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Total Products: 31,199
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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P1AFS600-2FG484I
P1AFS600-2FG484IMicrochip TechnologyIC FPGA 172 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
172
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,409
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P1AFS600-2FGG256N/AP1AFS600-2FGG256Microchip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
119
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
48
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P1AFS600-2FGG256I
P1AFS600-2FGG256IMicrochip TechnologyIC FPGA 119 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
119
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
1,348
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P1AFS600-2FGG484
P1AFS600-2FGG484Microchip TechnologyIC FPGA 172 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
172
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
590
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P1AFS600-2FGG484IN/AP1AFS600-2FGG484IMicrochip TechnologyIC FPGA 172 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
172
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
913
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N/AN/APAS5201-A0Microchip TechnologyIC SYSTEM ON CHIP ETHERNETControllers--–
Protocol:
Ethernet
Function:
MAC Controller
Interface:
Ethernet, GPIO, UART
Standards:
IEEE 802.3
44
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N/AN/APAS5201-L0Microchip TechnologyIC ETHERNET MAC CNTRLRControllers--–
Protocol:
Ethernet
Function:
MAC Controller
Interface:
Ethernet, GPIO, UART
Standards:
IEEE 802.3
1,929
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N/AN/APAS5211A-F3EIMicrochip TechnologyFOUR-PORT GPON OLT SOCControllers--–

N/A

654
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N/AN/APAS6511B-F3EIMicrochip TechnologyIC SYSTEM ON CHIP ETHERNETControllers336-FCBGA (17x17)-–
Protocol:
Ethernet
Function:
Controller
Interface:
I2C, MII, SPI
Standards:
IEEE 802.3, 10/100/1000 Base-T PHY
Package / Case:
336-BGA, FCBGA
Supplier Device Package:
336-FCBGA (17×17)
907
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N/AN/APAS6511B-F3GIMicrochip TechnologyIC ETHERNET I2C/MII/SPI 336FCBGAControllers336-FCBGA (17x17)-–
Protocol:
Ethernet
Interface:
I2C, MII, SPI
Standards:
10/100/1000 Base-T PHY
Package / Case:
336-BGA, FCBGA
Supplier Device Package:
336-FCBGA (17×17)
549
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N/AN/APAS6512B-F3GIMicrochip TechnologyIC ETHERNET I2C/MII/SPI 336FCBGAControllers336-FCBGA (17x17)-–
Protocol:
Ethernet
Interface:
I2C, MII, SPI
Standards:
10/100/1000 Base-T PHY
Package / Case:
336-BGA, FCBGA
Supplier Device Package:
336-FCBGA (17×17)
295
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N/AN/APAS7400B-NGIMicrochip TechnologyIC ETHERNET MII 384FCBGAControllers384-FCBGA (17x17)-–
Protocol:
Ethernet
Interface:
MII
Package / Case:
384-BGA, FCBGA
Supplier Device Package:
384-FCBGA (17×17)
887
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N/AN/APAS7401B-PGIMicrochip TechnologyIC SYSTEM ON CHIP ETHERNETControllers416-HBGA (27x27)-–
Protocol:
Ethernet
Function:
Switch
Interface:
JTAG, MII, SPI, UART
Package / Case:
416-BGA
Supplier Device Package:
416-HBGA (27×27)
230
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N/A
PCX7447AVGH1000NBMicrochip TechnologyIC MPU POWERPC 1.0GHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Graphics Acceleration:
No
Voltage – I/O:
1.1V, 1.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
887
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N/A
PCX7447AVGH1167NBMicrochip TechnologyIC MPU POWERPC 1.167GHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Graphics Acceleration:
No
Voltage – I/O:
1.1V, 1.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
1,322
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N/A
PCX7457VGH1000NCMicrochip TechnologyIC MPU POWERPC G4 1.0GHZ 483CBGAMicroprocessors483-HiTCE-CBGA (29x29)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA Exposed Pad
Supplier Device Package:
483-HiTCE-CBGA (29×29)
Grade:
Industrial
745
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N/A
PCX7457VGU933NCMicrochip TechnologyIC MPU POWERPC G4 933MHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
933MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
1,803
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N/A
PCX745BVZFU300LEMicrochip TechnologyIC MPU POWERPC 300MHZ 255BGAMicroprocessors255-PBGA (21x21)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA Exposed Pad
Supplier Device Package:
255-PBGA (21×21)
Grade:
Industrial
1,432
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N/A
PCX755BVZFU300LEMicrochip TechnologyIC MPU POWERPC 300MHZ 360BGAMicroprocessors360-PBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA Exposed Pad
Supplier Device Package:
360-PBGA (25×25)
Grade:
Industrial
456
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N/A
PCX755BVZFU350LEMicrochip TechnologyIC MPU 350MHZ 360BGAMicroprocessors360-PBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA Exposed Pad
Supplier Device Package:
360-PBGA (25×25)
Grade:
Industrial
59
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