Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AXCVU7P-1FLVA2104IAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLVA2104825 mV - 876 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
945
N/A
XCVU7P-1FLVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
702
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
780
N/AN/AXCVU7P-1FLVB2104IAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAsFLVB2104825 mV - 876 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
144
N/AN/AXCVU7P-2FLVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLVA2104825 mV - 876 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
532
N/AN/AXCVU7P-2FLVA2104IAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLVA2104825 mV - 876 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
1,900
N/AN/AXCVU7P-2FLVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAsFLVB2104825 mV - 876 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
757
N/AN/AXCVU7P-2FLVB2104IAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAsFLVB2104825 mV - 876 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
788160
Number of Logic Elements/Cells:
1724000
Qualification:
N/A
Total RAM Bits:
241801626
639
N/AN/AXCVU7P-2FLVC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
416
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Qualification:
N/A
Total RAM Bits:
260812800
1,299
N/A
XCVU7P-2FLVC2104IAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
416
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
20
N/A
XCVU7P-3FLVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
832
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
901
N/A
XCVU7P-3FLVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
702
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,230
N/A
XCVU7P-3FLVC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
416
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,389
N/A
XCVU7P-L2FLVA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
832
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,131
N/AN/AXCVU7P-L2FLVB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Qualification:
N/A
Total RAM Bits:
260812800
289
N/A
XCVU7P-L2FLVC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
98520
Number of Logic Elements/Cells:
1724100
Total RAM Bits:
260812800
Number of I/O:
416
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
203
N/AN/AXCVU9P-1FLGA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLGA2104825 mV - 876 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
1182240
Number of Logic Elements/Cells:
2586000
Qualification:
N/A
Total RAM Bits:
362702438
617
N/AN/AXCVU9P-1FLGA2104IAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLGA2104825 mV - 876 mV-40°C – 100°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
1182240
Number of Logic Elements/Cells:
2586000
Qualification:
N/A
Total RAM Bits:
362702438
915
N/A
XCVU9P-1FLGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
572
N/AN/AXCVU9P-1FLGA2577IAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
827
N/AN/AXCVU9P-1FLGB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
651

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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