| N/A | N/A | 5AGXBA7D4F27C5G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 271 | |
 | | 5AGXBA7D4F27C5N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 847 | |
| N/A | | 5AGXBA7D4F27I5G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 1,030 | |
 | | 5AGXBA7D4F27I5N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 227 | |
 | | 5AGXBA7D4F31C4G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 1,584 | |
 | | 5AGXBA7D4F31C4N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 169 | |
 | N/A | 5AGXBA7D4F31C5G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 912 | |
 | | 5AGXBA7D4F31C5N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 587 | |
 | N/A | 5AGXBA7D4F31I5G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 231 | |
 | | 5AGXBA7D4F31I5N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 182 | |
 | | 5AGXBA7D4F35C4G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 643 | |
 | | 5AGXBA7D4F35C4N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 977 | |
 | | 5AGXBA7D4F35C5G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 765 | |
 | | 5AGXBA7D4F35C5N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 230 | |
 | | 5AGXBA7D4F35I5G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.07 V - 1.13 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 1,080 | |
 | | 5AGXBA7D4F35I5N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.07 V - 1.13 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 447 | |
| N/A | | 5AGXBA7D6F27C6G | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 975 | |
 | | 5AGXBA7D6F27C6N | Intel | IC FPGA 336 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 926 | |
 | | 5AGXBA7D6F31C6G | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07 V - 1.13 V | 0°C – 85°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 759 | |
 | | 5AGXBA7D6F31C6N | Intel | IC FPGA 384 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.07V ~ 1.13V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31×31) | 341 | |