MIMX8QP6AVUFFAB
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F Microprocessor IC i.MX8Q 7 Core, 64-Bit 1.6GHz, 1.26GHz, 266MHz 1313-FCPBGA (29x29) |
|---|---|
| Quantity | 32 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8QP |
| Manufacturer | NXP Semiconductors |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 0 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F | Device Package | 1313-FCPBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 1Gbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 7 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 1313-BBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS | ||
| Speed | 1.6GHz, 1.26GHz, 266MHz | Supplier Device Package | 1313-FCPBGA (29×29) | USB | USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8QP6AVUFFAB – IC MPU I.MX8Q 266MHZ 1313FCPBGA
The MIMX8QP6AVUFFAB is a high-integration microprocessor from NXP Semiconductors' i.MX 8QP series. It combines heterogeneous ARM cores—ARM Cortex-A53, ARM Cortex-A72 and Arm Cortex-M4F—across a 7‑core, 64‑bit architecture with core clocks up to 1.6 GHz to address demanding embedded workloads.
Designed for industrial embedded applications, this device delivers a broad set of interfaces, multimedia acceleration and on-chip security features to support networked, display-driven and multimedia systems operating across a wide temperature range.
Key Features
- Heterogeneous CPU Cluster ARM Cortex‑A53, ARM Cortex‑A72 and Arm Cortex‑M4F cores in a 7‑core, 64‑bit configuration with core frequencies listed up to 1.6 GHz and subordinate clocks of 1.26 GHz and 266 MHz for mixed-performance tasks.
- Memory Support Integrated LPDDR4 memory controller for high-bandwidth system memory.
- Multimedia and DSP Multimedia DSP and NEON support plus graphics acceleration to handle visual and compute workloads.
- Display and Imaging Interfaces Multiple display and camera interfaces including DisplayPort (DP), eDP, HDMI, LVDS, MIPI‑CSI and MIPI‑DSI for flexible HMI and vision system designs.
- High‑speed Connectivity Dual 1 Gbps Ethernet interfaces and a mix of USB ports—USB 3.0 with PHY, USB 2.0 with PHY and USB 2.0 + HSIC—enable robust network and peripheral connectivity.
- Vehicle/Field Bus and Peripheral I/O CANbus support and a broad set of additional interfaces for industrial device integration.
- Security and System Integrity On-chip security features including A‑HAB, ARM TrustZone, CAAM, eFuse, true random number generator, secure memory, secure RTC, System JTAG and SNVS for hardware-rooted security.
- Package and Mounting 1313‑FCPBGA (29×29) package, 1313‑BBGA FCBGA case type, intended for surface‑mount assembly.
- Industrial Temperature Range Qualified for operation from ‑40 °C to 125 °C to meet industrial environment requirements.
Typical Applications
- Industrial Automation Use as the central processor in control systems and HMI units where industrial temperature range and broad I/O are required.
- Human‑Machine Interfaces (HMI) Drive high‑resolution displays and touch panels using HDMI, eDP, LVDS or MIPI‑DSI interfaces with on‑chip graphics acceleration.
- Vision and Multimedia Processing Leverage MIPI‑CSI, multimedia DSP and NEON support for camera input, image processing and media playback applications.
- Networked Embedded Systems Integrate dual 1 Gbps Ethernet, USB 3.0 and CANbus connectivity for industrial gateways, edge controllers and networked devices.
Unique Advantages
- Heterogeneous multi‑core performance: Combination of Cortex‑A72, A53 and M4F cores provides scalable performance for mixed workloads and real‑time tasks.
- Comprehensive display and camera support: Multiple display outputs and MIPI‑CSI support simplify design of advanced HMIs and vision systems.
- Robust industrial qualification: Rated for ‑40 °C to 125 °C operation to withstand harsh industrial environments.
- Extensive security stack: Hardware security primitives and secure subsystem features support secure boot and runtime protection strategies.
- Broad connectivity suite: Dual GbE, USB 3.0/2.0 options and CANbus enable flexible integration into networked and fielded systems.
- Surface‑mount FCBGA package: 1313‑FCPBGA (29×29) package supports high pin count and dense integration for compact embedded boards.
Why Choose MIMX8QP6AVUFFAB?
The MIMX8QP6AVUFFAB positions itself as a highly integrated, industrial‑qualified processor well suited to embedded designs that demand mixed‑performance compute, advanced multimedia, and strong connectivity. Its heterogeneous CPU cluster, LPDDR4 support and hardware security features provide a balanced platform for both compute‑intensive and real‑time subsystems.
Engineers designing industrial HMIs, vision systems, networked controllers or edge appliances will find the combination of display interfaces, dual Gigabit Ethernet, USB 3.0 and CANbus support advantageous for reducing external components while meeting temperature and security requirements.
Request a quote or submit an inquiry to start a purchase discussion for the MIMX8QP6AVUFFAB and evaluate how its integration and industrial qualification align with your embedded design requirements.

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