5AGXBA7D4F35I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,099 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXBA7D4F35I5G – Arria V GX FPGA, 544 I/O, 1152-BBGA
The 5AGXBA7D4F35I5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) packaged in a 1152‑BBGA (FCBGA) mounting. The device delivers 242,000 logic elements, 15,470,592 bits of on‑chip RAM and 544 I/O pins, supporting dense, system‑level integration in a compact surface‑mount package. Rated for industrial use, it operates across a core supply range of 1.07 V to 1.13 V and an ambient temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity Provides 242,000 logic elements for implementing complex digital designs and custom logic functions.
- On‑Chip Memory Includes 15,470,592 bits of RAM to support large buffering, state machines, and data‑intensive processing inside the FPGA fabric.
- I/O Density Delivers 544 general‑purpose I/O pins to interface with high‑pin‑count peripherals and multi‑lane systems.
- Industrial Grade Specified for industrial operation with an operating temperature range of −40 °C to 100 °C.
- Power Supply Core voltage specified between 1.07 V and 1.13 V to match system power‑rail requirements.
- Package & Mounting 1152‑BBGA (FCBGA) surface‑mount package, supplier package listed as 1152‑FBGA, FC (35×35), enabling compact board layouts.
- Compliant RoHS compliant, supporting environmental and regulatory requirements for lead‑free assembly.
Unique Advantages
- High integration in a compact package: Combines 242,000 logic elements, substantial on‑chip RAM and 544 I/Os in a 1152‑BBGA footprint to minimize PCB area for dense designs.
- Industrial temperature range: Rated from −40 °C to 100 °C for deployment in thermally demanding environments common to industrial applications.
- Deterministic supply requirements: Narrow core voltage range (1.07 V–1.13 V) simplifies power rail planning and voltage margining for the core.
- Surface‑mount packaging: 1152‑BBGA surface‑mount package supports automated assembly and high‑density board designs.
- Extensive on‑chip memory: Over 15 million bits of RAM reduce external memory dependence for buffering and state storage.
Why Choose 5AGXBA7D4F35I5G?
The 5AGXBA7D4F35I5G positions itself for designs that require a balance of large logic capacity, significant on‑chip RAM and high I/O count within an industrial‑rated, compact BGA package. Its specifications make it suitable for engineers seeking a highly integrated FPGA solution to consolidate discrete logic, memory buffering and multi‑pin interfacing on a single device while maintaining industrial temperature capability.
Backed by detailed Arria V device specifications for electrical characteristics, configuration and I/O timing, this device is appropriate for system designers prioritizing predictable electrical requirements and a robust packaging option for surface‑mount assembly.
Request a quote or submit an inquiry today to obtain pricing and availability for 5AGXBA7D4F35I5G.

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