Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
FEMC032GCA-E540FEMC032GCA-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 3
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 3
307
FEMC032GCA-T740FEMC032GCA-T740FlexxonXTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 3
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 3
823
FEMC032GCB-E530FEMC032GCB-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
100-FBGA
Qualification:
AEC-Q100 Grade 2
656
FEMC032GCB-E540FEMC032GCB-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 2
882
FEMC032GCB-T740FEMC032GCB-T740FlexxonXTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 105°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 2
841
FEMC032GCE-E530FEMC032GCE-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
100-FBGA
Qualification:
N/A
834
FEMC032GCE-E540FEMC032GCE-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
153-FBGA
Qualification:
N/A
510
FEMC032GCE-T740FEMC032GCE-T740FlexxonXTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
153-FBGA
Qualification:
N/A
617
FEMC032GCG-E530FEMC032GCG-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
100-FBGA
Qualification:
N/A
837
FEMC032GCG-E540FEMC032GCG-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
153-FBGA
Qualification:
N/A
497
FEMC032GCG-T34NFEMC032GCG-T34NFlexxonXTRA V 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D pSLC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1 / 4.x
Grade:
Industrial
Packaging:
153-FBGA
Qualification:
N/A
278
FEMC064G-M11FEMC064G-M11FlexxonECON II 5.1 153ball eMMC (3D TLC/MLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Commercial
Packaging:
153-FBGA
Qualification:
N/A
341
FEMC064GBA-E530FEMC064GBA-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 3
Packaging:
100-FBGA
Qualification:
AEC-Q100 Grade 3
832
FEMC064GBA-E540FEMC064GBA-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 3
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 3
325
FEMC064GBA-T740FEMC064GBA-T740FlexxonXTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 3
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 3
691
FEMC064GBB-E530FEMC064GBB-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
100-FBGA
Qualification:
AEC-Q100 Grade 2
533
FEMC064GBB-E540FEMC064GBB-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 105°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 2
84
FEMC064GBB-T740FEMC064GBB-T740FlexxonXTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-40°C - 105°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Automotive grade 2
Packaging:
153-FBGA
Qualification:
AEC-Q100 Grade 2
1,556
FEMC064GBE-E530FEMC064GBE-E530FlexxonAXO 5.1 100ball eMMC (3D TLC/3D pSLC)Memory100-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
100-FBGA
Qualification:
N/A
311
FEMC064GBE-E540FEMC064GBE-E540FlexxonAXO 5.1 153ball eMMC (3D TLC/3D pSLC)Memory153-FBGAVCCQ: 1.8V/3.3V VCC: 3.3V-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
200 MHz
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Packaging:
153-FBGA
Qualification:
N/A
1,179

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