MIMX8QX1FVOFZAC

I.MX 8QUADXPLUS 17X17
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17)

Quantity 1,477 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package417-FBGA (17x17)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case417-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz, 264MHz
Supplier Device Package417-FBGA (17×17)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX1FVOFZAC – I.MX 8QUADXPLUS 17X17

The MIMX8QX1FVOFZAC is an i.MX 8QX series microprocessor from NXP Semiconductors integrating ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F real-time core. This 3-core, 64-bit device combines high-performance application processing with a dedicated microcontroller core for deterministic tasks.

Designed for embedded systems requiring multimedia, connectivity and hardware security, the device delivers a balanced mix of processing, graphics acceleration and I/O integration in a compact 417-FBGA (17×17) surface-mount package.

Key Features

  • Multi-core Architecture  3 cores (64-bit) combining ARM® Cortex®-A53 for application processing and an ARM® Cortex®-M4F for real-time control; primary core speed listed at 1.2 GHz and M4F at 264 MHz.
  • Multimedia and DSP Acceleration  On-chip multimedia acceleration with NEON and Hi-Fi4 DSP support to assist media processing and signal tasks.
  • Memory Interfaces  Supports DDR3L SDRAM and LPDDR4 DRAM controllers to match a range of memory performance and power targets.
  • Display and Image I/O  Integrated display interface controllers for LCD and LVDS plus MIPI-CSI and MIPI-DSI for camera and display connectivity.
  • High-Speed Connectivity  Dual 10/100/1000 Mbps Ethernet ports and both USB 2.0 OTG + PHY and USB 3.0 OTG + PHY ports for broad peripheral and network connectivity.
  • Security and Trust  Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM, A-HAB and SNVS for secure boot and cryptographic acceleration.
  • Package and Mounting  417-FBGA package (17×17 mm) in a surface-mount form factor for space-constrained embedded boards.
  • Graphics Acceleration  Integrated graphics acceleration to support display and UI workloads.

Typical Applications

  • Industrial Control and Automation  Use the Cortex‑A53 cores for HMI and application logic while the Cortex‑M4F handles real‑time control and deterministic I/O.
  • Multimedia HMI  Drive LCD/LVDS displays and MIPI-DSI panels with graphics acceleration for responsive user interfaces.
  • Networked Embedded Systems  Dual Gigabit Ethernet and USB 3.0/2.0 OTG enable high-throughput connectivity for gateways, controllers and edge appliances.
  • Vision and Sensor Processing  MIPI-CSI support combined with NEON/Hi-Fi4 DSP assists camera interfacing and multimedia preprocessing tasks.

Unique Advantages

  • Balanced Processing and Real-Time Control: Combines high-performance Cortex‑A53 application cores with a Cortex‑M4F real-time core to separate workload domains and simplify system design.
  • Comprehensive Connectivity: Integrated Gigabit Ethernet, USB 3.0 OTG and USB 2.0 OTG provide flexible, high-speed peripheral and network options.
  • Rich Multimedia I/O: Native support for LCD, LVDS, MIPI-DSI and MIPI-CSI reduces external bridge requirements for display and camera subsystems.
  • Built-in Security Primitives: On-chip cryptographic and secure-boot features (CAAM, A-HAB, ARM TZ, SNVS, DES/3DES/MD5/SHA) help implement device-level security functions.
  • Memory Flexibility: Support for DDR3L and LPDDR4 gives designers options for optimizing cost, performance and power.
  • Compact, Production-Ready Packaging: 417-FBGA (17×17) surface-mount package enables dense board layouts for embedded product designs.

Why Choose MIMX8QX1FVOFZAC?

The MIMX8QX1FVOFZAC positions itself as a versatile embedded processor for designs requiring a mix of application processing, multimedia capability and deterministic control. Its combination of ARM® Cortex®-A53 cores and an ARM® Cortex®-M4F core, along with integrated graphics acceleration and extensive I/O, makes it suitable for a wide range of embedded and industrial applications.

Manufactured by NXP Semiconductors and supplied in a compact 417‑FBGA (17×17) package, this device offers designers a high-integration option that helps reduce BOM complexity while delivering validated hardware security and broad connectivity.

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