Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DSPIC33FJ64MC804T-I/PT
DSPIC33FJ64MC804T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b; D/A 6x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
369
E-L9637D
E-L9637DSTMicroelectronicsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 36V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 150°C
Grade:
Automotive
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
720
E-L9637D013TR
E-L9637D013TRSTMicroelectronicsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 36V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 150°C
Grade:
Automotive
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
287
E-ST10F269-DPN/AE-ST10F269-DPSTMicroelectronicsIC MCU 16BIT 256KB FLASH 144QFPMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-QFP
401
E-ST10F269-DPTRN/AE-ST10F269-DPTRSTMicroelectronicsIC MCU 16BIT 256KB FLASH 144QFPMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-QFP
578
E-ST10F269-DPTXN/AE-ST10F269-DPTXSTMicroelectronicsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
289
E-ST10F269DT3N/AE-ST10F269DT3STMicroelectronicsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 125°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
470
E-ST10F269DTR3N/AE-ST10F269DTR3STMicroelectronicsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 125°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,148
E-ST10F269DTX3N/AE-ST10F269DTX3STMicroelectronicsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ST10
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
845
E-ST7538P
E-ST7538PSTMicroelectronicsIC TRANSCEIVER HALF 1/1 44TQFPDrivers, Receivers, Transceivers44-TQFP (10x10)4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Number of Drivers/Receivers:
1/1
Duplex:
Half
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
44-LQFP Exposed Pad
Supplier Device Package:
44-TQFP (10×10)
309
E-STE100P
E-STE100PSTMicroelectronicsIC TRANSCEIVER HALF 1/1 64TQFPDrivers, Receivers, Transceivers64-TQFP (10x10)3.15V ~ 3.45V-40°C ~ 85°C
Type:
Transceiver
Protocol:
MII
Number of Drivers/Receivers:
1/1
Duplex:
Half
Voltage – Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
Supplier Device Package:
64-TQFP (10×10)
1,649
N/AEDFB164A1MA-GD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
512M x 64
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,384
N/AEDFB164A1MA-GD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
512M x 64
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
941
N/AEDFB164A1MA-JD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
512M x 64
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
313
N/AEDFB164A1MA-JD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
512M x 64
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
166
N/AEDFB232A1MA-GD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,462
N/AEDFB232A1MA-GD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
57
N/AEDFB232A1MA-JD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,004
N/AEDFB232A1MA-JD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZMemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,534
EE80C186XL20
EE80C186XL20IntelIC MPU I186 20MHZ 68PLCCMicroprocessors68-PLCCN/A0°C ~ 70°C (TA)
Core Processor:
80C186
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
20MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC
72

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up