Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.
Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | STM32MP157CAB3 | STMicroelectronics | IC MPU STM32MP1 650MHZ 354LFBGA | Microprocessors | 354-LFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 354-LFBGA Supplier Device Package: 354-LFBGA (16×16) Grade: Automotive | 606 | ||
 | STM32MP157CAB3T | STMicroelectronics | IC MPU STM32MP1 650MHZ 354LFBGA | Microprocessors | 354-LFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 354-LFBGA Supplier Device Package: 354-LFBGA (16×16) Grade: Automotive | 736 | ||
 | STM32MP157CAC3 | STMicroelectronics | IC MPU STM32MP1 650MHZ 361TFBGA | Microprocessors | 361-TFBGA (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (12×12) Grade: Automotive | 288 | ||
 | STM32MP157CAC3T | STMicroelectronics | IC MPU STM32MP1 650MHZ 361TFBGA | Microprocessors | 361-TFBGA (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (12×12) Grade: Automotive | 430 | ||
 | STM32MP157CAD3 | STMicroelectronics | IC MPU STM32MP1 650MHZ 257TFBGA | Microprocessors | 257-TFBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 257-TFBGA Supplier Device Package: 257-TFBGA (10×10) Grade: Automotive | 1,625 | ||
 | STM32MP157CAD3T | STMicroelectronics | IC MPU STM32MP1 650MHZ 257TFBGA | Microprocessors | 257-TFBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 257-TFBGA Supplier Device Package: 257-TFBGA (10×10) Grade: Automotive | 381 | ||
 | STM32MP157DAA1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 448LFBGA | Microprocessors | 448-LFBGA (18x18) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 448-LFBGA Supplier Device Package: 448-LFBGA (18×18) Grade: Consumer | 22 | ||
 | STM32MP157DAB1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 354LFBGA | Microprocessors | 354-LFBGA (16x16) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 354-LFBGA Supplier Device Package: 354-LFBGA (16×16) Grade: Consumer | 1,490 | ||
 | STM32MP157DAC1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 361TFBGA | Microprocessors | 361-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (12×12) Grade: Consumer | 609 | ||
 | STM32MP157DAD1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 257TFBGA | Microprocessors | 257-TFBGA (10x10) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 257-TFBGA Supplier Device Package: 257-TFBGA (10×10) Grade: Consumer | 157 | ||
 | STM32MP157FAA1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 448LFBGA | Microprocessors | 448-LFBGA (18x18) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 448-LFBGA Supplier Device Package: 448-LFBGA (18×18) Grade: Consumer | 1,351 | ||
 | STM32MP157FAB1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 354LFBGA | Microprocessors | 354-LFBGA (16x16) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 354-LFBGA Supplier Device Package: 354-LFBGA (16×16) Grade: Consumer | 211 | ||
 | STM32MP157FAC1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 361TFBGA | Microprocessors | 361-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (12×12) Grade: Consumer | 635 | ||
 | STM32MP157FAD1 | STMicroelectronics | IC MPU STM32MP1 800MHZ 257TFBGA | Microprocessors | 257-TFBGA (10x10) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 209MHz, 800MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI-CEC, LCD Ethernet: 10/100Mbps, GbE USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ Mounting Type: Surface Mount Package / Case: 257-TFBGA Supplier Device Package: 257-TFBGA (10×10) Grade: Consumer | 1,142 | ||
 | SVF311R3K1CKU2 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 40 | ||
 | SVF311R3K2CKU2 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 50 | ||
 | N/A | SVF312R3K1CKU2 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 64 | |
 | SVF312R3K2CKU2 | NXP Semiconductors | IC MPU VYBRID 266MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 684 | ||
 | N/A | SVF321R3K1CKU2 | NXP Semiconductors | IC MPU VYBRID 133MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 266MHz, 133MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 1,605 | |
 | SVF321R3K2CKU2 | NXP Semiconductors | IC MPU VYBRID 133MHZ 176HLQFP | Microprocessors | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 266MHz, 133MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24×24) | 349 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
We’ve Got You Covered!
If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.
