MIMX8QX2FVLFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 1,220 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | ||
| Speed | 1.2GHz, 264MHz | Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8QX2FVLFZAC – I.MX 8QUADXPLUS 21X21
The MIMX8QX2FVLFZAC is an i.MX 8QUADXPLUS series microprocessor from NXP Semiconductors featuring a 3‑core heterogeneous ARM architecture. It combines ARM® Cortex®‑A53 application cores with an ARM® Cortex®‑M4F real‑time core, delivering 64‑bit application processing at 1.2 GHz alongside a 264 MHz Cortex‑M4F for deterministic control tasks.
Designed for embedded systems that require multimedia acceleration, broad I/O connectivity and hardware security, this device provides integrated networking, display and USB interfaces plus on‑chip DSP/NEON acceleration to simplify system design and improve system performance and integration.
Key Features
- Core Architecture Three‑core, 64‑bit heterogeneous architecture combining ARM® Cortex®‑A53 application cores and an ARM® Cortex®‑M4F for real‑time tasks; A‑core frequency specified at 1.2 GHz and M4F at 264 MHz.
- Memory Support Integrated controllers supporting DDR3L SDRAM and LPDDR4 DRAM for flexible system memory configurations.
- Multimedia & DSP Multimedia accelerators with NEON and Hi‑Fi4 DSP support to handle signal processing and media workloads.
- Display Interfaces Multiple display controller interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI to drive diverse HMI and camera solutions.
- Networking Dual 10/100/1000 Mbps Ethernet ports for robust wired connectivity and high throughput networked applications.
- USB Connectivity On‑chip USB support including one USB 2.0 OTG + PHY and one USB 3.0 OTG + PHY for high‑speed peripheral and host options.
- Security Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM, A‑HAB and SNVS to support secure boot and runtime protection.
- Additional Interfaces Integrated CANbus support for industrial and control communications.
- Graphics Acceleration Graphics acceleration is available to offload GUI and rendering tasks from the main cores.
- Package & Mounting 609‑FBGA package (21×21 mm) in a surface‑mount form factor; RoHS compliant.
Typical Applications
- Embedded HMI and Multimedia Use the Cortex‑A53 cores, graphics acceleration and MIPI/LVDS/LCD display interfaces to implement rich user interfaces and multimedia playback.
- Industrial Control & Connectivity Leverage the Cortex‑M4F core for real‑time control and CANbus plus dual Gigabit Ethernet for industrial networking.
- Edge Networking and Gateways Dual 1 Gb Ethernet ports and USB 3.0 OTG support high‑bandwidth edge processing and interfacing for gateway devices.
Unique Advantages
- Heterogeneous Processing Combines high‑performance 64‑bit application cores with a real‑time M4F core to separate application and control workloads efficiently.
- Integrated Multimedia Acceleration NEON and Hi‑Fi4 DSP resources reduce CPU load for signal processing and multimedia tasks, simplifying software partitioning.
- Broad I/O Integration Extensive display, USB, Ethernet and CAN interfaces reduce the need for external bridge chips and lower BOM complexity.
- Hardware Security Primitives Built‑in cryptographic engines and secure boot features support implementation of secure systems and trusted applications.
- Flexible Memory Options Support for DDR3L and LPDDR4 memory types enables designers to optimize cost, power and performance trade‑offs.
- Compact Surface‑Mount Package 609‑FBGA (21×21) provides a high‑density package for space‑constrained embedded designs while remaining RoHS compliant.
Why Choose MIMX8QX2FVLFZAC?
The MIMX8QX2FVLFZAC positions itself as a balanced platform for embedded designs that need a mix of application performance, real‑time control and rich I/O. Its combination of ARM® Cortex®‑A53 and Cortex‑M4F cores, integrated multimedia/DSP acceleration and comprehensive interfaces (Ethernet, USB, display and CAN) makes it suitable for complex HMI, industrial and edge networking applications.
Choosing this part provides designers with a highly integrated silicon foundation—reducing external component count while delivering security primitives and multiple memory options to support scalable, robust product implementations.
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