Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
1ST280EY2F55I2VG1ST280EY2F55I2VGIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
631
1ST280EY2F55I2VGAS1ST280EY2F55I2VGASIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
423
1ST280EY3F55E3VG1ST280EY3F55E3VGIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
958
1ST280EY3F55E3VGS11ST280EY3F55E3VGS1IntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)770 mV - 970 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
1,358
1ST280EY3F55E3XG
1ST280EY3F55E3XGIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)0.82V ~ 0.88V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
296
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2912-BBGA, FCBGA
Supplier Device Package:
2912-FBGA, FC (55×55)
254
1ST280EY3F55I3VG1ST280EY3F55I3VGIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)770 mV - 970 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
296
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Qualification:
N/A
Total RAM Bits:
240123904
561
1ST280EY3F55I3XG
1ST280EY3F55I3XGIntelIC FPGA 296 I/O 2912BGAFPGAs2912-FBGA, FC (55x55)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
350000
Number of Logic Elements/Cells:
2800000
Number of I/O:
296
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2912-BBGA, FCBGA
Supplier Device Package:
2912-FBGA, FC (55×55)
487
N/AN/A203-2859-03Analog Devices Inc.IC SWITCH ANALOGAnalog Switches, Multiplexers, Demultiplexers-N/A

N/A

87
N/AN/A203-2859-22+TDAnalog Devices Inc.IC SWITCH ANALOGAnalog Switches, Multiplexers, Demultiplexers-N/A

N/A

1,573
21281CB
21281CBIntelIC MPU 200MHZ 144TQFPMicroprocessors144-TQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
SA-110
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
No
Voltage – I/O:
2.1V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,349
26LS32AP-E
26LS32AP-ERenesasIC LINE RECEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

854
N/A
26LS32FPEL-ERenesasIC LINE RECEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,660
N/A31018-07-3418Advanced Micro DevicesIC FPGAFPGAsN/A4.75 V - 5.25 VN/A
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
N/A
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
N/A
Qualification:
N/A
Total RAM Bits:
N/A
1,388
32P4742-CGT
32P4742-CGTTexas InstrumentsIC READ CHAN BICMOS PQFP64Drivers, Receivers, TransceiversN/AN/AN/A

N/A

143
32P4752-CGT
32P4752-CGTTexas InstrumentsIC READ CHAN BICMOS PQFP64Drivers, Receivers, TransceiversN/AN/AN/A

N/A

786
32P4782A-CGT
32P4782A-CGTTexas InstrumentsIC READ CHAN BICMOS PQFP64Drivers, Receivers, TransceiversN/AN/AN/A

N/A

1,229
33R3753-CGTN/A33R3753-CGTTexas InstrumentsIC ANALOG COMP STORAGEDrivers, Receivers, TransceiversN/AN/AN/A

N/A

894
3530ECBCAMERCURYN/A3530ECBCAMERCURYTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
1,558
3530ECUSAGRM
3530ECUSAGRMTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
1,888
50051R
50051RRenesasIC TRANSCEIVER 10A TWISTED PAIRDrivers, Receivers, Transceivers-5V-40°C ~ 85°C
Type:
Transceiver
Voltage – Supply:
5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
Module
829

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