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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC875CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 11 | ||
 | MPC875CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 732 | ||
 | MPC875CZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,805 | ||
 | MPC875CZT66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 770 | ||
 | MPC875VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,657 | ||
 | MPC875VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 684 | ||
 | MPC875VR66-NXP | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 610 | ||
 | MPC875VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 319 | ||
 | MPC875ZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 494 | ||
 | MPC875ZT66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 570 | ||
 | MPC880CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 633 | ||
 | MPC880CVR133-NXP | NXP Semiconductors | POWERQUICC 32 BIT POWER ARCHITEC | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 513 | ||
 | MPC880CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 603 | ||
 | MPC880VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 111 | ||
 | MPC880VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 108 | ||
 | MPC880VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 226 | ||
 | MPC880ZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 517 | ||
 | MPC880ZP66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 645 | ||
 | MPC885CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 1,097 | ||
 | MPC885CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) | 192 |
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