MIMX8QX5CVLFZAC

MIMX8QX5CVLFZAC
Part Description

Microprocessor IC

Quantity 985 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCN5A992CEthernet10/100/1000Mbps (2)Graphics AccelerationYes
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitRAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantUSBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)

Overview of MIMX8QX5CVLFZAC – Microprocessor IC

The MIMX8QX5CVLFZAC from NXP Semiconductors is a high-integration embedded microprocessor in the i.MX 8QX series. It combines ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real-time core to address mixed workload designs requiring both application processing and deterministic control.

Designed for embedded systems, the device targets applications that need multimedia acceleration, rich display and camera interfaces, robust wired connectivity, and hardware security features while maintaining system-level integration to simplify board design.

Key Features

  • Core Architecture 
    ARM® Cortex®-A53 and ARM® Cortex®-M4F cores provide a mix of 64-bit application processing and dedicated real-time control for hybrid workloads.
  • Multimedia and DSP 
    Includes multimedia acceleration and NEON plus Hi-Fi4 DSP support to accelerate signal processing and media pipelines.
  • Memory Interfaces 
    Support for DDR3L SDRAM and LPDDR4 DRAM controllers to enable flexible memory configurations for performance or power-optimized designs.
  • Display and Camera 
    Integrated display interface controllers including LCD, LVDS, MIPI-CSI and MIPI-DSI to support advanced HMI and vision applications.
  • High-Speed Networking 
    Two 10/100/1000 Mbps Ethernet interfaces provide wired connectivity options for industrial and networking applications.
  • USB Connectivity 
    Includes USB 2.0 OTG with PHY and USB 3.0 OTG with PHY for flexible host/device and high-bandwidth peripheral connections.
  • Security Features 
    Built-in cryptographic and secure boot capabilities including 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS to help protect system integrity and data.
  • Mounting and Package 
    Surface-mount device suitable for compact embedded board designs.
  • Environmental Compliance 
    RoHS compliant.
  • Graphics Acceleration 
    On-chip graphics acceleration to support modern user interfaces and visual workloads.

Typical Applications

  • Industrial Control and Automation 
    Use the combination of Cortex-A53 and Cortex-M4F cores for HMI, protocol stacks and real-time motor or process control.
  • Edge Networking and Gateways 
    Dual gigabit Ethernet and USB OTG support make the device well suited for secure edge routers, IoT gateways and protocol converters.
  • Multimedia and Vision Systems 
    MIPI-CSI/MIPI-DSI and graphics acceleration enable camera-based inspection, vision analytics and rich graphical interfaces.
  • Embedded Human-Machine Interfaces 
    LCD/LVDS display support and graphics acceleration make it suitable for touchscreen panels and operator consoles.

Unique Advantages

  • Heterogeneous Processing: Combines 64-bit application cores with a dedicated real-time core to separate user-space workloads from timing-critical control.
  • Integrated Multimedia Acceleration: NEON and Hi‑Fi4 DSP support reduce external accelerator requirements and simplify BOM for media and signal-processing tasks.
  • Robust Connectivity: Dual gigabit Ethernet plus USB 3.0 OTG enables high-throughput network and peripheral connections without additional interface chips.
  • Comprehensive Security Toolbox: On-chip cryptographic engines and secure-boot related features help implement system-level security workflows.
  • Flexible Memory Support: DDR3L and LPDDR4 controller support allows designers to choose memory that fits performance and power targets.
  • Design-Friendly Packaging: Surface-mount package supports compact embedded PCBs and industrial board layouts.

Why Choose MIMX8QX5CVLFZAC?

The MIMX8QX5CVLFZAC positions itself as a balanced solution for embedded designs that require application-grade processing alongside deterministic real-time control. Its combination of ARM® Cortex®-A53 and Cortex®-M4F cores, multimedia/DSP capabilities, extensive display and camera interfaces, and multiple wired connectivity options make it suitable for compact, integrated systems.

Backed by NXP Semiconductors and the i.MX 8QX series pedigree, this device delivers a scalable platform for developers focused on multimedia-enabled HMIs, industrial networking, and edge compute applications where integration, security features, and interface flexibility reduce BOM complexity and accelerate development.

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