5AGXBA7D4F35C4N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 3 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXBA7D4F35C4N – Arria V GX Field Programmable Gate Array (FPGA) IC, 242000 logic elements
The 5AGXBA7D4F35C4N is an Intel Arria V GX family FPGA provided in a commercial-grade, surface-mount FCBGA package. It delivers high on-chip logic and memory density with 242,000 logic elements and 15,470,592 total RAM bits, plus 544 user I/Os for complex, reconfigurable designs.
Voltage supply for the device is specified between 1.07 V and 1.13 V, and the operating temperature range is 0 °C to 85 °C. The Arria V device datasheet provides extensive electrical, switching, configuration, and I/O timing specifications for system integration and validation.
Key Features
- Core Logic Capacity 242,000 logic elements (cells) support substantial programmable logic for custom accelerators, control functions, and glue logic.
- On‑Chip Memory 15,470,592 total RAM bits for embedded data buffering, LUT RAM, and state storage within the FPGA fabric.
- High I/O Count 544 I/O pins enable extensive connectivity to peripherals, memory interfaces, and board-level signals.
- Package and Mounting 1152‑BBGA package (FCBGA exposed pad). Supplier device package listed as 1152‑FBGA (35×35). Surface mount design for board-level assembly.
- Power Supply Core voltage specified from 1.07 V to 1.13 V to match system power budgeting and sequencing requirements.
- Operating Range Commercial grade operation across 0 °C to 85 °C for standard embedded and industrial-adjacent environments.
- RoHS Compliance Device is RoHS compliant, supporting regulatory requirements for lead‑free assembly.
Typical Applications
- High‑density embedded processing Use the large logic element count and on‑chip RAM to implement custom datapaths, control logic, and hardware accelerators.
- Interface aggregation and bridging High I/O count enables aggregation of multiple interfaces, protocol bridging, and board-level signal routing.
- Real‑time control systems Deterministic hardware implementation of control loops and signal processing using on‑chip resources.
- Prototype and system validation Commercial‑grade Arria V GX capacity suitable for FPGA prototyping and development of complex systems prior to production deployment.
Unique Advantages
- Substantial programmable logic: 242,000 logic elements provide the headroom to implement complex custom logic without immediate migration to larger devices.
- Large embedded memory: 15,470,592 bits of RAM reduce dependence on external memory for buffering and state retention, simplifying board design.
- Extensive I/O: 544 I/Os enable flexible connectivity options and reduce the need for external multiplexing or additional interface chips.
- Industry-standard package: 1152‑BBGA (FCBGA exposed pad) and 1152‑FBGA (35×35) supplier package facilitate placement in compact, high-density PCB layouts.
- Regulatory alignment: RoHS compliance supports lead‑free assembly and environmental requirements for many commercial products.
- Clear power and thermal envelope: Defined core voltage range and commercial temperature rating support predictable system power sequencing and thermal design.
Why Choose 5AGXBA7D4F35C4N?
The 5AGXBA7D4F35C4N Arria V GX FPGA combines high logic density, abundant on‑chip memory, and a large I/O complement in a commercial-grade, surface-mount BGA package. Its specifications are well suited for designers building complex, reconfigurable systems that require significant programmable resources and broad board-level connectivity while maintaining a defined power and temperature envelope.
For engineering teams focused on prototyping, embedded acceleration, or interface consolidation, this device offers a balance of capacity and integration with documented electrical and configuration details in the Arria V device datasheet to support system validation and deployment.
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