MIMX8QX5GVLFZAC

I.MX 8X FIPS
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,947 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX5GVLFZAC – I.MX 8X FIPS

The MIMX8QX5GVLFZAC is a secure, industrial-grade microprocessor featuring heterogeneous ARM cores for balanced application and real‑time processing. It combines ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real‑time core in a 3‑core, 64‑bit configuration running up to 1.2 GHz (A53) and 264 MHz (M4F).

Designed for embedded industrial systems, this device targets connected multimedia, human‑machine interface and secure edge processing applications where integrated connectivity, hardware security engines and extended temperature operation are required.

Key Features

  • Core & Performance ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F co‑processor provide a 3‑core, 64‑bit architecture with the A‑cores at up to 1.2 GHz and the M4F at 264 MHz for real‑time tasks.
  • Memory Support Onboard memory controller support for DDR3L SDRAM and LPDDR4 DRAM allowing flexible system memory choices.
  • Display & Graphics Integrated graphics acceleration and multiple display controller interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI for rich HMI and camera applications.
  • High‑Speed Connectivity Dual Gigabit Ethernet ports (10/100/1000 Mbps), USB 3.0 OTG + PHY and USB 2.0 OTG + PHY provide robust wired networking and host/device connectivity.
  • Fieldbus & Vehicle Networks Native CANbus support for industrial control and field network integration.
  • Security Engines Hardware security features including 3DES, DES, MD5, SHA, A‑HAB, ARM TrustZone and CAAM to support secure boot, trusted execution and cryptographic operations.
  • Multimedia DSP Acceleration NEON and Hi‑Fi4 DSP co‑processor support for multimedia processing and optimized signal processing workloads.
  • Package & Mounting 609‑FBGA package (21×21 mm) in a surface‑mount form factor to enable compact board designs.
  • Industrial Qualification & Temperature Range Industrial qualification with operating temperature from −40 °C to 125 °C and RoHS compliance for deployment in demanding environments.

Typical Applications

  • Industrial Automation — Real‑time control and processing with CANbus and dual Gigabit Ethernet for factory and process automation systems.
  • Human‑Machine Interfaces (HMIs) — Graphics acceleration plus multiple display interfaces for advanced touch displays and operator panels.
  • Secure Edge Gateways — On‑chip cryptographic engines and ARM TrustZone support secure data handling and device authentication at the edge.
  • Media & Vision Systems — MIPI‑CSI camera input and DSP/NEON acceleration for embedded vision, multimedia processing and playback.

Unique Advantages

  • Heterogeneous processing: Combines high‑performance Cortex‑A53 cores with a Cortex‑M4F for deterministic real‑time tasks, enabling workload partitioning without external processors.
  • Comprehensive connectivity: Dual 1 Gb Ethernet, USB 3.0/2.0 OTG and CANbus reduce external bridging components and simplify system architecture.
  • Built‑in security: Multiple crypto engines (CAAM, A‑HAB, 3DES, SHA, MD5, DES) and TrustZone support enhance device integrity and secure boot capabilities.
  • Flexible memory options: Support for DDR3L and LPDDR4 gives designers choices for performance, power and cost tradeoffs.
  • Industrial robustness: Industrial qualification and −40 °C to 125 °C operation ensure reliable performance in harsh environments.
  • Compact packaging: 609‑FBGA (21×21) surface‑mount package permits dense board layouts for space‑constrained embedded systems.

Why Choose MIMX8QX5GVLFZAC?

This device positions performance, integration and security for industrial embedded designs that require multimedia, real‑time control and robust communications. Its combination of Cortex‑A53 and Cortex‑M4F cores, hardware security engines and broad I/O makes it suited to applications that must balance application throughput with deterministic control and secure operation.

For design teams targeting long‑lifecycle industrial products, the MIMX8QX5GVLFZAC offers a compact, secure and connectivity‑rich foundation that simplifies system integration while meeting extended temperature and industrial qualification requirements.

Request a quote or submit an inquiry to receive pricing, availability and assistance with your design requirements for the MIMX8QX5GVLFZAC.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up