing and voice recognition workloads.
  • Advanced Embedded Control  Multi-core compute plus extensive peripheral I/O supports complex embedded control systems requiring a mix of high-performance and real-time processing.

Unique Advantages

  • Scalable Multicore Options: Family architecture provides combinations of Cortex‑A72, Cortex‑A53 and Cortex‑M4F cores to match performance and real-time needs.
  • Rich Multimedia Subsystems: Dual GPUs and a 4K H.265-capable VPU enable high-quality video and graphics capabilities in a single device.
  • Comprehensive Memory Support: LPDDR4 and DRAM controller support enables high-bandwidth system memory configurations for demanding applications.
  • High-density Package: The 1313‑BGA (29 × 29 mm) package concentrates advanced functionality into a compact surface-mount form factor for space-constrained designs.
  • Wide Temperature Operation: Specified operation from −40 °C to 125 °C supports deployment in thermally demanding embedded environments.
  • Extensive Documentation: Detailed datasheet content covers block diagrams, electrical characteristics and boot configuration to aid integration and validation.

Why Choose MIMX8QP5AVUFFAB?

The MIMX8QP5AVUFFAB delivers a highly integrated processing platform from NXP’s i.MX 8QP family, combining heterogeneous ARM cores with robust multimedia and interface support. Its combination of graphics acceleration, 4K video capability, LPDDR4 memory support and high-speed I/O in a 29 × 29 mm BGA package makes it well suited to embedded designs that require multimedia performance and compact board-level integration.

This part is appropriate for designers targeting advanced infotainment, multimedia, audio processing and complex embedded control systems who require documented electrical and system-level details to support design, bring‑up and validation.

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