Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

Part Search

CLEAR SEARCH
Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
M2GL025-1FGG484T1
M2GL025-1FGG484T1Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V-40°C ~ 135°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 135°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,503
M2GL025-1VF256
M2GL025-1VF256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
138
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LFBGA
Supplier Device Package:
256-FPBGA (14×14)
9
M2GL025-1VF256I
M2GL025-1VF256IMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
138
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LFBGA
Supplier Device Package:
256-FPBGA (14×14)
947
M2GL025-1VF400
M2GL025-1VF400Microchip TechnologyIC FPGA 207 I/O 400VFBGAFPGAs400-VFBGA (17x17)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
207
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-LFBGA
Supplier Device Package:
400-VFBGA (17×17)
295
M2GL025-1VF400IM2GL025-1VF400IMicrochip TechnologyIC FPGA 207 I/O 400VFBGAFPGAs400-VFBGA (17x17)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
207
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
1,191
M2GL025-1VFG256
M2GL025-1VFG256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
138
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LFBGA
Supplier Device Package:
256-FPBGA (14×14)
129
M2GL025-1VFG256IN/AM2GL025-1VFG256IMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
138
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
134
M2GL025-1VFG400
M2GL025-1VFG400Microchip TechnologyIC FPGA 207 I/O 400VFBGAFPGAs400-VFBGA (17x17)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
207
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-LFBGA
Supplier Device Package:
400-VFBGA (17×17)
254
M2GL025-1VFG400IM2GL025-1VFG400IMicrochip TechnologyIC FPGA 207 I/O 400VFBGAFPGAs400-VFBGA (17x17)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
207
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
305
N/AN/AM2GL025-FCS325Microchip TechnologyIC FPGA 180 I/O 325BGAFPGAs325-FCBGA (11x11)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
180
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
310
N/AN/AM2GL025-FCS325IMicrochip TechnologyIC FPGA 180 I/O 325BGAFPGAs325-FCBGA (11x11)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
180
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
471
M2GL025-FCSG325
M2GL025-FCSG325Microchip TechnologyIC FPGA 180 I/O 324CSBGAFPGAs325-FCBGA (11x11)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
180
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
325-TFBGA, FCBGA
Supplier Device Package:
325-FCBGA (11×11)
209
M2GL025-FCSG325I
M2GL025-FCSG325IMicrochip TechnologyIC FPGA 180 I/O 324CSBGAFPGAs325-FCBGA (11x11)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
180
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
325-TFBGA, FCBGA
Supplier Device Package:
325-FCBGA (11×11)
605
M2GL025-FG484M2GL025-FG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
849
M2GL025-FG484IN/AM2GL025-FG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
726
M2GL025-FGG484
M2GL025-FGG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
806
M2GL025-FGG484I
M2GL025-FGG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,566
M2GL025-VF256N/AM2GL025-VF256Microchip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
138
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
550
M2GL025-VF256IN/AM2GL025-VF256IMicrochip TechnologyIC FPGA 138 I/O 256FBGAFPGAs256-FPBGA (14x14)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
138
Number of LABs/CLBs:
27696
Number of Logic Elements/Cells:
27696
Qualification:
N/A
Total RAM Bits:
1130496
1,560
M2GL025-VF400
M2GL025-VF400Microchip TechnologyIC FPGA 207 I/O 400VFBGAFPGAs400-VFBGA (17x17)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
27696
Total RAM Bits:
1130496
Number of I/O:
207
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-LFBGA
Supplier Device Package:
400-VFBGA (17×17)
352

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


























      I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


      See What We Have to Offer!

      keyboard_arrow_up