EDFB164A1MA-GD-F-R TR
| Part Description |
IC DRAM 32GBIT PARALLEL 800MHZ |
|---|---|
| Quantity | 1,328 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial (Extended) | ||
| Clock Frequency | 800 MHz | Voltage | 1.14V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of EDFB164A1MA-GD-F-R TR – IC DRAM 32Gbit Parallel 800 MHz
The EDFB164A1MA-GD-F-R TR is a 32 Gbit volatile DRAM device manufactured by Micron Technology Inc., implemented using SDRAM - Mobile LPDDR3 architecture. It provides a 512M × 64 memory organization with a parallel memory interface and an 800 MHz clock frequency.
This device is intended for designs that require high-density, parallel DRAM memory with support for Mobile LPDDR3 technology and an operating voltage range of 1.14 V to 1.95 V and an ambient temperature range of -30°C to 85°C.
Key Features
- Core / Technology Implemented as SDRAM - Mobile LPDDR3 architecture suitable for systems specifying LPDDR3 memory technology.
- Memory Capacity & Organization 32 Gbit total capacity organized as 512M × 64 for high-density volatile storage.
- Clock Frequency Rated for an 800 MHz clock frequency to meet designs targeting that memory clock.
- Memory Interface Parallel memory interface for integration into parallel DRAM subsystems.
- Voltage Supply Operating supply range from 1.14 V to 1.95 V to accommodate different system operating points.
- Operating Temperature Specified ambient operating range of -30°C to 85°C (TA).
- Memory Type Volatile DRAM device intended for temporary data storage in system memory subsystems.
Typical Applications
- Mobile & Portable Devices — Memory implementations that require Mobile LPDDR3 SDRAM technology and high-density parallel DRAM.
- Embedded Systems — Systems needing 32 Gbit volatile memory with a parallel interface and specified operating temperature and voltage ranges.
- Memory Subsystems — Design of high-capacity parallel DRAM modules or memory boards where a 512M × 64 organization is required.
Unique Advantages
- High density 32 Gbit capacity: Enables compact designs that require large volatile memory space using a 512M × 64 organization.
- 800 MHz clock support: Provides a defined memory clock rate for systems designed around that frequency.
- Mobile LPDDR3 architecture: Conforms to SDRAM - Mobile LPDDR3 technology for applications specifying that memory type.
- Wide supply voltage range: Operates from 1.14 V to 1.95 V to support varying system power rails.
- Extended ambient temperature range: Rated for -30°C to 85°C (TA) for use across a broad set of environmental conditions.
- Parallel interface compatibility: Direct integration into parallel DRAM designs and memory subsystems.
Why Choose IC DRAM 32GBIT PARALLEL 800MHZ?
The EDFB164A1MA-GD-F-R TR positions itself as a high-density Mobile LPDDR3 SDRAM device offering a clear set of electrical and environmental specifications: 32 Gbit capacity (512M × 64), 800 MHz clock frequency, parallel interface, 1.14 V–1.95 V supply range, and -30°C to 85°C ambient rating. These defined parameters make it suitable for engineers specifying LPDDR3 memory for high-capacity, parallel DRAM implementations.
Produced by Micron Technology Inc., this device is appropriate for designs and procurement that require documented capacity, clocking, interface type, and operating limits. Its specification-driven profile supports predictable integration into memory subsystems and embedded platforms.
To request a quote or inquire about availability and lead times for the EDFB164A1MA-GD-F-R TR, please submit a quote request or contact sales for further assistance.
