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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC885CZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 479 | ||
 | MPC885CZP66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 1,409 | ||
 | MPC885VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 709 | ||
 | MPC885VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 1,445 | ||
 | MPC885VR66-NXP | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 289 | ||
 | MPC885VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 578 | ||
 | MPC885ZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 871 | ||
 | MPL485A-I/AJA | Microchip Technology | IC MPU 100MHZ 121TFBGA | Microprocessors | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz RAM Controllers: SRAM Graphics Acceleration: No USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES 128, 192, 256 Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-TFBGA (10×10) Grade: Industrial | 148 | ||
 | MPL485AT-I/AJA | Microchip Technology | IC MPU 100MHZ 121TFBGA | Microprocessors | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz RAM Controllers: SRAM Graphics Acceleration: No USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES 128, 192, 256 Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-TFBGA (10×10) Grade: Industrial | 1,046 | ||
| N/A | MQ801866 | Intel | RISC MPU, 16-BIT | Microprocessors | N/A | N/A | -55 °C – 125 °C | Core Processor: 80186 Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DRAM Grade: Military Graphics Acceleration: No Co-Processors/DSP: External 80187 FPU | 987 | ||
| N/A | MQ80386-16 | Intel | RISC MPU, 32-BIT, 16MHZ CQFP164 | Microprocessors | N/A | N/A | -55 °C – 125 °C | Core Processor: 80386 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM Grade: Military Graphics Acceleration: No Co-Processors/DSP: External 80387 FPU | 1,454 | ||
| N/A | MQ80386-25 | Intel | IC MPU 386 25MHZ 164CQFP | Microprocessors | 164-CQFP (28.71x28.71) | N/A | -55°C ~ 125°C (TC) | Core Processor: Intel 386® Speed: 25MHz Co-Processors/DSP: 80386 Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Surface Mount Package / Case: 164-BCQFP Exposed Pad Supplier Device Package: 164-CQFP (28.71×28.71) Grade: Military | 168 | ||
| N/A | MQ80960MC-25 | Intel | IC MPU 25MHZ 164CQFP | Microprocessors | 164-CQFP (28.71x28.71) | N/A | 0°C ~ 85°C (TC) | Core Processor: Intel® 80960XA Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 164-BCQFP Exposed Pad Supplier Device Package: 164-CQFP (28.71×28.71) Grade: Commercial | 1,093 | ||
| N/A | MQ80960MC25 | Intel | IC MPU 25MHZ 164CQFP | Microprocessors | 164-CQFP (28.71x28.71) | N/A | 0°C ~ 85°C (TC) | Core Processor: Intel® 80960XA Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 164-BCQFP Exposed Pad Supplier Device Package: 164-CQFP (28.71×28.71) Grade: Commercial | 761 | ||
 | MVF30NN151CKU26 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 133 | ||
 | MVF30NN152CKU26 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 313 | ||
 | MVF30NS151CKU26 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 1,610 | ||
 | MVF30NS152CKU26 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 1,004 | ||
 | MVF50NN151CMK40 | NXP Semiconductors | IC MPU VYBRID 400MHZ 364LFBGA | Microprocessors | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (17×17) | 1,848 | ||
 | MVF50NN151CMK50 | NXP Semiconductors | IC MPU VYBRID 500MHZ 364LFBGA | Microprocessors | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 500MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (17×17) | 1,221 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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