 | | P1022NSN2MHB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 245 | |
 | | P1022NXE2EFB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 250 | |
 | | P1022NXE2HFB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 108 | |
 | | P1022NXE2LFB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 375 | |
 | | P1022NXN2EFB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 563 | |
 | | P1022NXN2HFB | NXP Semiconductors | IC MPU QORIQ P1 1.055GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 1,728 | |
 | | P1022NXN2LFB | NXP Semiconductors | IC MPU QORIQ P1 1.067GHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 1,255 | |
| N/A | | P1023NSN5CFB | NXP Semiconductors | IC MPU QORIQ P1 500MHZ 457TEPBGA | Microprocessors | 457-TEPBGA-1 (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 457-TEPBGA-1 (19×19) | 1,020 | |
| N/A | | P1023NXE5CFB | NXP Semiconductors | IC MPU 500MHZ 457TEPBGA | Microprocessors | 457-TEPBGA I (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 105°C (TA) Security Features: 3DES, AES, DES, RNG Mounting Type: Surface Mount Supplier Device Package: 457-TEPBGA I (19×19) | 197 | |
 | | P1024NSE5DFB | NXP Semiconductors | IC MPU QORIQ P1 667MHZ 561TEPBGA | Microprocessors | 561-TEPBGA I (23x23) | - | 0°C – 125°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Mounting Type: Surface Mount | 1,126 | |
 | | P1024NSN5DFB | NXP Semiconductors | IC MPU QORIQ P1 667MHZ 561TEPBGA | Microprocessors | 561-TEPBGA I (23x23) | - | 0°C – 125°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Mounting Type: Surface Mount | 1,328 | |
 | | P1024NXE5BFB | NXP Semiconductors | IC MPU 400MHZ 561TEPBGA | Microprocessors | 561-TEPBGA I (23x23) | N/A | -40 °C – 125 °C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (3) Co-Processors/DSP: Security; SEC 3.3 | 451 | |
 | | P1024NXE5DFB | NXP Semiconductors | IC MPU QORIQ P1 667MHZ 561TEPBGA | Microprocessors | 561-TEPBGA I (23x23) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 Ethernet: 10/100/1000Mbps (3) Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 561-TEPBGA I (23×23) | 1,410 | |
 | | P1025NXE5DFB | NXP Semiconductors | IC MPU 533MHZ 561TEPBGA | Microprocessors | 561-TEPBGA I (23x23) | N/A | -40 °C – 125 °C | Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (3) Co-Processors/DSP: Communications; QUICC Engine, Security; SEC | 71 | |
 | | P1AFS1500-2FG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 85°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 1,004 | |
 | N/A | P1AFS1500-2FG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 100°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 600 | |
 | | P1AFS1500-2FG484 | Microchip Technology | IC FPGA 223 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 85°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 1,849 | |
 | | P1AFS1500-2FG484I | Microchip Technology | IC FPGA 223 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 100°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 485 | |
 | | P1AFS1500-2FGG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 85°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 738 | |
 | | P1AFS1500-2FGG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 100°C | Number of LABs/CLBs: 38400 Number of Logic Elements/Cells: 38400 | 1,035 | |