EDFB164A1MA-JD-F-D

IC DRAM 32GBIT PARALLEL 933MHZ
Part Description

IC DRAM 32GBIT PARALLEL 933MHZ

Quantity 512 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR3
Memory Size32 GbitAccess TimeN/AGradeCommercial (Extended)
Clock Frequency933 MHzVoltage1.14V ~ 1.95VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TA)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceParallelMemory Organization512M x 64
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of EDFB164A1MA-JD-F-D – IC DRAM 32GBIT PARALLEL 933MHZ

The EDFB164A1MA-JD-F-D is a 32 Gbit volatile DRAM device implementing Mobile LPDDR3 SDRAM architecture. It provides a parallel memory interface with a 512M × 64 organization and a 933 MHz clock frequency for high-density memory requirements.

This device targets system designs that require a 32 Gbit parallel DRAM solution with low-voltage operation and a broad operating temperature range.

Key Features

  • Memory Type & Technology  Volatile DRAM implemented as SDRAM - Mobile LPDDR3 for mobile LPDDR3 memory architectures.
  • Capacity & Organization  32 Gbit total capacity organized as 512M × 64 to support wide-data parallel memory buses.
  • Clock Frequency  933 MHz clock frequency to support high-throughput parallel memory access patterns.
  • Interface  Parallel memory interface suitable for systems that use parallel DRAM connectivity.
  • Power  Operates across a voltage supply range of 1.14 V–1.95 V to accommodate low-voltage system designs.
  • Operating Temperature  Rated for ambient operating temperatures from -30°C to 85°C (TA) to support a wide range of environmental conditions.
  • Memory Format  DRAM format intended for high-density, transient storage in electronic systems.

Typical Applications

  • Mobile memory subsystems  Integration where Mobile LPDDR3 SDRAM is required for parallel memory architectures.
  • High-density memory modules  Use in designs that need 32 Gbit capacity with 512M × 64 organization to provide wide data paths.
  • Embedded systems with wide operating range  Systems that require operation from -30°C to 85°C and support low-voltage memory supplies.

Unique Advantages

  • High capacity:  32 Gbit density provides substantial memory for data buffering and transient storage.
  • Wide-data organization:  512M × 64 organization supports 64-bit parallel data transfers for bus-efficient designs.
  • High clock rate:  933 MHz clock frequency enables higher throughput for parallel memory access.
  • Low-voltage operation:  1.14 V–1.95 V supply range supports power-sensitive designs and varied system rails.
  • Broad temperature tolerance:  -30°C to 85°C (TA) rating suits designs deployed across a range of ambient conditions.

Why Choose EDFB164A1MA-JD-F-D?

The EDFB164A1MA-JD-F-D combines a high 32 Gbit capacity with a 512M × 64 organization and a 933 MHz clock to deliver a parallel LPDDR3 SDRAM solution suitable for designs that need substantial, wide-path transient memory. Its low-voltage supply range and extended operating temperature window make it a practical choice for systems requiring both energy-aware operation and environmental robustness.

This device is appropriate for engineers and procurement teams specifying high-density parallel DRAM in mobile LPDDR3-based memory subsystems, embedded platforms, and memory modules where the listed electrical and environmental characteristics align with system requirements.

Please request a quote or contact sales to discuss availability, lead times, and pricing for EDFB164A1MA-JD-F-D.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up