5AGXBA5D4F35I5N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad

Quantity 1,756 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXBA5D4F35I5N – Arria V GX FPGA, 190000 logic elements, 1152-BBGA

The 5AGXBA5D4F35I5N is an Intel Arria V GX field-programmable gate array (FPGA) supplied in an exposed-pad FCBGA package. It delivers a large on-chip logic capacity and embedded RAM to implement complex programmable logic and memory-intensive functions for industrial applications.

Key architectural attributes include 190000 logic elements, 13,284,352 total RAM bits, and 544 user I/O, combined with an industrial operating temperature range and a low-voltage core supply. These characteristics make the device suitable for high-density embedded designs that require significant on-chip logic, memory, and I/O resources.

Key Features

  • Core Logic  190000 logic elements enable implementation of large-scale programmable logic designs and custom accelerators.
  • On-chip Memory  13,284,352 total RAM bits provide substantial embedded storage for buffers, state machines, and data-path implementations.
  • I/O Density  544 user I/O pins support extensive external interfacing for peripherals, sensors, and parallel/high-pin-count connections.
  • Power Supply  Specified core voltage range of 1.07 V to 1.13 V for the device core supply.
  • Package & Mounting  Available in a 1152‑BBGA exposed‑pad FCBGA package (supplier package: 1152‑FBGA, 35×35); designed for surface-mount assembly.
  • Industrial Grade & Temperature  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Programmable control logic and deterministic I/O handling across wide temperature ranges enabled by the industrial grade rating and broad operating temperature.
  • High-density Embedded Systems  Large logic capacity and on-chip RAM make this FPGA suitable for embedded processing, custom state machines, and hardware acceleration tasks.
  • Communications & Networking  High I/O count supports complex interface requirements and parallel connectivity for network line cards and protocol bridging.
  • Signal Processing  Substantial logic and memory resources can be used for real-time signal processing pipelines and buffering functions.

Unique Advantages

  • Significant Logic Capacity: 190000 logic elements provide the headroom to implement complex, multi-function designs on a single device, reducing board-level component count.
  • Large Embedded Memory: Over 13 million RAM bits enable on-chip data buffering and intermediate storage, simplifying system memory architecture.
  • High I/O Count: 544 user I/O pins allow extensive direct interfacing without additional I/O expanders, useful for dense peripheral connectivity.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
  • Compact FCBGA Packaging: 1152‑BBGA / 1152‑FBGA (35×35) package with exposed pad supports surface-mount assembly while delivering high pin density.
  • Vendor-backed Documentation: Device is part of the Intel Arria V family with detailed electrical and configuration specifications available in the device datasheet.

Why Choose 5AGXBA5D4F35I5N?

The 5AGXBA5D4F35I5N positions itself as a compelling option where large programmable logic capacity, substantial on-chip RAM, and extensive I/O are required within an industrial-temperature FPGA. Its low-voltage core and FCBGA exposed‑pad package support dense board implementations while meeting industrial environmental requirements.

This Intel Arria V GX device is well suited to engineers designing advanced embedded systems, industrial controllers, communications equipment, and signal-processing platforms that need scalable, on-chip resources and a reliable supply profile documented in the Arria V datasheet.

If you need pricing, availability, or a formal quote for the 5AGXBA5D4F35I5N Arria V GX FPGA, request a quote or submit an inquiry to obtain detailed purchasing information and lead-time estimates.

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