5AGXBA5D4F35C4G

The 5AGXBA5D4F35C4G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic capacity and on-chip memory combined with a large I/O count in a high-density BGA package.

With 190,000 logic elements, 13,284,352 bits of embedded RAM and 544 user I/O, this commercial‑grade device is intended for designs that require significant programmable logic, substantial embedded memory and extensive I/O connectivity within a 1152‑ball FCBGA footprint.

Key Features

• Logic Capacity — 190,000 logic elements to support complex, high‑density programmable designs.
• Embedded Memory — 13,284,352 total RAM bits for on‑chip data storage and buffering.
• I/O Density — 544 user I/O pins to accommodate multiple interfaces and parallel data paths.
• Package & Mounting — 1152‑FBGA / 1152‑BBGA FCBGA package (35 × 35 mm) with surface‑mount compatibility for compact system integration.
• Power — Core voltage supply range of 1.07 V to 1.13 V for predictable core power design.
• Commercial Grade — Rated for commercial operating temperatures from 0°C to 85°C.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High‑density digital processing — Use the large logic element count and embedded RAM for compute‑intensive custom logic and acceleration tasks.
• Interface bridging and I/O aggregation — 544 I/O pins support dense parallel interfaces, protocol conversion, and multi‑lane data routing.
• Communications and networking — Leverage on‑chip RAM and logic resources to implement packet processing, buffering and custom datapaths.
• System prototyping and FPGA‑based platforms — The combination of package density and memory capacity makes the device suitable for prototype boards and advanced system development.

Unique Advantages

• High logic density: 190,000 logic elements enable large, integrated logic designs without external ASICs for many functions.
• Substantial on‑chip RAM: 13,284,352 bits of embedded RAM reduce dependency on external memory and improve data throughput.
• Extensive I/O capability: 544 user I/Os provide flexible connectivity for complex multi‑interface systems.
• Compact, production‑ready package: 1152‑ball FCBGA (35×35 mm) offers a high pin‑count solution in a PCB‑friendly footprint.
• Predictable core power range: Defined core voltage supply (1.07–1.13 V) simplifies power‑supply design and verification.
• Commercial temperature rating: 0°C to 85°C operation supports typical industrial and commercial deployments.

Why Choose 5AGXBA5D4F35C4G?

The 5AGXBA5D4F35C4G Arria V GX FPGA combines high logic capacity, large embedded RAM and a broad I/O complement in a manufacturable 1152‑ball FCBGA package. This configuration addresses projects that need substantial programmable resources and on‑chip memory without sacrificing I/O flexibility, making it well suited for advanced communications, data‑path acceleration and complex system prototyping.

As a commercial‑grade Intel Arria V device with RoHS compliance and documented electrical and configuration specifications, this FPGA provides a stable platform for designs that require both performance and predictable integration constraints.

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