5AGXBA5D6F31C6G

The 5AGXBA5D6F31C6G is an Arria V GX Field Programmable Gate Array (FPGA) from Intel, offered in a high-pin-count 896-ball FCBGA package. It provides large on-chip logic and memory resources alongside extensive I/O capacity for designs that require programmable logic, on-chip RAM and dense external connectivity.

As a commercial-grade device, the part operates from a core voltage range of 1.07 V to 1.13 V and across an ambient temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 190,000 logic elements to implement complex custom logic and signal processing functions.
• On‑Chip Memory  13,284,352 total RAM bits for data buffering, LUT-based storage and local scratch memory.
• I/O Density  384 general-purpose I/O pins to support multiple parallel interfaces and dense peripheral connectivity.
• Power and Operating Conditions  Core supply specified from 1.07 V to 1.13 V with commercial operating temperature 0 °C to 85 °C.
• Package and Mounting  896‑ball BGA FCBGA package (supplier package 896‑FBGA, 31 × 31 mm) with surface-mount mounting for board-level integration.
• Compliance  RoHS compliant for regulatory and environmental requirements in commercial applications.

Typical Applications

• High‑density programmable logic systems  Use the device’s ~190,000 logic elements to implement custom datapaths, control logic and protocol processing.
• On‑chip buffering and memory‑intensive designs  13,284,352 RAM bits provide significant on-chip storage for packet buffering, FIFOs and localized data structures.
• Dense I/O and interface aggregation  384 I/O pins enable integration of multiple parallel interfaces, sensors, or peripheral buses on a single FPGA.
• Compact board integration  Surface-mount 896‑FBGA (31 × 31 mm) package supports compact PCB layouts while delivering a high pin count.

Unique Advantages

• High logic and memory density: Large logic element count paired with over 13 million RAM bits enables implementation of complex, memory-aware designs on a single device.
• Extensive I/O provisioning: 384 I/O pins reduce the need for external interface multiplexing and simplify multi-channel connectivity.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• Surface-mount, high‑pin package: 896-ball FCBGA (31 × 31 mm) provides a compact footprint with high interconnect density for space-constrained PCBs.
• RoHS compliant: Conforms to environmental directives for lead‑free assembly and materials handling in commercial products.

Why Choose 5AGXBA5D6F31C6G?

The 5AGXBA5D6F31C6G Arria V GX FPGA combines substantial logic capacity, large on‑chip RAM and a high number of I/O to address demanding programmable-logic requirements in commercial applications. Its specified core voltage window, commercial temperature rating and RoHS compliance make it a practical choice for designs that require predictable electrical and environmental behavior.

This device is suited to engineers and procurement teams building systems that need consolidated logic, memory and interface capability in a single, surface-mounted 896‑FBGA package backed by Intel’s Arria V documentation.

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