5AGXBA7D4F35I5N

The 5AGXBA7D4F35I5N is an Intel Arria V GX field programmable gate array (FPGA) offered in an industrial-grade device package. It provides substantial on-chip resources and a high I/O count for designs that require dense programmable logic and broad external interfacing.

Key capabilities include 242,000 logic elements, 15,470,592 bits of total RAM, and 544 I/O pins, delivered in a 1152-ball FBGA package with an exposed pad. The device supports operation from -40 °C to 100 °C and requires a core supply in the 1.07 V–1.13 V range.

Key Features

• Core Logic Density  Offers 242,000 logic elements to implement complex programmable logic, state machines, and custom datapaths.
• Embedded Memory  Provides 15,470,592 bits of on-chip RAM for buffering, FIFOs, and local data storage without external memory.
• Extensive I/O  544 available I/O pins support wide parallel interfaces and multiple peripheral connections to simplify board-level routing.
• Industrial Temperature Range  Specified for operation from -40 °C to 100 °C to meet industrial-environment requirements.
• Power Supply Range  Core voltage specified between 1.07 V and 1.13 V to enable predictable power provisioning and margin planning.
• Package & Mounting  Supplied in a 1152-ball FBGA (35×35) package with exposed pad and surface-mount mounting for standard PCB assembly flows.
• Environmental Compliance  RoHS-compliant to meet common environmental and regulatory requirements.

Unique Advantages

• High programmable capacity: 242,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing external component count.
• Large on-chip RAM: 15,470,592 bits of RAM support local data buffering and high-throughput streaming without relying solely on external memory.
• Broad external connectivity: 544 I/O pins provide flexibility to connect numerous peripherals, sensors, or parallel buses directly to the FPGA.
• Industrial operation: Rated from -40 °C to 100 °C to support deployment in demanding environments.
• Compact package: 1152-ball FBGA with exposed pad delivers a high-pin-count solution in a standardized surface-mount package for PCB integration.
• Regulatory readiness: RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose 5AGXBA7D4F35I5N?

The 5AGXBA7D4F35I5N arranges substantial logic, memory, and I/O resources in a single industrial-grade Arria V GX FPGA package, making it suitable for projects that demand high integration and robust operation across a wide temperature range. Its combination of 242,000 logic elements, more than 15 million bits of on-chip RAM, and 544 I/O pins enables complex system integration while minimizing external BOM.

Choose this device when your design requires a scalable, high-density FPGA solution with clear electrical and thermal operating parameters (core supply 1.07 V–1.13 V, operating temperature -40 °C to 100 °C) and a standard 1152-FBGA (35×35) mounting footprint.

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