5AGXBA5D4F35I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8962 | Number of Logic Elements/Cells | 190000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 13284352 |
Overview of 5AGXBA5D4F35I5G – Arria V GX FPGA, 544 I/Os, 190,000 logic elements, 1152‑BBGA
The 5AGXBA5D4F35I5G is an Intel Arria V GX field programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package designed for industrial applications. It delivers a high logic density and large on‑chip RAM to support complex, memory‑intensive digital designs and high‑pin‑count system integration.
With 190,000 logic elements, 13,284,352 total RAM bits and 544 I/O pins, this device targets designs that require significant programmable logic, abundant embedded memory and extensive external interfacing while operating across an industrial temperature range.
Key Features
- Core Logic — 190,000 logic elements provide high-density programmable fabric for complex digital implementations.
- Embedded Memory — 13,284,352 total RAM bits for on‑chip data buffering, packet storage and intermediate processing.
- I/O Capacity — 544 I/O pins support extensive external connectivity for multi‑lane interfaces and large peripheral sets.
- Package & Mounting — Supplied in a 1152‑BBGA (FCBGA) package (supplier package: 1152‑FBGA, FC, 35×35) with surface mount mounting for compact board integration.
- Power — Core voltage supply specified between 1.07 V and 1.13 V to match system power planning requirements.
- Industrial Grade Temperature — Rated for operation from −40 °C to 100 °C for demanding environmental conditions.
- Regulatory Compliance — RoHS compliant to support lead‑free manufacturing processes.
Typical Applications
- Industrial Control Systems — Industrial temperature rating (−40 °C to 100 °C) and broad I/O support enable robust sensor/actuator interfacing and real‑time control logic.
- High‑Density Logic Designs — 190,000 logic elements accommodate complex state machines, custom accelerators and protocol processing.
- Memory‑Intensive Processing — 13,284,352 RAM bits provide on‑chip storage for buffering, packet processing and intermediate data handling.
- System Integration & I/O Expansion — 544 I/Os and a high‑pin‑count FCBGA package simplify connection to multiple external devices and high‑speed peripheral arrays.
Unique Advantages
- High Logic Density: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing system complexity.
- Substantial On‑Chip Memory: Multi‑megabit RAM capacity supports memory‑heavy algorithms without immediate reliance on external memory.
- Extensive I/O Count: 544 I/Os reduce the need for external GPIO expanders and simplify board routing for multi‑interface applications.
- Industrial Reliability: Specified operation from −40 °C to 100 °C helps ensure stability in harsh or temperature‑variable deployments.
- Compact, High‑Pin Package: The 1152‑BBGA (FCBGA) footprint provides a balance of size and I/O density for space‑constrained, high‑function systems.
- Defined Core Voltage Range: Narrow 1.07 V–1.13 V core supply simplifies power supply design and voltage rail management.
Why Choose 5AGXBA5D4F35I5G?
The 5AGXBA5D4F35I5G Arria V GX FPGA combines high logic capacity, abundant embedded RAM and a large I/O complement in a robust industrial‑grade package. It is well suited for designers who need to implement complex, memory‑intensive functions while maintaining extensive external connectivity and operating across a wide temperature range.
As a member of the Arria V family, this device offers a clear specification set for power, temperature and packaging to support long‑life industrial deployments and streamlined system integration.
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