MIMX8QX1AVOFZAC

I.MX 8QUADXPLUS 17X17
Part Description

I.MX 8QUADXPLUS 17X17

Quantity 1,251 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitOperating Temperature–RAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantUSBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)

Overview of MIMX8QX1AVOFZAC – I.MX 8QUADXPLUS 17X17

The MIMX8QX1AVOFZAC is a high-integration microprocessor IC for embedded systems, featuring ARM® Cortex®‑A53 application cores alongside an ARM® Cortex®‑M4F real‑time core. It targets designs that require a blend of application‑level performance, real‑time control and multimedia processing, with on‑chip support for advanced displays, networking and security.

With a 3‑core, 64‑bit architecture and dedicated multimedia/DSP engines, this device is suitable for embedded applications that demand compute density, graphics acceleration and robust connectivity while maintaining a surface‑mount form factor.

Key Features

  • Core and Compute 3 Core, 64‑Bit configuration using ARM® Cortex®‑A53 plus an ARM® Cortex®‑M4F for real‑time tasks, enabling partitioned application and control processing.
  • Multimedia and DSP Integrated multimedia co‑processors including NEON and Hi‑Fi4 DSP support for media acceleration and signal processing workloads.
  • Memory Support Built‑in controllers for DDR3L SDRAM and LPDDR4 DRAM to support memory bandwidth requirements for multimedia and application processing.
  • Display and Vision Interfaces Multiple display interface controllers including LCD, LVDS, MIPI‑CSI and MIPI‑DSI to support rich HMI and camera/vision front ends.
  • High‑Speed Connectivity Dual Gigabit Ethernet (10/100/1000 Mbps ×2) plus USB 3.0 OTG + PHY and USB 2.0 OTG + PHY for flexible high‑throughput I/O and peripheral connectivity.
  • Security and Trusted Boot Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone, CAAM, A‑HAB and SNVS for secure boot, cryptography and system integrity.
  • Graphics Acceleration On‑chip graphics acceleration to offload display rendering and improve UI responsiveness.
  • Mounting and Compliance Surface mount device with RoHS compliance for modern PCB assembly and environmental requirements.

Typical Applications

  • Embedded HMI and Infotainment – Use integrated display controllers and graphics acceleration to drive LCD/LVDS/MIPI displays for rich user interfaces.
  • Edge Multimedia and Vision – Leverage MIPI‑CSI and DSP/NEON engines for camera capture, image processing and multimedia codecs at the edge.
  • Industrial Networking and Gateways – Dual Gigabit Ethernet and USB OTG ports provide the throughput and peripheral connectivity needed for industrial networked devices.
  • Real‑Time Control + Applications – Combine Cortex‑A53 application processing with a Cortex‑M4F real‑time core for mixed control and higher‑level functions in compact embedded platforms.

Unique Advantages

  • Balanced Heterogeneous Processing: Combines 64‑bit Cortex‑A53 cores for application workloads with a Cortex‑M4F for deterministic real‑time tasks to simplify partitioned system design.
  • Integrated Multimedia and DSP: NEON and Hi‑Fi4 DSP co‑processors plus graphics acceleration reduce external accelerator requirements and lower BOM complexity.
  • Flexible Memory Options: Support for DDR3L and LPDDR4 DRAM controllers enables designers to choose memory technologies that match performance and power goals.
  • Robust Connectivity: Dual 1GbE plus USB 3.0/2.0 OTG provide high bandwidth interfaces for networking, storage and peripherals without external bridging.
  • Comprehensive Security Suite: On‑chip cryptographic engines and trusted‑boot features enhance device security and protect IP and data at rest and in transit.
  • Production‑Ready Compliance: RoHS compliance and surface‑mount packaging align with standard manufacturing processes.

Why Choose MIMX8QX1AVOFZAC?

The MIMX8QX1AVOFZAC positions itself as a versatile, highly integrated microprocessor for embedded designs that require a combination of application performance, real‑time control and multimedia capability. Its ARM® Cortex®‑A53 and Cortex®‑M4F cores, along with dedicated DSP and graphics acceleration, make it suitable for systems that consolidate compute, vision, HMI and networking functions.

Choose this device when you need a compact surface‑mount processor with dual gigabit Ethernet, modern USB connectivity, flexible DRAM support and hardware security primitives—enabling scalable, secure embedded platforms with simplified system integration and reduced external component count.

If you would like pricing, lead‑time or a formal quote for MIMX8QX1AVOFZAC, submit a request and our team will assist with a tailored quote and ordering details.

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