5AGXBA7D4F35C4N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad

Quantity 3 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXBA7D4F35C4N – Arria V GX Field Programmable Gate Array (FPGA) IC, 242000 logic elements

The 5AGXBA7D4F35C4N is an Intel Arria V GX family FPGA provided in a commercial-grade, surface-mount FCBGA package. It delivers high on-chip logic and memory density with 242,000 logic elements and 15,470,592 total RAM bits, plus 544 user I/Os for complex, reconfigurable designs.

Voltage supply for the device is specified between 1.07 V and 1.13 V, and the operating temperature range is 0 °C to 85 °C. The Arria V device datasheet provides extensive electrical, switching, configuration, and I/O timing specifications for system integration and validation.

Key Features

  • Core Logic Capacity  242,000 logic elements (cells) support substantial programmable logic for custom accelerators, control functions, and glue logic.
  • On‑Chip Memory  15,470,592 total RAM bits for embedded data buffering, LUT RAM, and state storage within the FPGA fabric.
  • High I/O Count  544 I/O pins enable extensive connectivity to peripherals, memory interfaces, and board-level signals.
  • Package and Mounting  1152‑BBGA package (FCBGA exposed pad). Supplier device package listed as 1152‑FBGA (35×35). Surface mount design for board-level assembly.
  • Power Supply  Core voltage specified from 1.07 V to 1.13 V to match system power budgeting and sequencing requirements.
  • Operating Range  Commercial grade operation across 0 °C to 85 °C for standard embedded and industrial-adjacent environments.
  • RoHS Compliance  Device is RoHS compliant, supporting regulatory requirements for lead‑free assembly.

Typical Applications

  • High‑density embedded processing  Use the large logic element count and on‑chip RAM to implement custom datapaths, control logic, and hardware accelerators.
  • Interface aggregation and bridging  High I/O count enables aggregation of multiple interfaces, protocol bridging, and board-level signal routing.
  • Real‑time control systems  Deterministic hardware implementation of control loops and signal processing using on‑chip resources.
  • Prototype and system validation  Commercial‑grade Arria V GX capacity suitable for FPGA prototyping and development of complex systems prior to production deployment.

Unique Advantages

  • Substantial programmable logic: 242,000 logic elements provide the headroom to implement complex custom logic without immediate migration to larger devices.
  • Large embedded memory: 15,470,592 bits of RAM reduce dependence on external memory for buffering and state retention, simplifying board design.
  • Extensive I/O: 544 I/Os enable flexible connectivity options and reduce the need for external multiplexing or additional interface chips.
  • Industry-standard package: 1152‑BBGA (FCBGA exposed pad) and 1152‑FBGA (35×35) supplier package facilitate placement in compact, high-density PCB layouts.
  • Regulatory alignment: RoHS compliance supports lead‑free assembly and environmental requirements for many commercial products.
  • Clear power and thermal envelope: Defined core voltage range and commercial temperature rating support predictable system power sequencing and thermal design.

Why Choose 5AGXBA7D4F35C4N?

The 5AGXBA7D4F35C4N Arria V GX FPGA combines high logic density, abundant on‑chip memory, and a large I/O complement in a commercial-grade, surface-mount BGA package. Its specifications are well suited for designers building complex, reconfigurable systems that require significant programmable resources and broad board-level connectivity while maintaining a defined power and temperature envelope.

For engineering teams focused on prototyping, embedded acceleration, or interface consolidation, this device offers a balance of capacity and integration with documented electrical and configuration details in the Arria V device datasheet to support system validation and deployment.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the 5AGXBA7D4F35C4N.

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