MIMX8QX2AVOFZAC
| Part Description |
I.MX8 QXP 17X17 |
|---|---|
| Quantity | 63 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | Yes | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 3 Core, 64-Bit | Operating Temperature | – | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) |
Overview of MIMX8QX2AVOFZAC – I.MX8 QXP 17X17
The MIMX8QX2AVOFZAC is a high‑integration microprocessor from NXP Semiconductors' i.MX 8QX family, designed for embedded and industrial applications. It combines a 64‑bit multicore architecture with real‑time processing to address multimedia, control and connectivity use cases.
Featuring ARM® Cortex®‑A53 application cores alongside an ARM® Cortex®‑M4F companion core, the device delivers balanced performance, real‑time responsiveness and on‑chip multimedia acceleration with a broad set of I/O and security capabilities for robust system designs.
Key Features
- Core Architecture: Triple‑core design with ARM® Cortex®‑A53 application cores plus an ARM® Cortex®‑M4F real‑time core; 64‑bit application processing for modern embedded workloads.
- Multimedia & DSP Acceleration: Integrated multimedia coprocessors including NEON and Hi‑Fi4 DSP support for audio and media processing; graphics acceleration is included for display and UI tasks.
- Memory Interfaces: Supports DDR3L and LPDDR4 memory controllers, enabling flexible system memory choices for performance and capacity.
- Display & Camera Interfaces: Multiple display and imaging controllers including LCD, LVDS, MIPI‑CSI and MIPI‑DSI to support rich human‑machine interfaces and camera input.
- Ethernet & USB Connectivity: Dual 10/100/1000 Mbps Ethernet ports and both USB 3.0 OTG (with PHY) and USB 2.0 OTG (with PHY) for high‑speed wired networking and peripheral connectivity.
- Security Features: On‑chip security primitives and modules including 3DES, DES, MD5, SHA, A‑HAB, ARM TrustZone and CAAM, plus SNVS for secure nonvolatile storage and state.
- Storage & Boot Options (from series datasheet): Series documentation indicates support for eMMC 5.1, SD 3.0 and FlexSPI (Quad/Octal SPI) options for flexible boot and storage configurations.
- Mounting & Compliance: Surface mount device with RoHS compliance for modern manufacturing and environmental requirements.
Typical Applications
- Industrial Control & Automation: Use the multicore CPU and real‑time M4F core for coordinated control, data aggregation and deterministic tasks in factory automation and process control systems.
- Human‑Machine Interfaces (HMI): Leverage graphics acceleration and multiple display interfaces (LCD, LVDS, MIPI‑DSI) to drive rich operator panels, touchscreens and visual dashboards.
- Multimedia & Audio Processing: Apply NEON and Hi‑Fi4 DSP resources for audio processing, voice interfaces and media decoding in embedded multimedia appliances.
- Networking & Gateway Appliances: Dual gigabit Ethernet and USB 3.0 connectivity make this device suitable for industrial gateways, routers and secure edge networking nodes.
Unique Advantages
- Balanced High‑Performance Architecture: Combines 64‑bit Cortex‑A53 cores with a Cortex‑M4F companion for responsive application processing plus low‑latency control tasks.
- Integrated Multimedia & Graphics: On‑chip NEON, Hi‑Fi4 DSP and graphics acceleration reduce external component count for compact multimedia and HMI designs.
- Comprehensive Connectivity: Dual Gigabit Ethernet and USB 3.0/2.0 OTG support provide flexible, high‑speed wired interfaces for networking and peripherals.
- Robust Security Building Blocks: A suite of security modules and crypto primitives (A‑HAB, ARM TrustZone, CAAM, SHA/MD5/DES/3DES, SNVS) help implement device and data protection strategies.
- Flexible Memory & Storage Options: Support for DDR3L and LPDDR4 memory controllers and series‑documented options for eMMC, SD and SPI flash enable scalable memory and boot configurations.
- Industrial‑Oriented Feature Set: The combination of processing, I/O, display and communication features addresses typical requirements for embedded industrial applications.
Why Choose MIMX8QX2AVOFZAC?
The MIMX8QX2AVOFZAC positions itself as an integrated, connectivity‑rich microprocessor for embedded designs that need a balance of application performance and real‑time control. Its multicore ARM architecture, multimedia/DSP accelerators, extensive display and camera interfaces, and dual gigabit Ethernet deliver a compact platform for HMI, gateway and industrial systems.
Backed by NXP Semiconductors and designed with on‑chip security features and flexible memory options, this device is suitable for engineers seeking a scalable, feature‑dense solution for modern embedded products while maintaining compliance with RoHS manufacturing requirements.
Request a quote or submit a product inquiry to receive pricing and availability information for the MIMX8QX2AVOFZAC and to discuss how it fits your design requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
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