5AGXBA7D4F31C5G

The 5AGXBA7D4F31C5G is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 896-BBGA surface-mount package. It provides a high-density programmable fabric with 242,000 logic elements and approximately 15.47 Mbits of embedded memory for complex digital designs.

Designed for commercial-grade applications, this device combines a large I/O count (384 pins), a low core-voltage operating window (1.07 V to 1.13 V), and an operating temperature range of 0 °C to 85 °C to support space- and power-constrained board-level implementations.

Key Features

• Programmable Fabric: 242,000 logic elements to implement complex logic, state machines, and custom datapaths.
• Embedded Memory: Approximately 15.47 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• High I/O Density: 384 user I/O pins for broad external connectivity to peripherals, memory, and high-speed interfaces.
• Package & Mounting: 896-BBGA (896-FBGA, 31 × 31 mm) surface-mount package for compact board integration.
• Power Envelope: Core supply specified between 1.07 V and 1.13 V to support designs targeting a narrow core-voltage operating range.
• Commercial Grade Temperature: Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
• Regulatory Compliance: RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• High-density logic designs: Use the 242,000 logic elements and ample embedded memory to implement complex programmable logic, state machines, and custom accelerators.
• High-pin-count interfaces: 384 I/O lines accommodate designs that require extensive external connectivity or parallel data paths.
• Space-constrained PCBs: The 896-BBGA (31 × 31 mm) surface-mount package enables integration into compact, high-density board layouts.

Unique Advantages

• High integration density: Large logic element count reduces the need for multiple discrete devices and simplifies system architecture.
• Substantial embedded RAM: Approximately 15.47 Mbits of on-chip memory lowers external memory dependence and improves system latency.
• Robust I/O capacity: 384 user I/Os provide flexibility for connecting multiple peripherals, buses, and interfaces without additional hubs.
• Compact package footprint: 896-FBGA (31 × 31 mm) package supports compact board designs while delivering high functionality.
• Commercial-grade readiness: Specified temperature range of 0 °C to 85 °C and RoHS compliance align with standard commercial production requirements.
• Predictable power domain: Narrow core-voltage range (1.07 V–1.13 V) helps simplify power-supply design and thermal budgeting.

Why Choose 5AGXBA7D4F31C5G?

The 5AGXBA7D4F31C5G Arria V GX FPGA delivers a balance of high logic density, significant embedded memory, and extensive I/O in a compact, surface-mount 896-BBGA package. Its commercial-grade rating and RoHS compliance make it suitable for production designs where integration density and board real estate are priorities.

Manufactured by Intel, this FPGA is intended for engineering teams and procurement professionals seeking a programmable device that supports complex logic, high I/O connectivity, and predictable power and thermal parameters for commercial applications.

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