5AGXBA7D6F35C6G

The 5AGXBA7D6F35C6G is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA (FCBGA) package. This commercial-grade FPGA delivers 242,000 logic elements, approximately 15.47 Mbits of embedded memory, and 544 user I/Os in a surface-mount, high-density package.

Designed for applications requiring large programmable logic capacity and extensive I/O, this device operates from a core supply range of 1.07 V to 1.13 V and is rated for operation from 0 °C to 85 °C.

Key Features

• Programmable Logic  242,000 logic elements provide substantial on-chip logic capacity for complex designs and custom processing blocks.
• Embedded Memory  Approximately 15.47 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions without relying solely on external memory.
• High I/O Count  544 user I/Os support wide parallel interfaces, multiple peripherals, and dense board-level connectivity.
• Compact, High-density Package  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35), optimized for surface-mount assembly.
• Power and Operating Range  Core voltage supply range of 1.07 V to 1.13 V; commercial operating temperature range of 0 °C to 85 °C.
• Surface Mount  Surface-mount mounting type for standard PCB assembly workflows.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Use the 242,000 logic elements to implement complex custom logic, state machines, and hardware-accelerated functions.
• Memory-intensive designs  Approximately 15.47 Mbits of embedded memory supports on-chip buffering, packet FIFOs, and local storage requirements.
• I/O-rich interface controllers  544 I/Os enable wide parallel buses, multiple peripheral interfaces, and extensive board-level interconnect.

Unique Advantages

• High on-chip integration: Combining 242,000 logic elements with substantial embedded memory and 544 I/Os reduces the need for external glue logic and memory components.
• Dense packaging for compact designs: The 1152-BBGA (FCBGA) footprint and 35×35 supplier package size enable high-density board layouts while maintaining surface-mount assembly compatibility.
• Controlled power envelope: A narrow core voltage range (1.07 V–1.13 V) simplifies power-supply planning for designs targeting this device.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for standard commercial deployments and environments.
• Regulatory readiness: RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose 5AGXBA7D6F35C6G?

The 5AGXBA7D6F35C6G Arria V GX FPGA combines substantial logic capacity, on-chip memory, and a large I/O complement in a compact FCBGA package, making it well suited for advanced programmable logic implementations that require dense integration within a commercial temperature envelope. Its voltage and package specifications simplify system-level power and mechanical planning while RoHS compliance aligns with common manufacturing requirements.

This device is appropriate for engineers and procurement teams specifying mid-to-high-density FPGA resources where on-chip memory, abundant I/O, and a compact surface-mount package are primary design drivers.

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