5AGXBA5D4F31C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 13284352 190000 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,578 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8962 | Number of Logic Elements/Cells | 190000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 13284352 |
Overview of 5AGXBA5D4F31C5G – Arria V GX Field Programmable Gate Array (FPGA) IC, 190,000 logic elements, 384 I/O, 896‑BBGA FCBGA
The 5AGXBA5D4F31C5G is an Intel Arria V GX Field Programmable Gate Array provided in a 896‑ball FCBGA package (896‑BBGA, 31×31 mm). The device delivers a high-density programmable fabric with 190,000 logic elements and 13,284,352 bits of on‑chip RAM, along with 384 dedicated I/O pins for system interfacing.
Targeted at designs that require significant programmable logic and on‑chip memory in a compact surface‑mount package, this commercial‑grade FPGA operates from a core voltage window of 1.07 V to 1.13 V and is specified for 0 °C to 85 °C operation. The device is RoHS compliant.
Key Features
- Core Capacity Provides 190,000 logic elements to implement complex digital logic, datapaths, and custom accelerators.
- On‑chip Memory 13,284,352 total RAM bits available for large buffering, lookup tables, and embedded memory structures.
- I/O Resources 384 I/O pins for broad connectivity to peripherals, memory interfaces, and multi‑lane I/O architectures.
- Package & Mounting 896‑ball FCBGA package (896‑FBGA, 31×31 mm) designed for surface‑mount PCB assembly for compact system integration.
- Power Core supply voltage range of 1.07 V to 1.13 V for predictable power provisioning and board power‑rail planning.
- Operating Conditions Commercial grade device specified for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing alignment.
Typical Applications
- High‑density programmable logic Use the extensive logic capacity and on‑chip RAM to implement complex finite‑state machines, datapaths, and custom processing pipelines.
- Interface aggregation and bridging Leverage 384 I/O pins to consolidate and translate between multiple peripheral and memory interfaces within a single FPGA footprint.
- Custom acceleration Deploy the large logic and memory resources to accelerate compute‑intensive functions or application‑specific processing blocks.
Unique Advantages
- Large programmable fabric: 190,000 logic elements enable dense implementation of complex designs without immediate need to partition across multiple devices.
- Substantial on‑chip RAM: 13,284,352 bits of RAM support deep buffering and memory‑centric algorithms directly inside the FPGA fabric.
- Extensive I/O count: 384 I/O pins provide flexibility for multi‑interface designs, parallel buses, and high‑pin‑count connectivity.
- Compact surface‑mount packaging: 896‑ball FCBGA (31×31 mm) delivers high integration density for space‑constrained PCBs.
- Predictable power envelope: Narrow core voltage range (1.07 V–1.13 V) simplifies power‑rail design and voltage regulation planning.
- Commercial operating range: Rated for 0 °C to 85 °C operation for typical commercial deployments.
Why Choose 5AGXBA5D4F31C5G?
The 5AGXBA5D4F31C5G Arria V GX FPGA combines high logic density, substantial on‑chip RAM, and a large I/O count in a single surface‑mount FCBGA package. Its specification set — including a well‑defined core voltage window and commercial temperature rating — makes it suitable for compact, high‑capability programmable designs where integration density and memory resources are primary considerations.
This FPGA is well suited to engineering teams building feature‑rich, programmable systems that require significant in‑fabric resources and flexible external connectivity while retaining predictable power and thermal planning. RoHS compliance supports integration into standard manufacturing workflows.
Request a quote or submit an inquiry to get pricing and availability for the 5AGXBA5D4F31C5G Arria V GX FPGA.

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