MIMX8QX6FVLFZAC

I.MX 8QUADXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 36 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8QX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8QX6FVLFZAC – I.MX 8QUADXPLUS 21X21

The MIMX8QX6FVLFZAC is a high-integration embedded microprocessor featuring ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real-time core. The device provides a 3-core, 64-bit architecture with Cortex‑A53 cores running at 1.2 GHz and a Cortex‑M4F at 264 MHz, delivering a balanced mix of application performance and real-time control for embedded systems.

Designed for connected, multimedia-rich embedded applications, the part combines multimedia acceleration, extensive I/O and wired networking, and on-chip security features to simplify system design and speed time-to-market.

Key Features

  • Core Architecture  ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F co‑processor provide a 3‑core, 64‑bit heterogeneous processing configuration with a 1.2 GHz A‑core speed and 264 MHz M4F real‑time core.
  • Media and DSP Acceleration  Integrated multimedia engines and co‑processors including NEON and Hi‑Fi4 DSP support accelerated signal and media processing workloads. Graphics acceleration is supported.
  • Memory Interfaces  Supports DDR3L SDRAM and LPDDR4 DRAM memory controllers for flexible memory subsystem options.
  • Display and Vision I/O  Display and camera interfaces include LCD, LVDS, MIPI‑CSI and MIPI‑DSI to support user interfaces and vision subsystems.
  • High‑speed Connectivity  Dual 10/100/1000 Mbps Ethernet ports plus USB connectivity (USB 2.0 OTG + PHY and USB 3.0 OTG + PHY) enable high‑bandwidth wired networking and peripheral connectivity.
  • Safety and Security  On‑chip security features include 3DES, A‑HAB, ARM TrustZone (ARM TZ), CAAM, DES, MD5, SHA and SNVS for device and data protection.
  • Peripheral and Field Interfaces  Additional interfaces include CANbus support for fieldbus and control networks alongside other common embedded peripherals.
  • Package and Mounting  Supplied in a 609‑FBGA package (21 × 21 mm) for surface‑mount assembly, suitable for compact embedded boards.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Automation  Use the combination of real‑time Cortex‑M4F and application Cortex‑A53 cores for control logic, protocol handling and local HMI processing.
  • Human‑Machine Interfaces (HMI)  LCD, LVDS and MIPI‑DSI support enable rich graphical interfaces for operator panels and control displays.
  • Vision and Camera Systems  MIPI‑CSI and multimedia accelerators support image capture and on‑device preprocessing for embedded vision tasks.
  • Edge Gateways and Networking Appliances  Dual Gigabit Ethernet and USB 3.0/2.0 enable high‑throughput wired connectivity for industrial gateways and edge compute nodes.

Unique Advantages

  • Heterogeneous processing mix  Combines 64‑bit Cortex‑A53 performance with a dedicated Cortex‑M4F real‑time core for concurrent application and control tasks, reducing the need for separate MCUs.
  • Integrated multimedia and DSP engines  NEON and Hi‑Fi4 DSP support lower CPU load for audio/video and signal processing functions, simplifying BOM and software partitioning.
  • Comprehensive connectivity  Dual Gigabit Ethernet plus USB 3.0 and USB 2.0 expand options for high‑bandwidth peripherals and networked deployments.
  • On‑chip security primitives  Multiple cryptographic and secure boot features provide building blocks for protecting firmware and data at the device level.
  • Compact, manufacturable package  609‑FBGA (21×21 mm) surface‑mount package supports dense PCB designs while remaining assembly‑friendly.
  • RoHS compliance  Meets standard environmental requirements for lead‑free manufacturing.

Why Choose MIMX8QX6FVLFZAC?

The MIMX8QX6FVLFZAC positions itself as a versatile embedded processor that balances compute performance, real‑time control and rich I/O in a single device. Its combination of ARM® Cortex®‑A53 application cores, a Cortex®‑M4F real‑time core, multimedia/DSP acceleration, wired networking and robust security primitives makes it suitable for complex embedded systems that require integrated multimedia, connectivity and control.

This part is well suited to designers building industrial and embedded products that require a compact package, broad peripheral set and hardware security features, offering a pathway to scalable, maintainable designs with a reduced component count.

Request a quote or submit a pricing inquiry to evaluate MIMX8QX6FVLFZAC for your next embedded design. Our team can provide lead‑time and availability details to support your project planning.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up