| N/A | | F28P650SH7NMRR | Texas Instruments | C2000 32-BIT MCU, 400 MIPS, 1XC2 | Microcontrollers | N/A | N/A | N/A | N/A | 68 | |
| N/A | N/A | F28P650SH7PTP | Texas Instruments | C2000 32-bit MCU, 400 MIPS | Microcontrollers | 176-HLQFP (24x24) | 2.8V - 3.63V | -40°C – 125°C | Program Memory Size: 768KB (768K x 8) Mounting Type: Surface Mount | 239 | |
| N/A | N/A | F28P650SH7ZEJR | Texas Instruments | C2000 32-bit MCU, 400 MIPS | Microcontrollers | 256-NFBGA (13x13) | 2.8V - 3.63V | -40°C – 125°C | Program Memory Size: 768KB (768K x 8) Mounting Type: Surface Mount | 1,240 | |
| N/A | | F28P650SK6NMRR | Texas Instruments | C2000 32-BIT MCU, 400 MIPS, 1XC2 | Microcontrollers | N/A | N/A | N/A | N/A | 330 | |
| N/A | N/A | F28P650SK6PTP | Texas Instruments | C2000 32-bit MCU, 400 MIPS | Microcontrollers | 176-HLQFP (24x24) | 2.8V - 3.63V | -40°C – 125°C | Program Memory Size: 1.28MB (1.28M x 8) Mounting Type: Surface Mount | 132 | |
| N/A | | F28P650SK7NMRR | Texas Instruments | C2000 32-BIT MCU, 400 MIPS, 1XC2 | Microcontrollers | N/A | N/A | N/A | N/A | 1,365 | |
| N/A | N/A | F28P650SK7PTP | Texas Instruments | C2000 32-bit MCU, 400 MIPS, 1xC2 | Microcontrollers | 176-HLQFP (24x24) | 2.8V - 3.63V | -40°C – 125°C | Program Memory Size: 1.28MB (1.28M x 8) Mounting Type: Surface Mount | 1,118 | |
 | N/A | F28P659DK8PTPQ1 | Texas Instruments | C2000 32-bit MCU, 2x C28x+CLA | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, SCI, SPI, UART/USART, USB Peripherals: AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1.28MB (1.28M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.8V ~ 3.63V Data Converters: A/D 36×12/16b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 841 | |
 | | F28P659DK8PZPQ1 | Texas Instruments | C2000 32-bit MCU, 2x C28x+CLA | Microcontrollers | 100-HTQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, SCI, SPI, UART/USART, USB Peripherals: AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1.28MB (1.28M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.8V ~ 3.63V Data Converters: A/D 24×12/16b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14×14) Package / Case: 100-TQFP Exposed Pad | 1,204 | |
| N/A | N/A | F28P659DK8PZPRQ1 | Texas Instruments | C2000 32-bit MCU, 2x C28x+CLA C | Microcontrollers | 100-HTQFP (14x14) | 2.8V - 3.63V | -40°C – 125°C | Core Size: 32-Bit Dual-Core Program Memory Size: 1.28MB (1.28M x 8) Mounting Type: Surface Mount | 762 | |
| N/A | | F28P659DK8ZEJQ1 | Texas Instruments | C2000 32-BIT MCU, 2X C28X+CLA CP | Microcontrollers | 256-NFBGA (13x13) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, SCI, SPI, UART/USART, USB Peripherals: AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1.28MB (1.28M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.8V ~ 3.63V Data Converters: A/D 40×12/16b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-NFBGA (13×13) | 133 | |
| N/A | | F28P659DK8ZEJRQ1 | Texas Instruments | C2000 32-BIT MCU, 2X C28X+CLA CP | Microcontrollers | 256-NFBGA (13x13) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, SCI, SPI, UART/USART, USB Peripherals: AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1.28MB (1.28M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.8V ~ 3.63V Data Converters: A/D 40×12/16b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-NFBGA (13×13) | 8 | |
| N/A | | F505CA4EMCANP | Infineon Technologies | IC MCU 8BIT 32KB OTP 44MQFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.25V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) | 1,468 | |
| N/A | | F505CALMCANP | Infineon Technologies | IC MCU 8BIT ROMLESS 44MQFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.25V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) | 1,611 | |
 | | F505CALMCAXP | Infineon Technologies | IC MCU 8BIT ROMLESS 44MQFP | Microcontrollers | PG-MQFP-44-2 | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.25V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-MQFP-44-2 | 1,497 | |
| N/A | N/A | F50D1G41LB (2M) | ESMT | 1Gb NAND Flash Auto. | Flash Memory | 8-contact WSON | 2.5V | -40°C – 105°C | Write Cycle Time Word Page: 900 µs Memory Organization: 128M x 8 Memory Interface: Parallel | 925 | |
| N/A | | F50D1G41LB-IP(2M) | ESMT | 1Gb SPI NAND Flash Ind. | Flash Memory | 8-contact WSON | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 900 µs Memory Organization: 128M x 8 Memory Interface: Parallel | 584 | |
| N/A | | F50D1G41LC (2P) | ESMT | 1Gb SPI NAND Flash Ind. | Flash Memory | 8-contact WSON | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 900 µs Memory Organization: 1G x 8 Memory Interface: Parallel | 234 | |
| N/A | | F50D2G41KA(2V) | ESMT | 2Gb SPI NAND Flash Ind. | Flash Memory | 8-contact WSON | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 600 µs Memory Organization: 256M x 8 Memory Interface: Parallel | 1,533 | |
| N/A | N/A | F50D2G41KA2V | ESMT | 2Gb SPI NAND Flash Auto. | Flash Memory | 8-contact WSON | 2.5V | -40°C – 105°C | Write Cycle Time Word Page: 600 µs Memory Organization: 256M x 8 Memory Interface: Parallel | 1,839 | |