EDFB164A1MA-JD-F-D
| Part Description |
IC DRAM 32GBIT PARALLEL 933MHZ |
|---|---|
| Quantity | 512 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial (Extended) | ||
| Clock Frequency | 933 MHz | Voltage | 1.14V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of EDFB164A1MA-JD-F-D – IC DRAM 32GBIT PARALLEL 933MHZ
The EDFB164A1MA-JD-F-D is a 32 Gbit volatile DRAM device implementing Mobile LPDDR3 SDRAM architecture. It provides a parallel memory interface with a 512M × 64 organization and a 933 MHz clock frequency for high-density memory requirements.
This device targets system designs that require a 32 Gbit parallel DRAM solution with low-voltage operation and a broad operating temperature range.
Key Features
- Memory Type & Technology Volatile DRAM implemented as SDRAM - Mobile LPDDR3 for mobile LPDDR3 memory architectures.
- Capacity & Organization 32 Gbit total capacity organized as 512M × 64 to support wide-data parallel memory buses.
- Clock Frequency 933 MHz clock frequency to support high-throughput parallel memory access patterns.
- Interface Parallel memory interface suitable for systems that use parallel DRAM connectivity.
- Power Operates across a voltage supply range of 1.14 V–1.95 V to accommodate low-voltage system designs.
- Operating Temperature Rated for ambient operating temperatures from -30°C to 85°C (TA) to support a wide range of environmental conditions.
- Memory Format DRAM format intended for high-density, transient storage in electronic systems.
Typical Applications
- Mobile memory subsystems Integration where Mobile LPDDR3 SDRAM is required for parallel memory architectures.
- High-density memory modules Use in designs that need 32 Gbit capacity with 512M × 64 organization to provide wide data paths.
- Embedded systems with wide operating range Systems that require operation from -30°C to 85°C and support low-voltage memory supplies.
Unique Advantages
- High capacity: 32 Gbit density provides substantial memory for data buffering and transient storage.
- Wide-data organization: 512M × 64 organization supports 64-bit parallel data transfers for bus-efficient designs.
- High clock rate: 933 MHz clock frequency enables higher throughput for parallel memory access.
- Low-voltage operation: 1.14 V–1.95 V supply range supports power-sensitive designs and varied system rails.
- Broad temperature tolerance: -30°C to 85°C (TA) rating suits designs deployed across a range of ambient conditions.
Why Choose EDFB164A1MA-JD-F-D?
The EDFB164A1MA-JD-F-D combines a high 32 Gbit capacity with a 512M × 64 organization and a 933 MHz clock to deliver a parallel LPDDR3 SDRAM solution suitable for designs that need substantial, wide-path transient memory. Its low-voltage supply range and extended operating temperature window make it a practical choice for systems requiring both energy-aware operation and environmental robustness.
This device is appropriate for engineers and procurement teams specifying high-density parallel DRAM in mobile LPDDR3-based memory subsystems, embedded platforms, and memory modules where the listed electrical and environmental characteristics align with system requirements.
Please request a quote or contact sales to discuss availability, lead times, and pricing for EDFB164A1MA-JD-F-D.