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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
KMPC8378ECVRALGN/AKMPC8378ECVRALGNXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V-40°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
953
KMPC8379EVRALGKMPC8379EVRALGNXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V0°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
835
KMPC852TCVR100AKMPC852TCVR100ANXP SemiconductorsIC MPU MPC8XX 100MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
558
KMPC852TVR100AKMPC852TVR100ANXP SemiconductorsIC MPU MPC8XX 100MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
313
KMPC8533EVTAQGKMPC8533EVTAQGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
439
KMPC8560CVT667JBKMPC8560CVT667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
712
KMPC8560PX833LCKMPC8560PX833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,438
KMPC8560VT833LBKMPC8560VT833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
513
KMPC8560VT833LCKMPC8560VT833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Mounting Type:
Surface Mount
1,700
KMPC860PCZQ66D4KMPC860PCZQ66D4NXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
324
KMPC860SRCVR50D4KMPC860SRCVR50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
579
KMPC860TCVR50D4KMPC860TCVR50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
477
KMPC860TCZQ50D4KMPC860TCZQ50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
827
KMPC860TVR80D4KMPC860TVR80D4NXP SemiconductorsIC MPU MPC8XX 80MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
413
KMPC862PVR100BKMPC862PVR100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,763
KMPC866PVR133AKMPC866PVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
437
KMPC866TVR133AKMPC866TVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
274
KMPC875CVR133KMPC875CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
397
KMPC875VR133KMPC875VR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
627
KMPC885CVR133KMPC885CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,097

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