MIMX8QX2FVOFZAC

I.MX 8QUADXPLUS 17X17
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17)

Quantity 908 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package417-FBGA (17x17)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case417-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz, 264MHz
Supplier Device Package417-FBGA (17×17)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX2FVOFZAC – I.MX 8QUADXPLUS 17X17

The MIMX8QX2FVOFZAC is a high-integration embedded microprocessor from NXP Semiconductors featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M4F cores. It delivers a 3‑core, 64‑bit architecture with a 1.2 GHz main processor and a 264 MHz real‑time MCU core, designed for embedded systems requiring multicore compute, multimedia acceleration and on‑chip security.

With a broad set of display, memory and high‑speed I/O options, this device targets embedded designs that need integrated connectivity, graphics capability and cryptographic features in a compact 417‑FBGA (17×17 mm) package.

Key Features

  • Core Architecture  ARM® Cortex®‑A53 application cores paired with an ARM® Cortex®‑M4F real‑time core; 3 cores total, 64‑bit processor operation at up to 1.2 GHz for application processing and 264 MHz for real‑time tasks.
  • Co‑processors and DSP  Multimedia acceleration including NEON and Hi‑Fi4 DSP capabilities for signal and media processing workloads.
  • Memory Interfaces  Support for DDR3L SDRAM and LPDDR4 DRAM memory controllers to match system memory performance and power requirements.
  • Display and Camera Interfaces  Integrated display interface controllers for LCD and LVDS, plus MIPI‑CSI and MIPI‑DSI for camera and display connectivity.
  • Ethernet and USB  Dual 10/100/1000 Mbps Ethernet ports and USB options including one USB 2.0 OTG + PHY and one USB 3.0 OTG + PHY for high‑bandwidth peripheral and network connectivity.
  • Security Features  On‑chip security primitives including 3DES, DES, SHA, MD5, ARM TrustedZone (ARM TZ), A‑HAB and CAAM to support secure boot and cryptographic services.
  • Package and Mounting  417‑FBGA (17×17 mm) supplier device package, designed for surface‑mount assembly in space‑constrained embedded designs.
  • Graphics Acceleration  Integrated graphics acceleration to support rich user interfaces and multimedia playback.

Typical Applications

  • Multimedia and HMI  Drives advanced user interfaces and multimedia playback using integrated graphics acceleration and display interfaces (LCD, LVDS, MIPI‑DSI).
  • Vision and Camera Systems  MIPI‑CSI support and DSP/NEON acceleration enable image processing and camera interface tasks in embedded vision applications.
  • Edge Networking and Gateways  Dual 1 Gb Ethernet and USB 3.0/2.0 OTG ports provide the connectivity needed for edge routers, industrial gateways and networked devices.
  • Real‑Time Control  The Cortex‑M4F core at 264 MHz supports deterministic control and real‑time peripheral management alongside application processing on the Cortex‑A53 cores.

Unique Advantages

  • Balanced Multicore Performance: Combines 64‑bit Cortex‑A53 cores for application processing with a Cortex‑M4F real‑time core for control tasks, enabling partitioned workloads on a single device.
  • Multimedia and DSP Capable: NEON and Hi‑Fi4 DSP support plus graphics acceleration simplify design of audio/visual and signal processing systems.
  • Flexible Memory Options: Compatible with DDR3L and LPDDR4 memory controllers to optimize for cost, performance or power in different designs.
  • Comprehensive Connectivity: Dual Gigabit Ethernet and USB 3.0/2.0 OTG interfaces provide high‑speed options for networking and peripheral expansion.
  • Integrated Security Building Blocks: Multiple cryptographic primitives and secure features (ARM TZ, CAAM, A‑HAB) help implement secure boot and data protection without external accelerators.
  • Compact High‑Density Package: 417‑FBGA (17×17 mm) keeps board footprint small while delivering extensive I/O and processing capability.

Why Choose MIMX8QX2FVOFZAC?

The MIMX8QX2FVOFZAC positions itself as a versatile embedded processing platform that combines multicore 64‑bit application processing with a real‑time MCU core, robust multimedia/DSP capabilities and extensive I/O. Its integrated security features, dual Gigabit Ethernet and modern USB interfaces make it well suited for embedded systems that require a blend of compute, connectivity and secure operation.

Backed by NXP Semiconductors, this device is appropriate for developers and engineers building compact, high‑function embedded products where integration, performance and security are key selection criteria.

Request a quote or submit your requirements to receive pricing and availability details for MIMX8QX2FVOFZAC. Our team can help evaluate part suitability for your embedded design and provide ordering information.

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