5AGXBA5D4F35C5N

The 5AGXBA5D4F35C5N is an Arria V GX Field Programmable Gate Array (FPGA) IC optimized for designs requiring large programmable logic, on-chip memory, and substantial I/O capacity. This commercial‑grade device integrates 190,000 logic elements and 13,284,352 bits of embedded RAM to support complex, high‑density programmable designs.

Housed in a 1152‑FBGA (35×35) package with an exposed pad and intended for surface‑mount assembly, the device operates from a core voltage range of 1.07 V to 1.13 V and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• High logic capacity — 190,000 logic elements provide substantial programmable fabric for implementing complex logic, DSP pipelines, and custom accelerators.
• On‑chip memory — 13,284,352 total RAM bits deliver abundant embedded storage for buffers, FIFOs, and data‑path registers.
• Extensive I/O — 544 I/O pins support broad interfacing options and dense external connectivity.
• Package and mounting — 1152‑BBGA / 1152‑FBGA (35×35) package with an exposed pad; surface mount mounting type for board‑level integration.
• Power and core voltage — Core supply range of 1.07 V to 1.13 V enables defined power budgeting and margin planning.
• Commercial operating range — Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
• Environmental compliance — RoHS compliant.

Unique Advantages

• Large programmable fabric: 190,000 logic elements give you the capacity to implement large finite state machines, data paths, and complex control logic without external CPLDs.
• Significant on‑chip RAM: 13,284,352 bits of embedded RAM reduce reliance on external memory for mid‑size buffering and local storage, simplifying BOM and board layout.
• High I/O count: 544 I/O pins enable dense peripheral and interface integration directly from the FPGA package.
• Compact, manufacturable package: 1152‑FBGA (35×35) with exposed pad and surface‑mount assembly supports modern PCB designs while providing thermal conduction through the exposed pad.
• Defined power envelope: Narrow core voltage range (1.07 V–1.13 V) assists in precise power‑supply design and power sequencing for reliable operation.
• Commercial reliability and compliance: Commercial temperature rating (0 °C–85 °C) and RoHS compliance support mainstream electronics manufacturing requirements.

Why Choose 5AGXBA5D4F35C5N?

The 5AGXBA5D4F35C5N Arria V GX FPGA combines high logic density, abundant on‑chip RAM, and a large number of I/O in a compact 1152‑FBGA package. These characteristics make it suitable for designers who need substantial programmable resources and memory within a single surface‑mount device and who are working within commercial temperature ranges.

Choosing this FPGA provides a clear, specification‑driven foundation for designs that demand large logic and memory resources, defined core power requirements, and robust I/O capacity while maintaining compliance with RoHS. Its package and exposed pad facilitate thermal and board‑level integration into production designs.

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