MIMX8QX5FVLFZAC

I.MX 8QUADXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,295 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX5FVLFZAC – I.MX 8QUADXPLUS 21X21

The MIMX8QX5FVLFZAC is a high-performance embedded microprocessor from NXP's i.MX 8QX family. It integrates ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F core in a 3-core, 64-bit configuration with a primary core speed of 1.2 GHz and a Cortex-M4F real-time core at 264 MHz.

Designed for embedded and industrial applications that require multimedia acceleration, robust connectivity and on-chip security, this device combines multicore processing, graphics acceleration and multiple I/O interfaces in a compact 609-FBGA (21×21) surface-mount package.

Key Features

  • Core Architecture ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F real-time core provide a 3-core, 64-bit processing foundation with a 1.2 GHz application clock and a 264 MHz real-time core for deterministic tasks.
  • Multimedia and DSP Integrated multimedia co-processors including NEON and Hi-Fi4 DSP support advanced signal processing and media workloads; on-chip graphics acceleration enables rich visual interfaces.
  • Memory Interfaces Supports DDR3L SDRAM and LPDDR4 DRAM controllers for flexible memory configurations and high-bandwidth system memory.
  • Display and Camera Display interface controllers include LCD, LVDS, MIPI-CSI and MIPI-DSI to support a range of displays and camera inputs for HMI and vision applications.
  • High-Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and USB 2.0 OTG plus USB 3.0 OTG (each with PHY) provide robust wired networking and peripheral connectivity options.
  • Automotive/Field Buses and I/O Additional interfaces include CANbus and a variety of peripheral I/O to integrate with vehicle networks and industrial control systems.
  • Hardware Security On-chip security features include 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM and A-HAB, plus SNVS for secure boot and cryptographic operations.
  • Package and Mounting Supplied in a 609-FBGA (21×21) package case, intended for surface-mount assembly suitable for compact embedded boards.

Typical Applications

  • Industrial Automation – Real-time control and networking using Cortex-M4F for deterministic tasks and Cortex-A53 cores for application-level processing, with dual Gigabit Ethernet for connectivity.
  • Human-Machine Interfaces (HMI) – Graphics acceleration and multiple display interfaces (MIPI-DSI, LVDS, LCD) enable responsive, feature-rich operator panels.
  • Imaging and Vision Systems – MIPI-CSI camera interfaces and DSP/NEON acceleration support image capture and processing workflows.
  • Networking and Gateways – Dual Gigabit Ethernet, USB 3.0 OTG and security engines make the device suitable for secure edge gateways and communication appliances.

Unique Advantages

  • Balanced Multicore Performance: Combines high-performance Cortex-A53 cores with a Cortex-M4F real-time core to separate application and control tasks.
  • Integrated Multimedia and Graphics: NEON and Hi-Fi4 DSP plus graphics acceleration reduce the need for external accelerators in multimedia-rich designs.
  • Comprehensive Connectivity: Dual Gigabit Ethernet, USB 2.0/3.0 OTG with PHY and CANbus provide flexible options for networking and peripheral integration.
  • On-Chip Security Resources: Multiple hardware cryptographic modules and TrustZone support help implement secure boot and runtime protection without heavy external components.
  • Compact Package: 609-FBGA (21×21) surface-mount package enables high-density board designs while retaining extensive I/O.

Why Choose MIMX8QX5FVLFZAC?

The MIMX8QX5FVLFZAC is positioned for embedded designs that require a combination of multicore application performance, deterministic real-time control and broad interface integration. Its on-chip multimedia engines, secure cryptographic modules and multiple high-speed I/O options make it suitable for industrial HMI, imaging, networking and gateway applications.

Engineers and procurement teams can leverage the device’s integrated feature set and compact 609-FBGA package to reduce system BOM and streamline board-level integration, backed by available product documentation and datasheet resources.

Request a quote or submit a pricing inquiry to get availability and lead-time information for MIMX8QX5FVLFZAC.

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