MIMX8QX2FVLFZAC

I.MX 8QUADXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,220 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX2FVLFZAC – I.MX 8QUADXPLUS 21X21

The MIMX8QX2FVLFZAC is an i.MX 8QUADXPLUS series microprocessor from NXP Semiconductors featuring a 3‑core heterogeneous ARM architecture. It combines ARM® Cortex®‑A53 application cores with an ARM® Cortex®‑M4F real‑time core, delivering 64‑bit application processing at 1.2 GHz alongside a 264 MHz Cortex‑M4F for deterministic control tasks.

Designed for embedded systems that require multimedia acceleration, broad I/O connectivity and hardware security, this device provides integrated networking, display and USB interfaces plus on‑chip DSP/NEON acceleration to simplify system design and improve system performance and integration.

Key Features

  • Core Architecture  Three‑core, 64‑bit heterogeneous architecture combining ARM® Cortex®‑A53 application cores and an ARM® Cortex®‑M4F for real‑time tasks; A‑core frequency specified at 1.2 GHz and M4F at 264 MHz.
  • Memory Support  Integrated controllers supporting DDR3L SDRAM and LPDDR4 DRAM for flexible system memory configurations.
  • Multimedia & DSP  Multimedia accelerators with NEON and Hi‑Fi4 DSP support to handle signal processing and media workloads.
  • Display Interfaces  Multiple display controller interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI to drive diverse HMI and camera solutions.
  • Networking  Dual 10/100/1000 Mbps Ethernet ports for robust wired connectivity and high throughput networked applications.
  • USB Connectivity  On‑chip USB support including one USB 2.0 OTG + PHY and one USB 3.0 OTG + PHY for high‑speed peripheral and host options.
  • Security  Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM, A‑HAB and SNVS to support secure boot and runtime protection.
  • Additional Interfaces  Integrated CANbus support for industrial and control communications.
  • Graphics Acceleration  Graphics acceleration is available to offload GUI and rendering tasks from the main cores.
  • Package & Mounting  609‑FBGA package (21×21 mm) in a surface‑mount form factor; RoHS compliant.

Typical Applications

  • Embedded HMI and Multimedia  Use the Cortex‑A53 cores, graphics acceleration and MIPI/LVDS/LCD display interfaces to implement rich user interfaces and multimedia playback.
  • Industrial Control & Connectivity  Leverage the Cortex‑M4F core for real‑time control and CANbus plus dual Gigabit Ethernet for industrial networking.
  • Edge Networking and Gateways  Dual 1 Gb Ethernet ports and USB 3.0 OTG support high‑bandwidth edge processing and interfacing for gateway devices.

Unique Advantages

  • Heterogeneous Processing  Combines high‑performance 64‑bit application cores with a real‑time M4F core to separate application and control workloads efficiently.
  • Integrated Multimedia Acceleration  NEON and Hi‑Fi4 DSP resources reduce CPU load for signal processing and multimedia tasks, simplifying software partitioning.
  • Broad I/O Integration  Extensive display, USB, Ethernet and CAN interfaces reduce the need for external bridge chips and lower BOM complexity.
  • Hardware Security Primitives  Built‑in cryptographic engines and secure boot features support implementation of secure systems and trusted applications.
  • Flexible Memory Options  Support for DDR3L and LPDDR4 memory types enables designers to optimize cost, power and performance trade‑offs.
  • Compact Surface‑Mount Package  609‑FBGA (21×21) provides a high‑density package for space‑constrained embedded designs while remaining RoHS compliant.

Why Choose MIMX8QX2FVLFZAC?

The MIMX8QX2FVLFZAC positions itself as a balanced platform for embedded designs that need a mix of application performance, real‑time control and rich I/O. Its combination of ARM® Cortex®‑A53 and Cortex‑M4F cores, integrated multimedia/DSP acceleration and comprehensive interfaces (Ethernet, USB, display and CAN) makes it suitable for complex HMI, industrial and edge networking applications.

Choosing this part provides designers with a highly integrated silicon foundation—reducing external component count while delivering security primitives and multiple memory options to support scalable, robust product implementations.

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