Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
P1022NSN2MHBP1022NSN2MHBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
245
P1022NXE2EFBP1022NXE2EFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
250
P1022NXE2HFBP1022NXE2HFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
108
P1022NXE2LFBP1022NXE2LFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
375
P1022NXN2EFBP1022NXN2EFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
563
P1022NXN2HFBP1022NXN2HFBNXP SemiconductorsIC MPU QORIQ P1 1.055GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.055GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,728
P1022NXN2LFBP1022NXN2LFBNXP SemiconductorsIC MPU QORIQ P1 1.067GHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
1,255
N/AP1023NSN5CFBNXP SemiconductorsIC MPU QORIQ P1 500MHZ 457TEPBGAMicroprocessors457-TEPBGA-1 (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
457-FBGA
Supplier Device Package:
457-TEPBGA-1 (19×19)
1,020
N/AP1023NXE5CFBNXP SemiconductorsIC MPU 500MHZ 457TEPBGAMicroprocessors457-TEPBGA I (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
Security; SEC 4.2
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
3DES, AES, DES, RNG
Mounting Type:
Surface Mount
Package / Case:
457-FBGA
Supplier Device Package:
457-TEPBGA I (19×19)
197
P1024NSE5DFBP1024NSE5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)-0°C – 125°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
1,126
P1024NSN5DFBP1024NSN5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)-0°C – 125°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
1,328
P1024NXE5BFBP1024NXE5BFBNXP SemiconductorsIC MPU 400MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40 °C – 125 °C
Speed:
400 MHz
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 3.3
Qualification:
Industrial
451
P1024NXE5DFBP1024NXE5DFBNXP SemiconductorsIC MPU QORIQ P1 667MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
561-FBGA
Supplier Device Package:
561-TEPBGA I (23×23)
Grade:
Industrial
1,410
P1025NXE5DFBP1025NXE5DFBNXP SemiconductorsIC MPU 533MHZ 561TEPBGAMicroprocessors561-TEPBGA I (23x23)N/A-40 °C – 125 °C
Speed:
533 MHz
Core Processor:
e500
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR2
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (1)
Grade:
Industrial
Graphics Acceleration:
No
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
Qualification:
Industrial
71
P1AFS1500-2FG256P1AFS1500-2FG256Microchip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
119
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
1,004
P1AFS1500-2FG256IN/AP1AFS1500-2FG256IMicrochip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
119
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
600
P1AFS1500-2FG484P1AFS1500-2FG484Microchip TechnologyIC FPGA 223 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
223
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
1,849
P1AFS1500-2FG484IP1AFS1500-2FG484IMicrochip TechnologyIC FPGA 223 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
223
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
485
P1AFS1500-2FGG256P1AFS1500-2FGG256Microchip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1500000
Number of I/O:
119
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
738
P1AFS1500-2FGG256IP1AFS1500-2FGG256IMicrochip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1500000
Number of I/O:
119
Number of LABs/CLBs:
38400
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
276480
1,035

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