5AGXBA7D6F31C6N

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

Quantity 74 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXBA7D6F31C6N – Arria V GX FPGA, 242,000 logic elements, 15,470,592 RAM bits, 384 I/O, 896-ball BGA (31×31)

The 5AGXBA7D6F31C6N is an Arria V GX Field Programmable Gate Array (FPGA) IC in a commercial-grade offering. It combines a high logic element count with large on-chip RAM and a high I/O density in a compact surface-mount BGA package.

Designed for designs that require substantial programmable logic and memory resources, this device provides a predictable operating envelope with a core supply range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and supplied in an 896-ball BGA (31×31) surface-mount package.

Key Features

  • Core Logic — 242,000 logic elements (cells) provide the programmable fabric for complex digital designs.
  • On-chip Memory — 15,470,592 total RAM bits for large buffering, state storage, and memory-intensive functions.
  • I/O Density — 384 I/O pins support extensive external interfacing and parallel connectivity.
  • Packaging — Surface-mount 896-ball BGA / FBGA package in a 31×31 footprint for high-density PCB implementations.
  • Power — Core supply voltage specified between 1.07 V and 1.13 V to guide power supply design and budgeting.
  • Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance — RoHS compliant to support regulatory requirements for lead-free assembly.

Unique Advantages

  • High integration of logic and memory: 242,000 logic elements paired with over 15 million RAM bits reduces the need for external FPGA resources.
  • Extensive I/O capability: 384 I/O pins allow dense peripheral and bus connectivity without immediate external expansion.
  • Compact BGA footprint: 896-ball 31×31 package enables integration into space-constrained, high-density boards.
  • Tightly specified core voltage: 1.07 V–1.13 V operating window simplifies power-supply planning for predictable performance.
  • Commercial-grade thermal operation: Rated 0 °C to 85 °C for standard commercial environments.
  • RoHS compliance: Aligned with lead-free manufacturing requirements for modern assembly processes.

Why Choose 5AGXBA7D6F31C6N?

As a member of the Arria V GX family, the 5AGXBA7D6F31C6N targets designs that need a balance of substantial programmable logic, large on-chip RAM, and a high count of I/O in a compact, surface-mount BGA package. Its commercial-grade rating and RoHS compliance make it suitable for mainstream embedded and system applications where predictable electrical and thermal behavior is required.

This device is well suited to projects that demand integrated logic and memory resources with a clear specification for supply voltage and operating temperature, enabling designers to plan power, thermal, and PCB integration with confidence.

Request a quote or submit a purchase inquiry for the 5AGXBA7D6F31C6N to obtain current pricing, lead time, and availability details.

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