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Electronic Parts Search

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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KMPC8378ECVRALGN/AKMPC8378ECVRALGNXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V-40°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
152
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KMPC8379EVRALG
KMPC8379EVRALGNXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V0°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
821
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KMPC852TCVR100A
KMPC852TCVR100ANXP SemiconductorsIC MPU MPC8XX 100MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, PCMCIA, SPI, UART
696
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KMPC852TVR100A
KMPC852TVR100ANXP SemiconductorsIC MPU MPC8XX 100MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, PCMCIA, SPI, UART
520
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KMPC8533EVTAQG
KMPC8533EVTAQGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
113
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KMPC8560CVT667JB
KMPC8560CVT667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
237
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KMPC8560PX833LC
KMPC8560PX833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,382
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KMPC8560VT833LB
KMPC8560VT833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,828
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KMPC8560VT833LC
KMPC8560VT833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Mounting Type:
Surface Mount
1,156
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KMPC860PCZQ66D4
KMPC860PCZQ66D4NXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
811
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KMPC860SRCVR50D4
KMPC860SRCVR50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
498
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KMPC860TCVR50D4
KMPC860TCVR50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
463
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QUOTE
KMPC860TCZQ50D4
KMPC860TCZQ50D4NXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
716
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KMPC860TVR80D4
KMPC860TVR80D4NXP SemiconductorsIC MPU MPC8XX 80MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
58
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KMPC862PVR100B
KMPC862PVR100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
82
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KMPC866PVR133A
KMPC866PVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
116
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QUOTE
KMPC866TVR133A
KMPC866TVR133ANXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (4), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
380
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KMPC875CVR133
KMPC875CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
312
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QUOTE
KMPC875VR133
KMPC875VR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
1,060
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QUOTE
KMPC885CVR133
KMPC885CVR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
347
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