MIMX8QX2AVOFZAC

I.MX8 QXP 17X17
Part Description

I.MX8 QXP 17X17

Quantity 63 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitOperating Temperature–RAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantUSBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)

Overview of MIMX8QX2AVOFZAC – I.MX8 QXP 17X17

The MIMX8QX2AVOFZAC is a high‑integration microprocessor from NXP Semiconductors' i.MX 8QX family, designed for embedded and industrial applications. It combines a 64‑bit multicore architecture with real‑time processing to address multimedia, control and connectivity use cases.

Featuring ARM® Cortex®‑A53 application cores alongside an ARM® Cortex®‑M4F companion core, the device delivers balanced performance, real‑time responsiveness and on‑chip multimedia acceleration with a broad set of I/O and security capabilities for robust system designs.

Key Features

  • Core Architecture: Triple‑core design with ARM® Cortex®‑A53 application cores plus an ARM® Cortex®‑M4F real‑time core; 64‑bit application processing for modern embedded workloads.
  • Multimedia & DSP Acceleration: Integrated multimedia coprocessors including NEON and Hi‑Fi4 DSP support for audio and media processing; graphics acceleration is included for display and UI tasks.
  • Memory Interfaces: Supports DDR3L and LPDDR4 memory controllers, enabling flexible system memory choices for performance and capacity.
  • Display & Camera Interfaces: Multiple display and imaging controllers including LCD, LVDS, MIPI‑CSI and MIPI‑DSI to support rich human‑machine interfaces and camera input.
  • Ethernet & USB Connectivity: Dual 10/100/1000 Mbps Ethernet ports and both USB 3.0 OTG (with PHY) and USB 2.0 OTG (with PHY) for high‑speed wired networking and peripheral connectivity.
  • Security Features: On‑chip security primitives and modules including 3DES, DES, MD5, SHA, A‑HAB, ARM TrustZone and CAAM, plus SNVS for secure nonvolatile storage and state.
  • Storage & Boot Options (from series datasheet): Series documentation indicates support for eMMC 5.1, SD 3.0 and FlexSPI (Quad/Octal SPI) options for flexible boot and storage configurations.
  • Mounting & Compliance: Surface mount device with RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

  • Industrial Control & Automation: Use the multicore CPU and real‑time M4F core for coordinated control, data aggregation and deterministic tasks in factory automation and process control systems.
  • Human‑Machine Interfaces (HMI): Leverage graphics acceleration and multiple display interfaces (LCD, LVDS, MIPI‑DSI) to drive rich operator panels, touchscreens and visual dashboards.
  • Multimedia & Audio Processing: Apply NEON and Hi‑Fi4 DSP resources for audio processing, voice interfaces and media decoding in embedded multimedia appliances.
  • Networking & Gateway Appliances: Dual gigabit Ethernet and USB 3.0 connectivity make this device suitable for industrial gateways, routers and secure edge networking nodes.

Unique Advantages

  • Balanced High‑Performance Architecture: Combines 64‑bit Cortex‑A53 cores with a Cortex‑M4F companion for responsive application processing plus low‑latency control tasks.
  • Integrated Multimedia & Graphics: On‑chip NEON, Hi‑Fi4 DSP and graphics acceleration reduce external component count for compact multimedia and HMI designs.
  • Comprehensive Connectivity: Dual Gigabit Ethernet and USB 3.0/2.0 OTG support provide flexible, high‑speed wired interfaces for networking and peripherals.
  • Robust Security Building Blocks: A suite of security modules and crypto primitives (A‑HAB, ARM TrustZone, CAAM, SHA/MD5/DES/3DES, SNVS) help implement device and data protection strategies.
  • Flexible Memory & Storage Options: Support for DDR3L and LPDDR4 memory controllers and series‑documented options for eMMC, SD and SPI flash enable scalable memory and boot configurations.
  • Industrial‑Oriented Feature Set: The combination of processing, I/O, display and communication features addresses typical requirements for embedded industrial applications.

Why Choose MIMX8QX2AVOFZAC?

The MIMX8QX2AVOFZAC positions itself as an integrated, connectivity‑rich microprocessor for embedded designs that need a balance of application performance and real‑time control. Its multicore ARM architecture, multimedia/DSP accelerators, extensive display and camera interfaces, and dual gigabit Ethernet deliver a compact platform for HMI, gateway and industrial systems.

Backed by NXP Semiconductors and designed with on‑chip security features and flexible memory options, this device is suitable for engineers seeking a scalable, feature‑dense solution for modern embedded products while maintaining compliance with RoHS manufacturing requirements.

Request a quote or submit a product inquiry to receive pricing and availability information for the MIMX8QX2AVOFZAC and to discuss how it fits your design requirements.

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