MIMX8QX1FVLFZAC

I.MX 8QUADXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,558 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX1FVLFZAC – I.MX 8QUADXPLUS 21X21

The MIMX8QX1FVLFZAC is an NXP i.MX 8QX-series embedded microprocessor combining high-performance application cores with a dedicated real-time core. It integrates ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F real-time core with clock rates of 1.2 GHz and 264 MHz respectively, targeting demanding embedded and industrial applications.

Designed for multimedia-rich, connectivity-focused designs, this 3-core 64-bit device delivers graphics acceleration, advanced security engines, and a broad set of I/O for connectivity and sensor interfaces, all in a compact 609-FBGA (21×21) surface-mount package.

Key Features

  • CPU Architecture  ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real-time core; 3 cores total with 64-bit application processing and a 1.2 GHz application clock plus 264 MHz real-time core.
  • DSP and Multimedia Engines  Integrated multimedia accelerators including NEON and Hi-Fi4 DSP support for optimized media processing and audio workloads.
  • Memory Interfaces  Supports DDR3L SDRAM and LPDDR4 DRAM controllers for flexible system memory configurations.
  • Display and Camera  Display controllers for LCD and LVDS plus MIPI-DSI and MIPI-CSI interfaces for high-resolution display and camera connectivity.
  • High-Speed Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps), USB 3.0 OTG + PHY and USB 2.0 OTG + PHY for high-bandwidth peripheral and networking options.
  • Automotive/Industrial Fieldbus  CANbus interface support for robust control and vehicle/industrial network integration.
  • Security and Cryptography  Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM, and Secure Non-Volatile Storage (SNVS) for secure boot and data protection strategies.
  • Graphics Acceleration  Integrated graphics acceleration to offload GUI and visualization tasks from main application cores.
  • Package and Mounting  609-FBGA package (21×21 mm) intended for surface-mount PCB assembly; RoHS compliant.

Typical Applications

  • Industrial Automation  Controls, HMIs and gateway devices leveraging real-time M4F processing, dual Ethernet and CANbus connectivity for factory networks.
  • Edge and IoT Compute  Edge devices requiring multi-core application processing, hardware security and USB/ethernet connectivity for local analytics and secure data transfer.
  • Multimedia and HMI  Human-machine interfaces and multimedia terminals using MIPI-DSI/MIPI-CSI, LCD/LVDS display support and graphics acceleration for responsive GUIs.
  • Networking and Gateway Appliances  Embedded gateways and routers that benefit from dual Gigabit Ethernet, USB 3.0 and hardware security for secure, high-throughput communication.

Unique Advantages

  • Heterogeneous processing  Combines 64-bit Cortex-A53 cores with a Cortex-M4F real-time core to separate application and real-time workloads for efficient system design.
  • Broad multimedia and sensor I/O  MIPI-CSI/DSI, LCD/LVDS and graphics acceleration simplify integration of displays and cameras while offloading rendering tasks.
  • Comprehensive security engines  On-chip cryptographic modules and TrustZone support help protect IP, secure boot and runtime data without external accelerators.
  • Flexible memory support  DDR3L and LPDDR4 memory controller support enables scalable memory performance choices for cost or performance optimized BOMs.
  • High-speed peripheral connectivity  USB 3.0 OTG plus dual Gigabit Ethernet provides headroom for high-bandwidth peripherals and networking functions.
  • Compact, production-ready package  609-FBGA (21×21) surface-mount package fits dense board designs while meeting RoHS environmental compliance.

Why Choose MIMX8QX1FVLFZAC?

The MIMX8QX1FVLFZAC positions itself as a versatile embedded processor for designs that need a balance of application performance, secure operation, and real-time responsiveness. Its combination of ARM® Cortex®-A53 application cores with a Cortex®-M4F real-time core, integrated multimedia accelerators, and extensive I/O makes it suitable for industrial automation, multimedia HMIs, edge compute nodes, and networked gateway devices.

With on-chip security engines, flexible memory interfaces, high-speed connectivity and a compact 609-FBGA package, this device supports scalable system architectures and long-term deployment needs while simplifying BOM and board-level integration.

Request a quote or submit an inquiry today to discuss availability, lead times and pricing for MIMX8QX1FVLFZAC. Our team can provide part-specific ordering and support information to help move your design forward.

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