5AGXBA7D4F35I5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA

Quantity 1,099 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXBA7D4F35I5G – Arria V GX FPGA, 544 I/O, 1152-BBGA

The 5AGXBA7D4F35I5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) packaged in a 1152‑BBGA (FCBGA) mounting. The device delivers 242,000 logic elements, 15,470,592 bits of on‑chip RAM and 544 I/O pins, supporting dense, system‑level integration in a compact surface‑mount package. Rated for industrial use, it operates across a core supply range of 1.07 V to 1.13 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  Provides 242,000 logic elements for implementing complex digital designs and custom logic functions.
  • On‑Chip Memory  Includes 15,470,592 bits of RAM to support large buffering, state machines, and data‑intensive processing inside the FPGA fabric.
  • I/O Density  Delivers 544 general‑purpose I/O pins to interface with high‑pin‑count peripherals and multi‑lane systems.
  • Industrial Grade  Specified for industrial operation with an operating temperature range of −40 °C to 100 °C.
  • Power Supply  Core voltage specified between 1.07 V and 1.13 V to match system power‑rail requirements.
  • Package & Mounting  1152‑BBGA (FCBGA) surface‑mount package, supplier package listed as 1152‑FBGA, FC (35×35), enabling compact board layouts.
  • Compliant  RoHS compliant, supporting environmental and regulatory requirements for lead‑free assembly.

Unique Advantages

  • High integration in a compact package: Combines 242,000 logic elements, substantial on‑chip RAM and 544 I/Os in a 1152‑BBGA footprint to minimize PCB area for dense designs.
  • Industrial temperature range: Rated from −40 °C to 100 °C for deployment in thermally demanding environments common to industrial applications.
  • Deterministic supply requirements: Narrow core voltage range (1.07 V–1.13 V) simplifies power rail planning and voltage margining for the core.
  • Surface‑mount packaging: 1152‑BBGA surface‑mount package supports automated assembly and high‑density board designs.
  • Extensive on‑chip memory: Over 15 million bits of RAM reduce external memory dependence for buffering and state storage.

Why Choose 5AGXBA7D4F35I5G?

The 5AGXBA7D4F35I5G positions itself for designs that require a balance of large logic capacity, significant on‑chip RAM and high I/O count within an industrial‑rated, compact BGA package. Its specifications make it suitable for engineers seeking a highly integrated FPGA solution to consolidate discrete logic, memory buffering and multi‑pin interfacing on a single device while maintaining industrial temperature capability.

Backed by detailed Arria V device specifications for electrical characteristics, configuration and I/O timing, this device is appropriate for system designers prioritizing predictable electrical requirements and a robust packaging option for surface‑mount assembly.

Request a quote or submit an inquiry today to obtain pricing and availability for 5AGXBA7D4F35I5G.

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