5AGXBA7D4F27C5G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 15470592 242000 672-BBGA, FCBGA

Quantity 1,024 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXBA7D4F27C5G – Arria V GX FPGA IC, 336 I/Os, 15,470,592‑bit RAM, 242,000 logic elements

The 5AGXBA7D4F27C5G is an Intel Arria V GX field‑programmable gate array (FPGA) supplied in a 672‑ball BGA package. It delivers a high density of programmable logic with substantial on‑chip RAM and a large I/O count for complex, configurable digital designs.

Targeted for commercial applications, this device combines 242,000 logic elements, 15,470,592 total RAM bits, and 336 I/O pins while operating from a core supply between 1.07 V and 1.13 V and across a 0 °C to 85 °C ambient range.

Key Features

  • Core Logic  242,000 logic elements provide programmable resources for custom digital processing, control logic, and complex state machines.
  • On‑Chip Memory  15,470,592 total RAM bits enable local storage, buffering, and memory‑intensive algorithms without requiring external RAM for many designs.
  • I/O Capacity  336 user I/O pins support extensive peripheral interfacing and board‑level connectivity.
  • Power and Supply  Core voltage range specified at 1.07 V to 1.13 V for predictable power budgeting and supply design.
  • Package & Mounting  672‑BBGA (FCBGA) package — supplier package noted as 672‑FBGA (27×27) — designed for surface‑mount assembly on compact PCBs.
  • Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C ambient operation.
  • RoHS Compliance  Environmentally compliant with RoHS requirements.

Typical Applications

  • High‑density digital processing  Use the large logic element count for custom datapaths, protocol engines, and real‑time signal processing.
  • Memory‑intensive functions  On‑chip RAM supports buffering, lookup tables, and intermediate data storage in systems that benefit from reduced external memory dependency.
  • High‑I/O interface systems  336 I/O pins enable integration with multiple peripherals, sensors, and board subsystems requiring extensive connectivity.

Unique Advantages

  • Substantial programmable resource pool: 242,000 logic elements allow implementation of complex logic and parallel architectures on a single device.
  • Large embedded RAM: 15,470,592 bits of on‑chip memory reduce the need for external memory in many designs, simplifying BOM and layout.
  • High I/O density: 336 I/Os provide flexibility for multi‑channel interfaces and mixed peripheral connections.
  • Compact, production‑ready packaging: 672‑ball BGA (27×27 supplier footprint) supports surface‑mount assembly in space‑constrained boards.
  • Commercial operating range: Rated for 0 °C to 85 °C to match typical commercial product environments.
  • Regulatory friendliness: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5AGXBA7D4F27C5G?

The 5AGXBA7D4F27C5G Arria V GX FPGA combines a high logic element count, abundant on‑chip RAM, and a large number of I/Os in a single commercial‑grade BGA package. These attributes make it well suited to complex, programmable digital systems where integration density, on‑chip memory, and flexible I/O are primary design drivers.

Choosing this device supports scalable designs that require substantial local memory and programmable resources while maintaining predictable power supply requirements and compatibility with standard surface‑mount assembly processes.

Request a quote or submit a procurement inquiry to confirm pricing, lead time, and availability for 5AGXBA7D4F27C5G.

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