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Total Products: 4,060
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
M2GL090T-FCSG325I
M2GL090T-FCSG325IMicrochip TechnologyIC FPGA 180 I/O 324CSBGAFPGAs325-FCBGA (11x11)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
180
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
325-TFBGA, FCBGA
Supplier Device Package:
325-FCBGA (11×11)
990
M2GL090T-FG484
M2GL090T-FG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
86316
Total RAM Bits:
2648064
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
3
M2GL090T-FG484I
M2GL090T-FG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,130
M2GL090T-FG676
M2GL090T-FG676Microchip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
86316
Total RAM Bits:
2648064
Number of I/O:
425
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
730
M2GL090T-FG676I
M2GL090T-FG676IMicrochip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
425
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
108
M2GL090T-FGG484N/AM2GL090T-FGG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86316
Qualification:
N/A
Total RAM Bits:
2648064
164
M2GL090T-FGG484IN/AM2GL090T-FGG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
1,453
M2GL090T-FGG676
M2GL090T-FGG676Microchip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
86316
Total RAM Bits:
2648064
Number of I/O:
425
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
110
M2GL090T-FGG676I
M2GL090T-FGG676IMicrochip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
425
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
754
N/A
M2GL090TS-1FCS325Microchip TechnologyIC FPGA 180 I/O 325BGAFPGAs325-FCBGA (11x11)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
180
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
325-TFBGA, FCBGA
Supplier Device Package:
325-FCBGA (11×11)
802
N/AN/AM2GL090TS-1FCS325IMicrochip TechnologyIC FPGA 180 I/O 325BGAFPGAs325-FCBGA (11x11)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
180
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
1,214
M2GL090TS-1FCSG325N/AM2GL090TS-1FCSG325Microchip TechnologyIC FPGA 180 I/O 324CSBGAFPGAs325-FCBGA (11x11)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
180
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
210
M2GL090TS-1FCSG325IN/AM2GL090TS-1FCSG325IMicrochip TechnologyIC FPGA 180 I/O 324CSBGAFPGAs325-FCBGA (11x11)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
180
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
1,580
M2GL090TS-1FG484
M2GL090TS-1FG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
86184
Total RAM Bits:
2648064
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
853
M2GL090TS-1FG484I
M2GL090TS-1FG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86316
Total RAM Bits:
2648064
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
244
M2GL090TS-1FG484MN/AM2GL090TS-1FG484MMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V-55°C – 125°C
Grade:
Military
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
MIL-STD-883
Total RAM Bits:
2648064
179
M2GL090TS-1FG676N/AM2GL090TS-1FG676Microchip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
425
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
633
M2GL090TS-1FG676IN/AM2GL090TS-1FG676IMicrochip TechnologyIC FPGA 425 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
425
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86316
Qualification:
N/A
Total RAM Bits:
2648064
563
M2GL090TS-1FGG484N/AM2GL090TS-1FGG484Microchip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
267
Number of LABs/CLBs:
86184
Number of Logic Elements/Cells:
86184
Qualification:
N/A
Total RAM Bits:
2648064
850
M2GL090TS-1FGG484I
M2GL090TS-1FGG484IMicrochip TechnologyIC FPGA 267 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 2.625V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
86316
Total RAM Bits:
2648064
Number of I/O:
267
Voltage – Supply:
1.14V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
132

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