5AGXBA7D4F27C4G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 336 15470592 242000 672-BBGA, FCBGA |
|---|---|
| Quantity | 147 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXBA7D4F27C4G – Arria V GX FPGA, 242,000 logic elements, 15,470,592 RAM bits, 336 I/Os, 672-FBGA (27×27)
The 5AGXBA7D4F27C4G is an Intel Arria V GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. This commercial-grade device delivers substantial on-chip logic and embedded RAM capacity combined with high I/O density for complex, programmable hardware designs.
With 242,000 logic elements, 15,470,592 total RAM bits, 336 I/Os and a 672-FBGA (27×27) surface-mount package, the device targets applications that require significant programmable logic resources, broad interface support, and integrated memory while operating from a core supply of 1.07 V to 1.13 V and an ambient range of 0 °C to 85 °C.
Key Features
- Logic Capacity Provides 242,000 logic elements to implement large, fully programmable digital designs and complex state machines.
- Embedded Memory 15,470,592 total RAM bits of on-chip memory to support data buffering, packet processing, and other memory-intensive functions.
- I/O Density 336 programmable I/Os for extensive connectivity to peripherals, interfaces, and external devices.
- Package & Mounting 672-BBGA (FCBGA) / 672-FBGA (27×27) surface-mount package for high connector density in a compact footprint suitable for board-level integration.
- Power Core voltage supply specified between 1.07 V and 1.13 V to align with system power-rail design and power budgeting.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
- Standards Compliance RoHS compliant, supporting environmental and material requirements for many commercial products.
Typical Applications
- High-performance embedded systems Use the device’s large logic capacity and embedded RAM to implement custom accelerators and real-time processing functions.
- Communications and I/O aggregation Leverage 336 I/Os to interface with multi-channel data streams, protocol bridges, and high-density front-end hardware.
- Prototyping and system integration Deploy the FPGA for hardware validation and system-level composition where programmable logic and plentiful I/O are required.
Unique Advantages
- Substantial programmable resources Large logic element count enables consolidation of multiple functions (control, signal processing, glue logic) into a single device, reducing board-level component count.
- Integrated memory capacity Over 15 million RAM bits provide on-chip buffering and state storage to minimize external memory dependence and improve system performance.
- High I/O count for flexible interfacing 336 I/Os simplify routing for multi-interface designs and support concurrent peripheral connections without extensive external multiplexing.
- Compact, production-ready package 672-FBGA (27×27) surface-mount package delivers high pin density in a manufacturable package suitable for production PCBs.
- Commercial-grade operating range Designed to operate across common commercial temperature ranges (0 °C to 85 °C), making it suitable for a broad set of non-industrial deployments.
Why Choose 5AGXBA7D4F27C4G?
This Arria V GX FPGA balances high logic density, ample on-chip RAM, and significant I/O capacity in a single commercial-grade, surface-mount package. It is well suited to design teams and system integrators who need a programmable platform capable of consolidating multiple digital functions and interfaces while maintaining straightforward board-level integration.
The device’s combination of 242,000 logic elements, 15,470,592 RAM bits, and 336 I/Os offers a strong platform for memory-intensive and I/O-rich designs, providing scalability and predictable electrical characteristics for production designs backed by Intel’s Arria V device documentation.
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