5AGXBA5D6F35C6G

The 5AGXBA5D6F35C6G is an Intel Arria V GX field-programmable gate array (FPGA) in a 1152‑FBGA package. It provides large programmable logic capacity and on-chip RAM to support complex, high‑density designs that require substantial I/O connectivity.

Offered in a commercial temperature grade and RoHS‑compliant, this device targets applications that need significant logic resources and memory bandwidth while maintaining compact surface‑mount package integration.

Key Features

• Logic Capacity — 190,000 logic elements to implement large-scale custom hardware functions and complex state machines.
• On‑Chip Memory — 13,284,352 total RAM bits for buffering, LUTRAM use, and embedded data storage within logic fabrics.
• I/O Density — 544 I/O pins to support extensive peripheral interfacing and multi‑lane data paths.
• Package — 1152‑FBGA (FC, 35×35) surface‑mount package optimized for compact board designs and high pin count routing.
• Power Supply — Core voltage operating range from 1.07 V to 1.13 V for defined power budgeting and regulator design.
• Operating Temperature — Commercial grade specified for 0 °C to 85 °C operation.
• Compliance — RoHS‑compliant for regulatory alignment in commercial systems.

Typical Applications

• High‑density I/O systems — Use the 544 available I/Os to interface multiple sensors, transceivers, or peripheral buses within a single FPGA footprint.
• Custom logic acceleration — Leverage 190,000 logic elements and 13,284,352 RAM bits to implement hardware accelerators and large custom datapaths.
• Compact, high‑pin‑count boards — The 1152‑FBGA surface‑mount package enables high functionality in constrained PCB area while supporting dense routing.

Unique Advantages

• Substantial programmable capacity: 190,000 logic elements enable complex designs without external logic partitioning.
• Significant on‑chip memory: Over 13 million RAM bits reduce reliance on external DRAM for many buffering and table storage needs.
• Extensive I/O connectivity: 544 I/Os support multi‑device interfacing and wide parallel data buses directly from the FPGA.
• Compact, manufacturable package: 1152‑FBGA surface‑mount package (35×35) provides a balance of pin count and board assembly compatibility.
• Predictable power envelope: Narrow core voltage window (1.07 V–1.13 V) simplifies power‑supply selection and thermal budgeting.
• Commercial readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for commercial products.

Why Choose 5AGXBA5D6F35C6G?

The 5AGXBA5D6F35C6G Arria V GX FPGA combines high logic density, substantial on‑chip RAM, and a large I/O complement in a single 1152‑FBGA surface‑mount package from Intel. It is well suited for designs that require integrated programmable logic and memory resources while maintaining a compact board footprint and controlled power rails.

This device is an appropriate choice for commercial systems designers seeking scalable logic capacity, robust I/O options, and RoHS‑compliant components backed by documented electrical and configuration specifications.

Request a quote or submit a parts availability inquiry to receive pricing and lead‑time information for the 5AGXBA5D6F35C6G Arria V GX FPGA.