MIMX8QX1FVOFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17) |
|---|---|
| Quantity | 1,477 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 417-FBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 417-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 264MHz | ||
| Supplier Device Package | 417-FBGA (17×17) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8QX1FVOFZAC – I.MX 8QUADXPLUS 17X17
The MIMX8QX1FVOFZAC is an i.MX 8QX series microprocessor from NXP Semiconductors integrating ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F real-time core. This 3-core, 64-bit device combines high-performance application processing with a dedicated microcontroller core for deterministic tasks.
Designed for embedded systems requiring multimedia, connectivity and hardware security, the device delivers a balanced mix of processing, graphics acceleration and I/O integration in a compact 417-FBGA (17×17) surface-mount package.
Key Features
- Multi-core Architecture 3 cores (64-bit) combining ARM® Cortex®-A53 for application processing and an ARM® Cortex®-M4F for real-time control; primary core speed listed at 1.2 GHz and M4F at 264 MHz.
- Multimedia and DSP Acceleration On-chip multimedia acceleration with NEON and Hi-Fi4 DSP support to assist media processing and signal tasks.
- Memory Interfaces Supports DDR3L SDRAM and LPDDR4 DRAM controllers to match a range of memory performance and power targets.
- Display and Image I/O Integrated display interface controllers for LCD and LVDS plus MIPI-CSI and MIPI-DSI for camera and display connectivity.
- High-Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and both USB 2.0 OTG + PHY and USB 3.0 OTG + PHY ports for broad peripheral and network connectivity.
- Security and Trust Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM, A-HAB and SNVS for secure boot and cryptographic acceleration.
- Package and Mounting 417-FBGA package (17×17 mm) in a surface-mount form factor for space-constrained embedded boards.
- Graphics Acceleration Integrated graphics acceleration to support display and UI workloads.
Typical Applications
- Industrial Control and Automation Use the Cortex‑A53 cores for HMI and application logic while the Cortex‑M4F handles real‑time control and deterministic I/O.
- Multimedia HMI Drive LCD/LVDS displays and MIPI-DSI panels with graphics acceleration for responsive user interfaces.
- Networked Embedded Systems Dual Gigabit Ethernet and USB 3.0/2.0 OTG enable high-throughput connectivity for gateways, controllers and edge appliances.
- Vision and Sensor Processing MIPI-CSI support combined with NEON/Hi-Fi4 DSP assists camera interfacing and multimedia preprocessing tasks.
Unique Advantages
- Balanced Processing and Real-Time Control: Combines high-performance Cortex‑A53 application cores with a Cortex‑M4F real-time core to separate workload domains and simplify system design.
- Comprehensive Connectivity: Integrated Gigabit Ethernet, USB 3.0 OTG and USB 2.0 OTG provide flexible, high-speed peripheral and network options.
- Rich Multimedia I/O: Native support for LCD, LVDS, MIPI-DSI and MIPI-CSI reduces external bridge requirements for display and camera subsystems.
- Built-in Security Primitives: On-chip cryptographic and secure-boot features (CAAM, A-HAB, ARM TZ, SNVS, DES/3DES/MD5/SHA) help implement device-level security functions.
- Memory Flexibility: Support for DDR3L and LPDDR4 gives designers options for optimizing cost, performance and power.
- Compact, Production-Ready Packaging: 417-FBGA (17×17) surface-mount package enables dense board layouts for embedded product designs.
Why Choose MIMX8QX1FVOFZAC?
The MIMX8QX1FVOFZAC positions itself as a versatile embedded processor for designs requiring a mix of application processing, multimedia capability and deterministic control. Its combination of ARM® Cortex®-A53 cores and an ARM® Cortex®-M4F core, along with integrated graphics acceleration and extensive I/O, makes it suitable for a wide range of embedded and industrial applications.
Manufactured by NXP Semiconductors and supplied in a compact 417‑FBGA (17×17) package, this device offers designers a high-integration option that helps reduce BOM complexity while delivering validated hardware security and broad connectivity.
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Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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