5AGXBA7D6F35C6N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad

Quantity 372 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXBA7D6F35C6N – Arria V GX FPGA — 242,000 logic elements, 544 I/Os

The 5AGXBA7D6F35C6N is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA exposed pad package. This commercial-grade device delivers a high logic capacity and extensive I/O count for programmable digital designs.

With 242,000 logic elements, 15,470,592 total RAM bits, and 544 I/Os, this Arria V GX device addresses designs that require large on-chip memory, dense logic integration, and broad external interfacing while operating within a 1.07 V to 1.13 V core supply window and a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity — 242,000 logic elements provide substantial programmable fabric for complex digital logic and control functions.
  • On‑Chip Memory — 15,470,592 total RAM bits enable memory-intensive algorithms, buffering, and data processing without immediate external memory dependence.
  • I/O Density — 544 user I/Os support high-pin-count interfaces and multiple simultaneous peripheral connections.
  • Package & Mounting — 1152-BBGA (FCBGA exposed pad), supplier device package 1152-FBGA (35×35), surface-mount mounting type for compact PCB integration.
  • Power — Core voltage supply specified between 1.07 V and 1.13 V to guide power distribution and regulator selection.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Standards Compliance — RoHS compliant.

Typical Applications

  • High‑density digital processing — Designs requiring extensive logic resources and on‑chip RAM benefit from 242,000 logic elements and 15.47 Mb of RAM.
  • Multi‑interface systems — Platforms that need many external connections can leverage the 544 I/Os for parallel sensors, control busses, and peripheral interfaces.
  • Embedded compute and control — Use in programmable control units and embedded accelerators where integrated memory and logic density reduce external component needs.

Unique Advantages

  • High integration density: Large logic element count and substantial on‑chip RAM reduce reliance on external logic and memory, simplifying BOM and PCB design.
  • Broad external connectivity: 544 I/Os enable flexible interfacing and support for multiple simultaneous peripherals and buses.
  • Compact system footprint: 1152‑BBGA FCBGA exposed pad package and surface-mount mounting support space-efficient layouts.
  • Predictable power planning: A defined core supply range of 1.07 V to 1.13 V simplifies regulator selection and power‑delivery network design.
  • Commercial deployment ready: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose 5AGXBA7D6F35C6N?

The 5AGXBA7D6F35C6N Arria V GX FPGA combines significant logic capacity, ample on‑chip memory, and a high I/O count in a compact 1152‑BBGA package, making it suitable for demanding commercial designs that require dense programmable logic and multiple external interfaces. Its defined voltage and temperature specifications help streamline power and thermal design decisions.

Backed by Arria V device documentation, this part is positioned for engineering teams building complex embedded processing, interface aggregation, and memory‑rich FPGA applications that require measurable, component-level specifications to guide system integration and procurement.

Request a quote or submit an inquiry to purchase 5AGXBA7D6F35C6N and receive pricing and availability information tailored to your production requirements.

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